JPS6364061U - - Google Patents

Info

Publication number
JPS6364061U
JPS6364061U JP15682486U JP15682486U JPS6364061U JP S6364061 U JPS6364061 U JP S6364061U JP 15682486 U JP15682486 U JP 15682486U JP 15682486 U JP15682486 U JP 15682486U JP S6364061 U JPS6364061 U JP S6364061U
Authority
JP
Japan
Prior art keywords
chips
led
substrate
shape
bonding surfaces
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15682486U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP15682486U priority Critical patent/JPS6364061U/ja
Publication of JPS6364061U publication Critical patent/JPS6364061U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案の具体的実施例を示すＬＥＤア
レイの構成斜視図、第２図乃至第３図は本考案の
説明に供する図、第４図はその他の実施例を示す
図、第５図は従来のＬＥＤアレイの一部概略構成
を示す図である。 １，１０，１００……基板、２……ＬＥＤチツ
プ、３……結像素子、４……感光ドラム。 FIG. 1 is a perspective view of the configuration of an LED array showing a specific embodiment of the present invention, FIGS. 2 and 3 are diagrams for explaining the present invention, FIG. 4 is a diagram showing other embodiments, and FIG. The figure is a diagram showing a partial schematic configuration of a conventional LED array. 1, 10, 100...substrate, 2...LED chip, 3...imaging element, 4...photosensitive drum.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 基板上の所定の位置に複数のＬＥＤチツプを直
列に並べて実装する構成のＬＥＤアレイにおいて
、前記基板の少なくとも前記ＬＥＤチツプを実装
する所定の位置の形状が、互いに隣接する前記Ｌ
ＥＤチツプの接合面が重畳して配列可能な構成の
段差を有して成ることを特徴とするＬＥＤアレイ
。 In an LED array having a configuration in which a plurality of LED chips are mounted in series at predetermined positions on a substrate, the shape of at least the predetermined position on the substrate where the LED chips are mounted is such that the shape of the adjacent L
1. An LED array characterized in that the bonding surfaces of ED chips have a step structure in which the bonding surfaces of the ED chips can be arranged in an overlapping manner.
JP15682486U 1986-10-14 1986-10-14 Pending JPS6364061U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15682486U JPS6364061U (en) 1986-10-14 1986-10-14

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15682486U JPS6364061U (en) 1986-10-14 1986-10-14

Publications (1)

Publication Number Publication Date
JPS6364061U true JPS6364061U (en) 1988-04-27

Family

ID=31078808

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15682486U Pending JPS6364061U (en) 1986-10-14 1986-10-14

Country Status (1)

Country Link
JP (1) JPS6364061U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009506370A (en) * 2005-08-29 2009-02-12 テソン ソン Light source module and optical scanning device using the same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009506370A (en) * 2005-08-29 2009-02-12 テソン ソン Light source module and optical scanning device using the same
JP4671139B2 (en) * 2005-08-29 2011-04-13 テソン ソン Light source module

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