JPS6364348A - Cooling system for integrated circuit element - Google Patents

Abstract

PURPOSE:To increase the heating area and a heat transfer rate between a heating surface and a refrigerant, and to improve cooling capacity by extending a heat exchanger plate in the direction of a flexible elastic structure, forming a recessed section and shaping a predetermined space between the bottom end of the flexible elastic structure and the base of the heat exchanger plate. CONSTITUTION:When a refrigerant such as water is flowed through a refrigerant path 2, the refrigerant is injected against a heat exchanger plate 5 mounted at the bottom end of a flexible elastic structure 4 by a nozzle 3 projected from the refrigerant path 2. The heat exchanger plate 5 and an integrated circuit element 6 are pushed directly or indirectly, heat generated from the integrated circuit element 6 mounted onto a substrate 7 is spread in the direction of the flexible elastic structure 4 and transmitted over the base section and both side surface sections of the heat exchanger plate 5 shaping a recessed section, and the refrigerant robs the base section and both side surface sections of the heat exchanger plate 5 of heat, thus cooling the integrated circuit element 6. A guide 21 improves positional precision in the horizontal direction of the heat exchanger plate 5, and prevents vibrations, movement, etc. in the horizontal direction.

Description

[Detailed description of the invention]

[Summary] Length ε - 10,000 - 6 - ゛ `` ``Childhood - 1 more possible 4 + ' elasticity) Between the bottom end of the structure and the bottom of the heat transfer ■
By doing so, the effective heat transfer surface fl and heat transfer area between the heat transfer plate and the cold temperature are increased, and the cooling capacity is improved. [εIndustrial sum (1 field)] The great invention is the creation of integrated circuit elements.TV'T b"j is particularly large in size. [Prior art] Diagram ζ4 is a diagram showing the (11 configuration) of the cooling system CI of the conventional Kure f〆 circuit element. , 42 Keijakujiri, 43
The nozzle, 44 is a 51" circuit element, 46 is a circular heat exchanger plate, 4
7 each indicate a substrate. Conventional integrated circuit elements
The cold tofu 4 protruding from the passage 42 and the nozzle 43-1 are used to cool the cold tofu.
It injects directly to the heat transfer W461C attached at the bottom = 1, and separately the heat transfer plate 46 and the i) First, all of the cooling of the elbow integrated circuit resistor 45 was performed. [Problems to be Solved by the Invention] However, in the conventional integrated circuit device cooling device, since a disk-shaped heat exchanger plate was used, there was a problem that the heat exchanger plate and the town were not the same. The bonding form of the flexible elastic structure is limited, and as a result, the heat transfer area between the heat transfer surface and the refrigerant opening is limited by the size of the flexible elastic structure. If the amount of heat generated by integrated circuit elements increases further by VC after implementation,
Sufficient cooling capacity was not obtained, resulting in 5 p.

[There was a risk that the credibility of 1st route Kanko would be lowered. In addition, since the folds are flat, the shape of the contact part with the flexible elastic structure allows the refrigerant to flow completely smoothly, and the refrigerant stagnates, causing parts where the flow is poor. No need to reduce cooling efficiency. SUMMARY OF THE INVENTION An object of the present invention is to provide an integrated circuit device cooling device 17 that can achieve sufficient cooling MF71 even when the size of the integrated circuit device increases. [Means for Solving the Problems] FIG. 1 is a diagram showing the principle of a circuit element cooling device 'J' according to the first embodiment of the present invention. a refrigerant passageway through which the 21i refrigerant flows; 3 is a nozzle protruding from the refrigerant path 2; a flexible elastic structure providing stable contact with the 4-pack integrated circuit element 6; , 5 is a heat transfer plate, which is plated on the flexible elastic structure 4, or a separate member with heat conduction μs is connected to the flexible elastic structure 4. 1C, 6 is an integrated circuit element, and 7 is a substrate on which the integrated circuit element 6 is mounted. The heat exchanger plate 5 is an elastic structure that can be cut and extended in four directions to form a concave shape, and has an elastic structure that can be inserted into the vagina.
A sufficient gap is provided between B+-5F of the corpse 4 and the bottom surface of the heat transfer device 5. [Function] The present invention is constructed as described above. Since the heat girder 5 extends in the flexible structure body 4 direction and forms a concave part, the flexibility is limited to a large degree. This makes it possible to provide a larger heat transfer plate.It is also possible to reach the refrigerant from both sides of the heat transfer ty5 due to the heat conduction action within the heat transfer plate 5. The effective heat transfer area increases significantly due to both effects.Here, the thermal resistance between the heat transfer machine 5 and the refrigerant is expressed as R (deg/W), and the thermal resistance R can be expressed as the following equation. In the above equation, A is the effective ν transfer area (r+/), and the average heat transfer coefficient at the table surface (W/y
&・dCg). By the way, in the present invention, the oil-based force [;<because the effective heat transfer area will be significantly larger than the actual heat transfer area, the thermal resistance 1
(Therefore, it decreases with 11 expressions.
Since the bottom corner of the predetermined space provided between the bottom end of the 15td structure 4 and the bottom surface of the heat transfer carbon 5 has a crystal shape, the flow of the refrigerant that is constantly flowing in the predetermined space is It becomes smoother and the average heat transfer rate also increases by one degree at the same time. This effect also contributes to reducing heat resistance by reducing the thermal resistance R. As described above, in the present invention, the heat transfer plate is extended in the direction of the flexible elastic structure to form a concave portion, and a predetermined space is provided between the bottom end of the flexible elastic structure and the jIS of the bottom surface of the heat transfer device. As a result, the heat transfer surface fJA and the heat transfer coefficient between the heat transfer surface and the refrigerant are increased, and the #A grinding resistance R between the heat transfer surface and the refrigerant is reduced. [Embodiment] Hereinafter, one embodiment of the present invention will be described in detail with reference to FIG. 2hY. FIG. 2 is a complete diagram of one embodiment of the present invention. It should be noted that in FIG. 2, the same reference numeral 1 as in FIG. 1 indicates the same object 2. In Fig. 2, 2 is a refrigerant passage, 3 is a nozzle, 4 is a flexible elastic structure, 5 is a heat transfer, a slope, 6 integrated circuit elements, 7 is a substrate, and 21 is a guide. . When a refrigerant, such as water, flows into the refrigerant passage 2, a nozzle 3 protruding from the refrigerant passage 2 sends the refrigerant through a heat transfer plate 5 attached to the bottom ρ of the flexible four-dimensional structure 4. is injected against. The heat exchanger plate 5 and the integrated circuit element 6 are pressed directly or indirectly, and the heat generated from the integrated circuit element 6 mounted on the substrate 7 is extended in the direction of the flexible elastic structure 4. The heat is transmitted to the bottom and both side surfaces of the heat transfer plate 5, which has a concave portion, and the coolant further removes the heat, thereby cooling the integrated circuit element 6. At this time guide 21
By joining the heat exchanger plate 5 to the cooling body l, it is possible to improve the horizontal positional accuracy of the heat exchanger plate 5 with respect to the integrated circuit element 6, and at the same time, it is possible to prevent vibration or movement of the heat exchanger plate 5 in the horizontal direction. The structure of the upper 2 guides is guide 21.
By attaching it to the cooling body 1, horizontal movement of the heat exchanger plate 5 can be prevented and the pressure position can be adjusted. As long as the measure-7 is completed 6Z, as shown in Figure 3, any number 1 or 5 may be used. Section 3 (a), fbl, (cl, (d) A plan view showing an example of installation of shore guides + construction. Figure fat and lbl are for the case where the number of guides is three. Figure (d) The number of guides d is a combination of 4 trees. ↓ The same figure / dl is a case where multiple heat transfers are common guides for SOYO, and the cooling body 1 except the part connecting the cooling bodies 1 As shown in FIG. 2, the guide 21 made of a material with good thermal conductivity such as copper is pressed against a small electronic component 22 to form an integrated circuit. At the same time as element 6, the small m-7 part 2
It would be possible to cool down 2 as well. At this time, guide 2
1 and the small V-child part 22 may be cooled by placing a compound or the like with good thermal conductivity between them. [Effects of the Invention] As explained above, the present invention has a structure in which the heat transfer plate that transfers the heat of the integrated circuit element to the refrigerant is extended in the direction of the flexible elastic 4I'd structure, and the concave portion is completely formed. A predetermined space is provided between the bottom end of the flexible four-dimensional structure and the bottom surface of the heat exchanger plate. For this reason, even if the heat generation area of integrated circuit elements increases due to high-density packaging of integrated circuit elements, the heat transfer area and heat transfer coefficient between the heat transfer surface and the refrigerant increase, so the heat transfer between the heat transfer surface and the refrigerant increases. Reduces resistance and greatly improves cooling capacity 0

[Brief explanation of drawings]

Fig. 1 is a diagram showing the principle of the present invention, Fig. 2 is a diagram showing an embodiment of the invention, Fig. 3 is a plan view showing the structure of the installation of the guide; FIG. 4 is a diagram showing the construction of a conventional integrated circuit device cooling device W. As shown in FIG. In the figure, 1...cooling body, 2...refrigerant passage, 3...nozzle,
4... Flexible elastic structure, 5... Heat exchanger plate, 6...
integrated circuit element, 7... substrate, 21... guide, 22...
・Small electronic parts.・'-1-・2r 1~+,. 1, ;- Nomi Rei Motoki f7 Emperor f'! - Closed No. 1 Fig. 7, ・1 Mogaki Akinai - Jitsukaku 9 ・1 32 Figure power - F sword sail f dimension / i, structure 2 - r -! -Surface view Figure 3

Claims (1)

[Scope of Claims] A heat transfer plate (5) is provided at the bottom end of a flexible elastic structure (4) whose upper end is attached to the cooling body (1), and a nozzle provided inside the cooling body (1). (3) A refrigerant is injected onto the heat exchanger plate (5), and the heat exchanger plate (5) is directly or indirectly applied to the integrated circuit element (6) mounted on the substrate (7). In the integrated circuit device cooling device for cooling the integrated circuit device (7) by pressing the heat transfer plate (5) against the integrated circuit device (6), the heat transfer plate (5) cools the integrated circuit device (7) by pressing the heat transfer plate (5) against the integrated circuit device (6). extending in the direction of the flexible elastic structure (4) and forming a concave portion;
An integrated circuit device cooling device characterized in that a predetermined space is provided between the bottom end of the heat transfer plate (5) and the bottom surface of the heat transfer plate (5).