JPS6364047U - - Google Patents
Info
- Publication number
- JPS6364047U JPS6364047U JP1986157157U JP15715786U JPS6364047U JP S6364047 U JPS6364047 U JP S6364047U JP 1986157157 U JP1986157157 U JP 1986157157U JP 15715786 U JP15715786 U JP 15715786U JP S6364047 U JPS6364047 U JP S6364047U
- Authority
- JP
- Japan
- Prior art keywords
- package
- protrusion
- metal base
- insulating frame
- semiconductor element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986157157U JPH0617303Y2 (ja) | 1986-10-14 | 1986-10-14 | 半導体素子収納用パツケ−ジ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986157157U JPH0617303Y2 (ja) | 1986-10-14 | 1986-10-14 | 半導体素子収納用パツケ−ジ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6364047U true JPS6364047U (enExample) | 1988-04-27 |
| JPH0617303Y2 JPH0617303Y2 (ja) | 1994-05-02 |
Family
ID=31079446
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986157157U Expired - Lifetime JPH0617303Y2 (ja) | 1986-10-14 | 1986-10-14 | 半導体素子収納用パツケ−ジ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0617303Y2 (enExample) |
-
1986
- 1986-10-14 JP JP1986157157U patent/JPH0617303Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0617303Y2 (ja) | 1994-05-02 |