JPH02127420U - - Google Patents

Info

Publication number
JPH02127420U
JPH02127420U JP3806789U JP3806789U JPH02127420U JP H02127420 U JPH02127420 U JP H02127420U JP 3806789 U JP3806789 U JP 3806789U JP 3806789 U JP3806789 U JP 3806789U JP H02127420 U JPH02127420 U JP H02127420U
Authority
JP
Japan
Prior art keywords
mold
upper mold
movable plate
lower mold
cavity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3806789U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP3806789U priority Critical patent/JPH02127420U/ja
Publication of JPH02127420U publication Critical patent/JPH02127420U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案による金型装置の一実施例の断
面図で左半分はゴム注入前の型締めした状態を示
し、右半分は注入したゴムの膨張により中芯型及
び可動盤が上昇した状態を示し、第２図は従来の
金型装置の断面図である。 １……固定盤、２……可動盤、３……下型、４
……上型、５……中芯型、６……ランナー、７…
…キヤビテイ、８……合わせ面、９……バネ押え
、１０……バネ。 Figure 1 is a cross-sectional view of one embodiment of the mold device according to the present invention. The left half shows the mold clamped state before rubber injection, and the right half shows the core mold and movable platen rising due to expansion of the injected rubber. FIG. 2 is a sectional view of a conventional mold device. 1...Fixed plate, 2...Movable plate, 3...Lower mold, 4
...Top mold, 5...Middle core mold, 6...Runner, 7...
...Cavity, 8...Matching surface, 9...Spring holder, 10...Spring.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 固定盤に固定した下型と、下型に対して型締め
可能で可動盤に接離可能に設けられた上型と、上
型内に上型と相対的に移動可能に挿入され下型と
共にキヤビテイを形成する可動盤に取付けられた
中芯型と、中芯型又は可動盤と上型との間に上型
を下型側に押すように挿入したバネとを備え、上
型と下型との合わせ面がキヤビテイと接して設け
られているゴム成形用金型装置。 A lower mold fixed to a fixed plate, an upper mold that can be clamped to the lower mold and can be moved toward and away from the movable plate, and is inserted into the upper mold so that it can move relative to the upper mold and together with the lower mold. It is equipped with a core mold attached to a movable plate that forms a cavity, and a spring inserted between the core mold or the movable plate and the upper mold to push the upper mold toward the lower mold. A rubber molding device whose mating surface is in contact with the cavity.
JP3806789U 1989-03-31 1989-03-31 Pending JPH02127420U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3806789U JPH02127420U (en) 1989-03-31 1989-03-31

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3806789U JPH02127420U (en) 1989-03-31 1989-03-31

Publications (1)

Publication Number Publication Date
JPH02127420U true JPH02127420U (en) 1990-10-19

Family

ID=31545740

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3806789U Pending JPH02127420U (en) 1989-03-31 1989-03-31

Country Status (1)

Country Link
JP (1) JPH02127420U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002192571A (en) * 2000-12-25 2002-07-10 Toyoda Gosei Co Ltd Mold for molding seal ring and seal ring molding method

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57193334A (en) * 1981-05-26 1982-11-27 Hitachi Ltd Injection mold

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57193334A (en) * 1981-05-26 1982-11-27 Hitachi Ltd Injection mold

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002192571A (en) * 2000-12-25 2002-07-10 Toyoda Gosei Co Ltd Mold for molding seal ring and seal ring molding method
JP4632073B2 (en) * 2000-12-25 2011-02-16 豊田合成株式会社 Mold for sealing ring molding and molding method for sealing ring

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