JPS6363410U - - Google Patents
Info
- Publication number
- JPS6363410U JPS6363410U JP1986156688U JP15668886U JPS6363410U JP S6363410 U JPS6363410 U JP S6363410U JP 1986156688 U JP1986156688 U JP 1986156688U JP 15668886 U JP15668886 U JP 15668886U JP S6363410 U JPS6363410 U JP S6363410U
- Authority
- JP
- Japan
- Prior art keywords
- terminal
- mold
- receiving surface
- case
- molten resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000465 moulding Methods 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims 3
- 239000011347 resin Substances 0.000 claims 3
- 238000001816 cooling Methods 0.000 claims 1
- 229920003002 synthetic resin Polymers 0.000 claims 1
- 239000000057 synthetic resin Substances 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C69/00—Combinations of shaping techniques not provided for in a single one of main groups B29C39/00 - B29C67/00, e.g. associations of moulding and joining techniques; Apparatus therefore
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Manufacture Of Switches (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Switch Cases, Indication, And Locking (AREA)
Description
第1図は本考案の一実施例に係る成形用金型の
型開き状態を示す断面図、第2図はその成形用金
型の型締め状態を示す要部断面図、第3図はその
成形用金型によつて成形されたスイツチケースを
示す断面図、第4図は本考案の他の実施例を示す
成形用金型の断面図、第5図ないし第8図は従来
例に係り、第5図はデイツプスイツチの断面図、
第6図および第7図は端子とケースの製造工程を
示す説明図、第8図はその製造工程で用いられる
金型装置の断面図である。
1……ケース、2……端子、2a……固定接点
部、6……ベース板、9……端子部、11……キ
ヤビテイ、12……上型、12b……傾斜面(挾
持面)、13……下型、13b……傾斜面(挾持
面)、15……樹脂、B……受面。
FIG. 1 is a cross-sectional view showing a mold opening state of a molding die according to an embodiment of the present invention, FIG. 2 is a cross-sectional view of essential parts showing the molding mold in a closed state, and FIG. A sectional view showing a switch case molded by a molding die, FIG. 4 is a sectional view of a molding die showing another embodiment of the present invention, and FIGS. 5 to 8 relate to a conventional example. , Figure 5 is a cross-sectional view of the deep switch,
6 and 7 are explanatory diagrams showing the manufacturing process of the terminal and the case, and FIG. 8 is a sectional view of a mold device used in the manufacturing process. DESCRIPTION OF SYMBOLS 1... Case, 2... Terminal, 2a... Fixed contact part, 6... Base plate, 9... Terminal part, 11... Cavity, 12... Upper mold, 12b... Inclined surface (clamping surface), 13... Lower mold, 13b... Inclined surface (clamping surface), 15... Resin, B... Receiving surface.
Claims (1)
型と下型とを備え、これら上型と下型との間に画
成されるキヤビテイの受面に前記端子を当接した
状態で該キヤビテイに溶融樹脂を充填し、しかる
後、該溶融樹脂を冷却・固化することにより合成
樹脂製のケースと前記端子とを一体成形するスイ
ツチケースの成形用金型において、前記上型と下
型に、前記キヤビテイの受面を臨み且つ該受面に
対して傾斜する挾持面を設け、これら挾持面で前
記端子を挾持してその自由端を前記受面に圧接す
るように構成したことを特徴とするスイツチケー
スの成形用金型。 An upper mold and a lower mold are provided for holding a terminal pressed into a predetermined shape, and the terminal is placed in the cavity with the terminal in contact with the receiving surface of the cavity defined between the upper mold and the lower mold. In a mold for molding a switch case, in which a synthetic resin case and the terminal are integrally molded by filling a molten resin and then cooling and solidifying the molten resin, the upper mold and the lower mold are filled with the molten resin. A switch characterized in that clamping surfaces facing the receiving surface of the cavity and inclined with respect to the receiving surface are provided, and the terminal is clamped by these clamping surfaces so that the free end thereof is pressed into contact with the receiving surface. Mold for molding the case.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986156688U JPH0342985Y2 (en) | 1986-10-15 | 1986-10-15 | |
KR2019870007674U KR900009158Y1 (en) | 1986-10-15 | 1987-05-19 | Mould of switch case |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986156688U JPH0342985Y2 (en) | 1986-10-15 | 1986-10-15 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6363410U true JPS6363410U (en) | 1988-04-26 |
JPH0342985Y2 JPH0342985Y2 (en) | 1991-09-09 |
Family
ID=31078541
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1986156688U Expired JPH0342985Y2 (en) | 1986-10-15 | 1986-10-15 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JPH0342985Y2 (en) |
KR (1) | KR900009158Y1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20210064670A (en) * | 2019-11-26 | 2021-06-03 | 주식회사 엘지에너지솔루션 | Forming apparatus for pouch type case and method of preparing pouch type case thereby |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS51148359A (en) * | 1975-06-16 | 1976-12-20 | Hitachi Ltd | Lead formation method of resin mold ic element |
-
1986
- 1986-10-15 JP JP1986156688U patent/JPH0342985Y2/ja not_active Expired
-
1987
- 1987-05-19 KR KR2019870007674U patent/KR900009158Y1/en not_active IP Right Cessation
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS51148359A (en) * | 1975-06-16 | 1976-12-20 | Hitachi Ltd | Lead formation method of resin mold ic element |
Also Published As
Publication number | Publication date |
---|---|
KR880007736U (en) | 1988-06-28 |
KR900009158Y1 (en) | 1990-10-06 |
JPH0342985Y2 (en) | 1991-09-09 |
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