JPS6367260U - - Google Patents

Info

Publication number
JPS6367260U
JPS6367260U JP16017286U JP16017286U JPS6367260U JP S6367260 U JPS6367260 U JP S6367260U JP 16017286 U JP16017286 U JP 16017286U JP 16017286 U JP16017286 U JP 16017286U JP S6367260 U JPS6367260 U JP S6367260U
Authority
JP
Japan
Prior art keywords
lead frame
die pad
semiconductor chip
pad portion
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP16017286U
Other languages
English (en)
Japanese (ja)
Other versions
JPH06834Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986160172U priority Critical patent/JPH06834Y2/ja
Publication of JPS6367260U publication Critical patent/JPS6367260U/ja
Application granted granted Critical
Publication of JPH06834Y2 publication Critical patent/JPH06834Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8338—Bonding interfaces outside the semiconductor or solid-state body
    • H01L2224/83385—Shape, e.g. interlocking features

Landscapes

  • Die Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP1986160172U 1986-10-21 1986-10-21 半導体装置用リ−ドフレ−ム Expired - Lifetime JPH06834Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986160172U JPH06834Y2 (ja) 1986-10-21 1986-10-21 半導体装置用リ−ドフレ−ム

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986160172U JPH06834Y2 (ja) 1986-10-21 1986-10-21 半導体装置用リ−ドフレ−ム

Publications (2)

Publication Number Publication Date
JPS6367260U true JPS6367260U (enrdf_load_stackoverflow) 1988-05-06
JPH06834Y2 JPH06834Y2 (ja) 1994-01-05

Family

ID=31085305

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986160172U Expired - Lifetime JPH06834Y2 (ja) 1986-10-21 1986-10-21 半導体装置用リ−ドフレ−ム

Country Status (1)

Country Link
JP (1) JPH06834Y2 (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016134592A (ja) * 2015-01-22 2016-07-25 Ｓｈマテリアル株式会社 リードフレーム
JP2019079935A (ja) * 2017-10-25 2019-05-23 三菱電機株式会社 電力用半導体装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5684360U (enrdf_load_stackoverflow) * 1979-11-29 1981-07-07
JPS5818948A (ja) * 1981-07-27 1983-02-03 Toshiba Corp リ−ドフレ−ム

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5684360U (enrdf_load_stackoverflow) * 1979-11-29 1981-07-07
JPS5818948A (ja) * 1981-07-27 1983-02-03 Toshiba Corp リ−ドフレ−ム

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016134592A (ja) * 2015-01-22 2016-07-25 Ｓｈマテリアル株式会社 リードフレーム
JP2019079935A (ja) * 2017-10-25 2019-05-23 三菱電機株式会社 電力用半導体装置

Also Published As

Publication number Publication date
JPH06834Y2 (ja) 1994-01-05

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