JPS6362725A - Manufacture of printed circuit base plate - Google Patents
Manufacture of printed circuit base plateInfo
- Publication number
- JPS6362725A JPS6362725A JP20737986A JP20737986A JPS6362725A JP S6362725 A JPS6362725 A JP S6362725A JP 20737986 A JP20737986 A JP 20737986A JP 20737986 A JP20737986 A JP 20737986A JP S6362725 A JPS6362725 A JP S6362725A
- Authority
- JP
- Japan
- Prior art keywords
- mold release
- guide pin
- release film
- diameter
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 15
- 238000000034 method Methods 0.000 claims abstract description 17
- 238000003475 lamination Methods 0.000 claims description 12
- 238000003825 pressing Methods 0.000 claims description 8
- 239000011347 resin Substances 0.000 abstract description 8
- 229920005989 resin Polymers 0.000 abstract description 8
- 238000010030 laminating Methods 0.000 abstract description 4
- 230000000694 effects Effects 0.000 abstract description 2
- 239000000463 material Substances 0.000 abstract description 2
- 229920000306 polymethylpentene Polymers 0.000 abstract description 2
- 239000011116 polymethylpentene Substances 0.000 abstract description 2
- 229920002620 polyvinyl fluoride Polymers 0.000 abstract description 2
- 238000007796 conventional method Methods 0.000 description 2
- 239000006082 mold release agent Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、プリント回路基板の製造方法に関し、更に詳
しくは、ピンラミネーシッン法により積層プレスして行
うプリント回路基板の製造方法の改良に関する。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a method for manufacturing a printed circuit board, and more particularly to an improvement in the method for manufacturing a printed circuit board by laminating and pressing using a pin lamination method.
従来技術
従来のピンラミネーシッン法によりｌａＮプレスして行
うプリント回路基板の製造方法を第３図及び第４図を参
照して説明する。BACKGROUND OF THE INVENTION A method of manufacturing a printed circuit board by laN pressing using a conventional pin lamination method will be described with reference to FIGS. 3 and 4.
第３図に示すように、両面プリント基板Ｂ、の上下に、
接着剤の役目をするプリプレグＰＩ、Ｐ２を挟んで片面
プリント基板Ｂ２．Ｂ、を置き、それらの上下面に、離
型フィルムｒｌ＋’２を挟んで中間板”ｒ、 ｌ Ｔ２
を置き、これを何段か繰り返し重ね、それを治具板Ｊ、
、Ｊ、（Ｊ２は図示省略）で押えて積層プレスする。As shown in Figure 3, on the top and bottom of the double-sided printed circuit board B,
One-sided printed circuit board B2. B, and place intermediate plates "r, l T2 on their upper and lower surfaces with a release film rl+'2 in between.
, repeat this several times, and place it on the jig plate J.
, J, (J2 not shown) for lamination pressing.
ここで積層するプリント基板Ｂ１．Ｂ２．・・・等の位
置決めを行うために、これらにガイド孔を開けておき、
それらガイド孔にガイドピンＧを挿通している。そこで
、これをビンラミネーシＪン法と呼んでいる。Printed circuit board B1 to be laminated here. B2. For positioning, etc., guide holes are drilled in these.
Guide pins G are inserted into these guide holes. Therefore, this is called the bottle lamination method.
従来技術の問題点
ガイドピンＧを挿通するためにプリント基板Ｂｌ、Ｂ２
、Ｂ３や離型フィルムｒｌ＋ｒ２等に穿設されるガイ
ド孔は、ガイドピンＧの直径より大きな径に設定されて
いる０例えば第４１１ （ａ）に示すように、離型フィ
ルムｒＩのガイド孔り、の直径αは、ガイドピンＧの直
径βより大きい。Problems with the prior art: In order to insert the guide pin G, the printed circuit boards Bl and B2
, B3, the release film rl+r2, etc., are set to have a diameter larger than the diameter of the guide pin G. For example, as shown in No. 411 (a), the guide hole of the release film rI is , is larger than the diameter β of the guide pin G.
すると、第４図（ｂ）に示すように、ガイド孔ｈ、にガ
イドピンＧを挿通した時、離型フィルムｒ１とガイドピ
ンＧの間に隙間を生じる。Then, as shown in FIG. 4(b), when the guide pin G is inserted into the guide hole h, a gap is created between the release film r1 and the guide pin G.
この状態で積層プレスすると、流出したプリプレグＰｔ
＋Ｐ２の樹脂が、離型フィルムｒｌ＋ｒ２とガイドピン
Ｇの間の隙間からガイドピンＧに沿って中間板Ｔ、、Ｔ
、や治具板Ｊ、、Ｊ２等に向かう。When lamination pressing is performed in this state, the prepreg Pt that flows out
+P2 resin flows from the gap between the release film rl+r2 and the guide pin G along the guide pin G to the intermediate plates T,,T
, and jig plates J, , J2, etc.
そこで、その樹脂が付着するのを防止するために、中間
板Ｔ、、’ｒ２や治具板ＪＨ，Ｊ２やガイドピンＧに離
型剤を塗布することが行われている。Therefore, in order to prevent the resin from adhering, a mold release agent is applied to the intermediate plates T, .r2, jig plates JH, J2, and guide pins G.
しかし、それらへの離型剤の塗布が不十分であると、樹
脂が付着してしまう問題点がある。However, if the release agent is not sufficiently applied to them, there is a problem that the resin will adhere to them.
発明の目的
本発明の目的とするところは、離型フィルムとガイドピ
ンの間の隙間を通うてプリプレグの樹脂が中間板や治具
板へ流出するのを防止できるようにしたプリント回路基
板の製造方法を提供することにある。OBJECT OF THE INVENTION The object of the present invention is to manufacture a printed circuit board that can prevent prepreg resin from flowing out to an intermediate plate or a jig plate through a gap between a release film and a guide pin. The purpose is to provide a method.
発明の構成
本発明のプリント回路基板の製造方法は、ピンラミネー
シシン法により積層プレスして行うプリント回路基板の
製造方法において、柔軟性を有する離型フィルムを用い
ると共に、その離型フィルムに穿設するガイド孔の直径
をガイドピンの直径より小とすることを構成上の特徴と
するものである。Structure of the Invention The method for manufacturing a printed circuit board of the present invention is a method for manufacturing a printed circuit board by laminating and pressing using a pin lamination method, in which a flexible release film is used, and the release film is provided with perforations. A structural feature is that the diameter of the guide hole is smaller than the diameter of the guide pin.
実施例
以下、図に示す実施例に基づいて本発明を更に詳しく説
明する。ここに第１図は本発明に係るプリント回路基板
の製造方法での積層状態を示す要部断面図、第２図は離
型フィルムとガイドピンの関係を示す斜視図で、（ａ）
はガイドピン挿通前、（ｂ）はガイドピン挿通時の状態
を示している。EXAMPLES Hereinafter, the present invention will be explained in more detail based on examples shown in the drawings. Here, FIG. 1 is a cross-sectional view of essential parts showing a laminated state in the method for manufacturing a printed circuit board according to the present invention, and FIG. 2 is a perspective view showing the relationship between a release film and a guide pin.
(b) shows the state before the guide pin is inserted, and (b) shows the state when the guide pin is inserted.
尚、図に示す実施例により本発明が限定されるものでは
ない。Note that the present invention is not limited to the embodiments shown in the figures.
第１図に示すように、両面プリント基板Ｂ、の雨上下面
に、プリプレグＰｌ＋Ｐ２を挾んで片面プリント基板Ｂ
２．Ｂ、を置き、その上下に、離型フィルムＲ，，Ｒ２
を挟んで中間板Ｔ、、Ｔ２を置き、これらを何段か繰り
返して重ね、治具板ＪＨ＋ Ｊ２ （Ｊ２は図示省
略）で押え、積層プレスする。As shown in Figure 1, prepreg Pl+P2 is sandwiched between the top and bottom surfaces of the double-sided printed circuit board B,
2. Place B, and release films R,, R2 above and below it.
Intermediate plates T, T2 are placed between them, and these are stacked repeatedly in several stages, pressed with jig plates JH+J2 (J2 not shown), and laminated and pressed.
積層するプリント基板Ｂ１．Ｂ２．・・・等の位置決め
を行うために、これらにガイド孔を開けておき、それら
ガイド孔にガイドピンＧを挿通している。Printed circuit boards to be laminated B1. B2. . . . etc., guide holes are drilled in these and guide pins G are inserted into these guide holes.
このようにピンラミネーション法により積層プレスを行
う点において本発明のプリント回路基板の製造方法は基
本的に従来と異なるところはない。In this way, the printed circuit board manufacturing method of the present invention is basically the same as the conventional method in that the lamination press is performed by the pin lamination method.
ところが、離型フィルムＲ１＋Ｒ２力（従来におけるも
のと異なる点に注意すべきである。However, it should be noted that the release film R1+R2 force (different from the conventional one).
すなわち、第２図（２）に示すように、離型フィルムＲ
，に穿設されたガイド孔Ｈ１の直径Ａは、ガイドピンＧ
の直径βよりも小さな直径となっている。また、離型フ
ィルムＲ＋ ＋ Ｒ２は、ポリフッ化ビニル、ポリメチ
ルペンテンの如き柔軟性のある素材により作られている
。That is, as shown in FIG. 2 (2), the release film R
, the diameter A of the guide hole H1 drilled in the guide pin G
The diameter is smaller than the diameter β of . Furthermore, the release film R+ + R2 is made of a flexible material such as polyvinyl fluoride or polymethylpentene.
そこで、この離型フィルムＲ１，Ｒ２にガイドピンＧを
挿通ずると、ガイドピンＧの大きさまでガイド孔Ｈ区が
拡がると共に、両者は密着した状態を保ち、離型フィル
ムＲＩ ＋ Ｒ２とガイドピンＧの間に隙間を生じさ
せない。Therefore, when the guide pin G is inserted through the release films R1 and R2, the guide hole H section expands to the size of the guide pin G, and the two remain in close contact, so that the release film RI + R2 and the guide pin G Do not leave any gaps between them.
そこで、積層プレス時に流出したプリプレグＰ１、Ｐ２
の樹脂が中間板Ｔ、、Ｔ２や治具板Ｊ１゜Ｊ２へ向かう
ことが妨げられ、したがって、中間板７１ ＋ ”ｒ２
や治具板Ｊｌ＋Ｊ２等が樹脂の付着から保護される。Therefore, the prepregs P1 and P2 that flowed out during lamination pressing
The resin of
, jig plate Jl+J2, etc. are protected from resin adhesion.
発明の効果
本発明によれば、ピンラミネーシＪン法により積層プレ
スして行うプリント回路基板の製造方法において、柔軟
性を有する離型フィルムを用いると共に、その離型フィ
ルムに穿設するガイド孔の直径をガイドピンの直径より
小とすることを特徴とするプリント回路基板の製造方法
が提供され、これにより離型フィルムのガイド孔とガイ
ドピンの間に隙間が生じないので、プリプレグの樹脂が
流出して中間板や治具板に流れ、付着することが防止さ
れる。したがって、中間板等に離型剤を塗布する手間を
軽減することができる。Effects of the Invention According to the present invention, in a method for manufacturing a printed circuit board by laminating and pressing using the pin lamination J method, a flexible mold release film is used, and the diameter of the guide hole formed in the mold release film is A method for manufacturing a printed circuit board is provided, characterized in that the diameter of the printed circuit board is smaller than the diameter of the guide pin, and as a result, no gap is created between the guide hole of the release film and the guide pin, so that the resin of the prepreg does not flow out. This prevents the liquid from flowing and adhering to the intermediate plate or jig plate. Therefore, it is possible to reduce the effort required to apply a mold release agent to the intermediate plate and the like.
第り図は本発明に係るプリント回路基板の製造方法での
積層状態を示す要部断面図、第２図は離型フィルムとガ
イドピンの関係を示す斜視図で、（ａ）はガイドピン挿
通前、（ｂ）はガイドピン挿通時の状態を示している。
第３図は従来のプリント回路基板の製造方法の積層プレ
スの状態を示す要部断面図、第４図は従来方法における
離型フィルムとガイドピンの関係を示す斜視図で、（ａ
）はガイドピンの挿通前の状態、（ｂ）はガイドピンを
挿通した状態である。
（符号の説明）
Ｒｌ ＊ Ｒ２・・・離型フィルム
Ｈ，・・・ガイド孔 Ａ・・・ガイド孔の直径Ｇ・・
・ガイドピン β・・・ガイドピンの直径。Figure 1 is a cross-sectional view of the main parts showing the laminated state in the printed circuit board manufacturing method according to the present invention, Figure 2 is a perspective view showing the relationship between the release film and the guide pin, and (a) is the guide pin insertion. The first part (b) shows the state when the guide pin is inserted. FIG. 3 is a sectional view of the main parts showing the state of the lamination press in the conventional printed circuit board manufacturing method, and FIG. 4 is a perspective view showing the relationship between the release film and the guide pin in the conventional method.
) shows the state before the guide pin is inserted, and (b) shows the state after the guide pin has been inserted. (Explanation of symbols) Rl * R2... Release film H,... Guide hole A... Diameter of guide hole G...
・Guide pin β...Diameter of guide pin.
Claims (1)
リント回路基板の製造方法において、柔軟性を有する離
型フィルムを用いると共に、その離型フィルムに穿設す
るガイド孔の直径をガイドピンの直径より小とすること
を特徴とするプリント回路基板の製造方法。1. In a method for manufacturing printed circuit boards by laminated pressing using the pin lamination method, a flexible mold release film is used, and the diameter of the guide hole bored in the mold release film is smaller than the diameter of the guide pin. A method of manufacturing a printed circuit board, characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20737986A JPS6362725A (en) | 1986-09-03 | 1986-09-03 | Manufacture of printed circuit base plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20737986A JPS6362725A (en) | 1986-09-03 | 1986-09-03 | Manufacture of printed circuit base plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6362725A true JPS6362725A (en) | 1988-03-19 |
Family
ID=16538754
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20737986A Pending JPS6362725A (en) | 1986-09-03 | 1986-09-03 | Manufacture of printed circuit base plate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6362725A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04168793A (en) * | 1990-10-31 | 1992-06-16 | Nec Toyama Ltd | Manufacture of multilayer copper-clad board |
| US7470342B2 (en) * | 2000-10-17 | 2008-12-30 | Brother Kogyo Kabushiki Kaisha | Structure and method for laminating and fixing thin plate parts and method for fabricating ink-jet printer head |
-
1986
- 1986-09-03 JP JP20737986A patent/JPS6362725A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04168793A (en) * | 1990-10-31 | 1992-06-16 | Nec Toyama Ltd | Manufacture of multilayer copper-clad board |
| US7470342B2 (en) * | 2000-10-17 | 2008-12-30 | Brother Kogyo Kabushiki Kaisha | Structure and method for laminating and fixing thin plate parts and method for fabricating ink-jet printer head |
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