JPS6367239U - - Google Patents

Info

Publication number
JPS6367239U
JPS6367239U JP16276486U JP16276486U JPS6367239U JP S6367239 U JPS6367239 U JP S6367239U JP 16276486 U JP16276486 U JP 16276486U JP 16276486 U JP16276486 U JP 16276486U JP S6367239 U JPS6367239 U JP S6367239U
Authority
JP
Japan
Prior art keywords
heating
fluid
bernoulli chuck
heating device
semiconductor wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP16276486U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0341461Y2 (US20020051482A1-20020502-M00012.png
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP16276486U priority Critical patent/JPH0341461Y2/ja
Publication of JPS6367239U publication Critical patent/JPS6367239U/ja
Application granted granted Critical
Publication of JPH0341461Y2 publication Critical patent/JPH0341461Y2/ja
Expired legal-status Critical Current

Links

JP16276486U 1986-10-22 1986-10-22 Expired JPH0341461Y2 (US20020051482A1-20020502-M00012.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16276486U JPH0341461Y2 (US20020051482A1-20020502-M00012.png) 1986-10-22 1986-10-22

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16276486U JPH0341461Y2 (US20020051482A1-20020502-M00012.png) 1986-10-22 1986-10-22

Publications (2)

Publication Number Publication Date
JPS6367239U true JPS6367239U (US20020051482A1-20020502-M00012.png) 1988-05-06
JPH0341461Y2 JPH0341461Y2 (US20020051482A1-20020502-M00012.png) 1991-08-30

Family

ID=31090339

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16276486U Expired JPH0341461Y2 (US20020051482A1-20020502-M00012.png) 1986-10-22 1986-10-22

Country Status (1)

Country Link
JP (1) JPH0341461Y2 (US20020051482A1-20020502-M00012.png)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0475328A (ja) * 1990-07-18 1992-03-10 Toshiba Corp 半導体の処理方法およびその装置
JP2009088222A (ja) * 2007-09-28 2009-04-23 Tokyo Electron Ltd 基板保持装置、基板保持方法、半導体製造装置及び記憶媒体
KR20180127390A (ko) * 2016-03-18 2018-11-28 에이씨엠 리서치 (상하이) 인코포레이티드 기판 열처리 장치

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0475328A (ja) * 1990-07-18 1992-03-10 Toshiba Corp 半導体の処理方法およびその装置
JP2009088222A (ja) * 2007-09-28 2009-04-23 Tokyo Electron Ltd 基板保持装置、基板保持方法、半導体製造装置及び記憶媒体
JP4616873B2 (ja) * 2007-09-28 2011-01-19 東京エレクトロン株式会社 半導体製造装置、基板保持方法及びプログラム
KR20180127390A (ko) * 2016-03-18 2018-11-28 에이씨엠 리서치 (상하이) 인코포레이티드 기판 열처리 장치
CN109075102A (zh) * 2016-03-18 2018-12-21 盛美半导体设备(上海)有限公司 衬底热处理装置
JP2019510375A (ja) * 2016-03-18 2019-04-11 エーシーエム リサーチ (シャンハイ) インコーポレーテッド 基板熱処理装置
CN109075102B (zh) * 2016-03-18 2022-07-12 盛美半导体设备(上海)股份有限公司 衬底热处理装置
US11854842B2 (en) 2016-03-18 2023-12-26 Acm Research (Shanghai), Inc. Substrate heat treatment apparatus

Also Published As

Publication number Publication date
JPH0341461Y2 (US20020051482A1-20020502-M00012.png) 1991-08-30

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