JPS6364049U - - Google Patents
Info
- Publication number
- JPS6364049U JPS6364049U JP1986156002U JP15600286U JPS6364049U JP S6364049 U JPS6364049 U JP S6364049U JP 1986156002 U JP1986156002 U JP 1986156002U JP 15600286 U JP15600286 U JP 15600286U JP S6364049 U JPS6364049 U JP S6364049U
- Authority
- JP
- Japan
- Prior art keywords
- resin body
- semiconductor device
- electrode
- hard resin
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920005989 resin Polymers 0.000 claims description 24
- 239000011347 resin Substances 0.000 claims description 24
- 239000004065 semiconductor Substances 0.000 claims description 17
- 239000003822 epoxy resin Substances 0.000 claims 1
- 229920000647 polyepoxide Polymers 0.000 claims 1
- 238000007789 sealing Methods 0.000 claims 1
- 229920002379 silicone rubber Polymers 0.000 claims 1
- 239000004945 silicone rubber Substances 0.000 claims 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986156002U JPH0519957Y2 (US08066781-20111129-C00013.png) | 1986-10-14 | 1986-10-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986156002U JPH0519957Y2 (US08066781-20111129-C00013.png) | 1986-10-14 | 1986-10-14 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6364049U true JPS6364049U (US08066781-20111129-C00013.png) | 1988-04-27 |
| JPH0519957Y2 JPH0519957Y2 (US08066781-20111129-C00013.png) | 1993-05-25 |
Family
ID=31077212
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986156002U Expired - Lifetime JPH0519957Y2 (US08066781-20111129-C00013.png) | 1986-10-14 | 1986-10-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0519957Y2 (US08066781-20111129-C00013.png) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03108362A (ja) * | 1989-09-22 | 1991-05-08 | Denki Kagaku Kogyo Kk | 半導体塔載用回路基板及びその製造方法 |
| WO2008123386A1 (ja) * | 2007-03-22 | 2008-10-16 | Toyota Jidosha Kabushiki Kaisha | パワーモジュール及び車両用インバータ |
| JP2009277876A (ja) * | 2008-05-14 | 2009-11-26 | Sanken Electric Co Ltd | 半導体装置 |
| JP2013098266A (ja) * | 2011-10-31 | 2013-05-20 | Hitachi Ltd | 半導体装置及びその製造方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS615812U (ja) * | 1984-05-31 | 1986-01-14 | 日本メクトロン株式会社 | 搬送用ベルト |
-
1986
- 1986-10-14 JP JP1986156002U patent/JPH0519957Y2/ja not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS615812U (ja) * | 1984-05-31 | 1986-01-14 | 日本メクトロン株式会社 | 搬送用ベルト |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03108362A (ja) * | 1989-09-22 | 1991-05-08 | Denki Kagaku Kogyo Kk | 半導体塔載用回路基板及びその製造方法 |
| WO2008123386A1 (ja) * | 2007-03-22 | 2008-10-16 | Toyota Jidosha Kabushiki Kaisha | パワーモジュール及び車両用インバータ |
| JP2009277876A (ja) * | 2008-05-14 | 2009-11-26 | Sanken Electric Co Ltd | 半導体装置 |
| JP2013098266A (ja) * | 2011-10-31 | 2013-05-20 | Hitachi Ltd | 半導体装置及びその製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0519957Y2 (US08066781-20111129-C00013.png) | 1993-05-25 |
