CN208368545U - heat sink device - Google Patents
heat sink device Download PDFInfo
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- CN208368545U CN208368545U CN201820675701.9U CN201820675701U CN208368545U CN 208368545 U CN208368545 U CN 208368545U CN 201820675701 U CN201820675701 U CN 201820675701U CN 208368545 U CN208368545 U CN 208368545U
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- Prior art keywords
- heat
- radiating groove
- heat sink
- sink device
- conducting layer
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Abstract
The utility model discloses a kind of heat sink devices, the heat sink device includes substrate and heat-conducting layer, substrate includes all sides and first surface that is being connected with all sides and being oppositely arranged and second surface, and first surface is provided with radiating groove, and radiating groove is for accommodating conductive fluid；Heat-conducting layer is formed on first surface, and is directly contacted with conductive fluid, so that conductive fluid absorbs at least partly heat of heat-conducting layer.By above-mentioned device, the utility model can directly be contacted by accommodating the radiating groove of conductive fluid on substrate with heat-conducting layer, and can take away the partial heat of heat-conducting layer, to reinforce radiating.
Description
Technical field
The utility model relates to arrive heat sink device field, it is related specifically to a kind of heat sink device.
Background technique
Heat sink (HeatSink) industrially refers to miniature water cooling cooling fin, for cooling down electronic chip.It is powerful at present
In LED (light emitting diode), LD (laser diode) illumination encapsulation, high heat can be generated when shining due to LED/LD, will use
The copper post of high thermal conductivity makes outside heat guiding packaging body, which also cries heat sink, and help is radiated to stabilized operating temperature.
Currently, most of packaged type is encapsulated using " discrete " of traditional type, i.e., chip is welded on AIN (aluminium nitride)
Or then again by heat sink welding on microchannel heat sink on tungsten-copper alloy heat sink.The encapsulation of this separate type exists and asks as follows
Topic: 1. structure is complicated, processing with to assemble difficulty big, and at high cost be not easy large-scale production.2. it is made of multiple material and device,
There are multiple contact layers, and thermal contact resistance is big, and consistency is poor, and there are multiple contact layers between multiple layers, thermal contact resistance is big, it is difficult to
Get desired heat dissipation effect.
Utility model content
The utility model provides a kind of heat sink device, is able to solve heat sink device thermal contact resistance in the prior art and radiates significantly
The problem of effect difference.
In order to solve the above technical problems, the technical solution that the utility model uses is: providing a kind of heat sink device, wrap
Substrate is included, first surface and second surface be connected including all sides and with all sides and being oppositely arranged, described
One surface is provided with radiating groove, and the radiating groove is for accommodating conductive fluid；Heat-conducting layer is formed on the first surface,
And with it is described it is thermally conductive directly contacted so that the conductive fluid absorbs at least partly heat of the heat-conducting layer.
The beneficial effects of the utility model are: a kind of heat sink device is provided, by the way that substrate is bonded with heat-conducting layer, and
Radiating groove is directly set on substrate, and the conductive fluid in radiating groove is directly contacted with heat-conducting layer, so as to take away
The partial heat of heat-conducting layer, to improve radiating efficiency.
Detailed description of the invention
Fig. 1 is the schematic cross-section of one embodiment of the utility model heat sink device；
Fig. 2 is a concrete structure schematic diagram of substrate in Fig. 1；
Fig. 3 is a front view of substrate in Fig. 1；
Fig. 4 is a top view of the substrate towards first surface in Fig. 1；
Fig. 5 is another top view of the substrate towards first surface in Fig. 1；
Fig. 6 is another top view of the substrate towards first surface in Fig. 1；
Fig. 7 is the another structural schematic diagram of substrate in Fig. 1；
Fig. 8 is the another structural schematic diagram of substrate in Fig. 1；
Fig. 9 is the another structural schematic diagram of substrate in Fig. 1；
Embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describing, it is clear that described embodiment is only a part of the embodiment of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
Every other embodiment obtained, fall within the protection scope of the utility model.
Referring to Fig. 1, Fig. 1 is the schematic cross-section of the first embodiment of heat sink device provided by the utility model, this
The heat sink device provided in implementation includes: substrate 11 and heat-conducting layer 12.
Wherein, substrate 11 it include all sides 115 and be connected with all sides 115 and opposite first surface 113 and
Second surface 114, heat-conducting layer 12 are formed in 113 on first surface.
Jointly refering to fig. 1 and Fig. 2, the first surface 113 of substrate 11 is equipped with radiating groove 111, which is used for
Conductive fluid is accommodated, so that the heat-conducting layer 12 being formed on first surface 113 is directly contacted with conductive fluid.
Wherein, radiating groove 111 includes the inlet 1111 and liquid outlet 1112 positioned at all sides 115,
Wherein, inlet 1111 is used for 111 filling heat-conductive liquid of radiating groove, and absorbs heat-conducting layer 12 extremely in conductive fluid
After minor heat, flowed out from liquid outlet 1112 to take away at least partly heat of heat-conducting layer 12.With feed liquor in the present embodiment Fig. 2
Mouth 1111 and liquid outlet 1112 are set to for all sides 115, and are located at the opposite two sides in all sides 115, in other embodiments
In, inlet 1111 and liquid outlet 1112 can also be positioned at the same sides or not opposite two sides of all sides 115.
Refering to Fig. 3, in another embodiment, the inlet 1111 and liquid outlet 1112 of radiating groove 111 can also positions
In the second surface 114 of substrate 11.In the particular embodiment, more conducively in radiating groove 11 conductive fluid importing, export.
Optionally, radiating groove 111 is multiple including at least successively alternately connecting from 1115 mouthfuls of feed liquor to liquid outlet 1112
Sub-trenches 1115, as shown in figure 4, Fig. 4 is a top view towards first surface in the utility model substrate, plurality of cunette
The bending connection of slot 1115, sub-trenches 1115 are straightway.
Radiating groove 111 is carried out by bending distribution by the area in restriction in above-described embodiment, so that radiating groove 111
Becoming larger with the contact surface of heat-conducting layer 12, i.e. conductive fluid and the contact surface of heat-conducting layer 12 becomes larger, so as to take away more heats,
Improve radiating efficiency.
Fig. 5 and Fig. 6 is please referred to, Fig. 5 and Fig. 6 are two towards the first surface top views of this Fig. 1 substrate 11,
In Fig. 5, the curved distribution of radiating groove 111, the tortuous connection of plurality of sub-trenches 1115, wherein sub-trenches 1115 are curve
Section, in Fig. 6, for radiating groove 111 in tortuous distribution, sub-trenches 1115 are straightway, and in tortuous connection.Using the present embodiment
Radiating groove 111 can accelerate the flow velocity of conductive fluid under same pressure, to enhance heat dissipation effect.
Optionally, radiating groove 111 be connected to first surface 113 and second surface 114 namely the radiating groove 111 from
On first surface 113 to the direction of second surface 114, run through substrate, that is to say, that the depth of radiating groove 111 is substrate 11 the
The distance of second surface 114 is arrived on one surface 113.
Please refer to the substrate 11 that Fig. 1 and Fig. 2 is provided, wherein the second surface 114 of substrate 11 is further sticked and has cover board
112, so that cover board 112 and radiating groove 111 are formed together a receiving cavity for accommodating conductive fluid, in other embodiments
In, cover board 112 can be only arranged in radiating groove 111 in the corresponding position of second surface 114.
Refering to Fig. 7, in another embodiment, radiating groove 111 is also not through substrate, optionally, the radiating groove depth
It is the 50% of substrate, in other examples, without limitation, can be 30%, 40%, 80% etc., through this embodiment
Structure save technique cost of manufacture, and the substrate 11 of the present embodiment is more steady when guaranteeing identical contact area
Gu.
Optionally, radiating groove 111 from second surface 114 to the direction of first surface 113 on area of section keep not
Become.
Refering to Fig. 8, in another embodiment, (figure is not in second surface (not shown) to first surface for radiating groove 111
Show) direction on area of section, be gradually increased, i.e., radiating groove 11 is maximum in the contact surface of first surface (not shown), leads to
The structure for crossing the present embodiment increases the direct contact area with heat-conducting layer 12 in the case where the conductive fluid of same volume, from
And enhance radiating efficiency.
Refering to Fig. 9, in another embodiment, in the present embodiment, radiating groove 11 includes that (figure is not from the second surface
Show) to sequentially connected first slot section 1113 and the second slot section 1114 on the direction of the first surface (not shown), wherein the
The area of section of one slot section 1113 is constant, and the second slot section 1114 is in second surface (not shown) to the side of first surface (not shown)
Upward area of section is gradually increased, that is, the second slot section 1114 maximum cross-section area be greater than the first slot section 1113 maximum
Area of section, structure through this embodiment further increase the contact area of heat-conducting layer and conductive fluid, save into
This.
Optionally, substrate uses silicon substrate, and the specification of the substrate 11 is the silicon wafer of 100 crystal structures, and specification can be selected
Four inch silicon wafers are also possible to the substrate of other some common material production in the market, specification in other examples
Also without limitation.
Heat-conducting layer 12 uses thermal conductivity to be made of the diamond of 2000W/m.K, and thickness range can use 0.1-5
μm, it specifically can be 0.1 μm, 1 μm, 3 μm and 5 μm etc., here without limitation, base be formed in by way of growth in situ
The first surface of plate 11, generation type in this way can make have very strong chemical bond between heat-conducting layer 12 and substrate 11
Position, so that the thermo-contact property between substrate 11 is good, almost can achieve the degree of contactless thermal resistance.
Heat sink device provided by the utility model further comprises welding layer 13, is arranged in heat-conducting layer 12 far from substrate 11
Another side on, specifically the methods of sputtering, evaporation, plating can be passed through using thermal conductivity and the good gold-tin alloy of plasticity
Preparation, here without limitation.
Through the foregoing embodiment it is found that embodiment provided by the utility model only illustrates setting for part radiating groove
Method is set, in the particular embodiment, there can be other some reasonable settings, as to inlet and liquid outlet orientation
It is arranged (including the combination settings between each all sides, second surface) and the cross sectional shape of radiating groove, it is such as semicircle, ellipse
Circle, rectangle, triangle and trapezoidal etc. setting, while setting of specification size of radiating groove etc. is not all carried out any
It limits.
By thermal resistance formula R=S/ λ h, wherein S is heat transfer area, and h is heat transfer thickness, and λ is thermal conductivity.By this reality
The heat sink device for applying example offer, since the material of the present embodiment uses the great diamond of thermal conductivity, and the present embodiment is each
It between layer is bonded by semiconductor technology so that the heat transfer thickness between each layer is minimum, thermal resistance is also accordingly reduced.
In conclusion it should be readily apparent to one skilled in the art that the utility model provides heat sink device, by the of substrate
One surface is provided with heat-conducting layer, is provided with welding layer on one side far from substrate in heat-conducting layer, and design has thermally conductive ditch in a substrate
Conductive fluid in slot and thermally conductive groove, conductive fluid are directly contacted with heat-conducting layer, and the part heat of heat-conducting layer is taken away by flowing
Amount all makes entire to reinforce the heat dissipation effect of whole device, and the semiconductor technology and material of the utility model use
Thermal resistance between device becomes smaller, and further enhances the efficiency of heat dissipation.
The above is only the embodiments of the present invention, and therefore it does not limit the scope of the patent of the utility model, all benefits
The equivalent structure or equivalent flow shift made by the utility model specification and accompanying drawing content, is applied directly or indirectly in it
His relevant technical field, is also included in the patent protection scope of the utility model.
Claims (9)
1. a kind of heat sink device, which is characterized in that described device includes:
Substrate, first surface and second surface be connected including all sides and with all sides and being oppositely arranged are described
First surface is provided with radiating groove, and the radiating groove is for accommodating conductive fluid；
Heat-conducting layer is formed on the first surface, and is directly contacted with the conductive fluid, so that the conductive fluid is inhaled
Receive at least partly heat of the heat-conducting layer.
2. heat sink device according to claim 1, which is characterized in that the radiating groove include be located at all sides or
The inlet and liquid outlet of person's second surface, the inlet are used to inject the conductive fluid to the radiating groove, and in institute
After stating at least partly heat that conductive fluid absorbs the heat-conducting layer, flowed out from the liquid outlet described at least partly hot to take away
Amount.
3. heat sink device according to claim 2, which is characterized in that the radiating groove includes from the inlet to institute
State multiple sub-trenches that liquid outlet is sequentially connected end to end, two adjacent bendings connection in the multiple sub-trenches.
4. heat sink device according to claim 1, which is characterized in that the radiating groove be connected to the first surface and
The second surface, described device further comprise cover board, and the cover board is attached at the second surface, with the heat dissipation ditch
Slot accommodates the conductive fluid jointly.
5. heat sink device according to claim 1, which is characterized in that the radiating groove is from the second surface to described
Area of section on first surface direction, is gradually increased.
6. heat sink device according to claim 1, which is characterized in that the radiating groove include from the second surface to
Sequentially connected first slot section and the second slot section, the maximum cross-section area of the second slot section are big on the direction of the first surface
In the area of section of the first slot section.
7. heat sink device according to claim 1, which is characterized in that the heat-conducting layer is with a thickness of 0.1-5 μm, material
Diamond.
8. heat sink device according to claim 1, which is characterized in that described device further comprises welding layer, the weldering
Layer is connect to be formed on the heat-conducting layer.
9. heat sink device according to claim 8, which is characterized in that the welding layer material is gold-tin alloy.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820675701.9U CN208368545U (en) | 2018-05-07 | 2018-05-07 | heat sink device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820675701.9U CN208368545U (en) | 2018-05-07 | 2018-05-07 | heat sink device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208368545U true CN208368545U (en) | 2019-01-11 |
Family
ID=64934079
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820675701.9U Active CN208368545U (en) | 2018-05-07 | 2018-05-07 | heat sink device |
Country Status (1)
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|---|---|
| CN (1) | CN208368545U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108831986A (en) * | 2018-05-07 | 2018-11-16 | 深圳技术大学（筹） | heat sink device and preparation method thereof |
-
2018
- 2018-05-07 CN CN201820675701.9U patent/CN208368545U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108831986A (en) * | 2018-05-07 | 2018-11-16 | 深圳技术大学（筹） | heat sink device and preparation method thereof |
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