JPS636733U - - Google Patents

Info

Publication number
JPS636733U
JPS636733U JP1986099861U JP9986186U JPS636733U JP S636733 U JPS636733 U JP S636733U JP 1986099861 U JP1986099861 U JP 1986099861U JP 9986186 U JP9986186 U JP 9986186U JP S636733 U JPS636733 U JP S636733U
Authority
JP
Japan
Prior art keywords
wire
bonding
solenoid
movable member
backward movement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1986099861U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0423324Y2 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986099861U priority Critical patent/JPH0423324Y2/ja
Publication of JPS636733U publication Critical patent/JPS636733U/ja
Application granted granted Critical
Publication of JPH0423324Y2 publication Critical patent/JPH0423324Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/071Connecting or disconnecting
    • H10W72/0711Apparatus therefor
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/071Connecting or disconnecting
    • H10W72/0711Apparatus therefor
    • H10W72/07141Means for applying energy, e.g. ovens or lasers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/071Connecting or disconnecting
    • H10W72/0711Apparatus therefor
    • H10W72/07168Means for storing or moving the material for the connector
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/071Connecting or disconnecting
    • H10W72/075Connecting or disconnecting of bond wires
    • H10W72/07502Connecting or disconnecting of bond wires using an auxiliary member

Landscapes

  • Wire Bonding (AREA)
JP1986099861U 1986-07-01 1986-07-01 Expired JPH0423324Y2 (https=)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986099861U JPH0423324Y2 (https=) 1986-07-01 1986-07-01

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986099861U JPH0423324Y2 (https=) 1986-07-01 1986-07-01

Publications (2)

Publication Number Publication Date
JPS636733U true JPS636733U (https=) 1988-01-18
JPH0423324Y2 JPH0423324Y2 (https=) 1992-05-29

Family

ID=30969133

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986099861U Expired JPH0423324Y2 (https=) 1986-07-01 1986-07-01

Country Status (1)

Country Link
JP (1) JPH0423324Y2 (https=)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55138853A (en) * 1979-04-17 1980-10-30 Shinkawa Ltd Wire bonding apparatus

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55138853A (en) * 1979-04-17 1980-10-30 Shinkawa Ltd Wire bonding apparatus

Also Published As

Publication number Publication date
JPH0423324Y2 (https=) 1992-05-29

Similar Documents

Publication Publication Date Title
JPS636733U (https=)
JPS63189514U (https=)
JPH0137790Y2 (https=)
JPH01155131U (https=)
JPS62199269U (https=)
JPS63157412U (https=)
JPH0342334U (https=)
JPS6265461U (https=)
JPH0261543U (https=)
JPH02146014U (https=)
JPH0414233U (https=)
JPH02123388U (https=)
JPH01139930U (https=)
JPS6213140U (https=)
JPH0229705U (https=)
JPH0368727U (https=)
JPS62159405U (https=)
JPS6384306U (https=)
JPS62107917U (https=)
JPS6185335U (https=)
JPH0413219U (https=)
JPH0240532U (https=)
JPS6446122U (https=)
JPH0392036U (https=)
JPH03111415U (https=)