JPS6362271U - - Google Patents

Info

Publication number
JPS6362271U
JPS6362271U JP15449886U JP15449886U JPS6362271U JP S6362271 U JPS6362271 U JP S6362271U JP 15449886 U JP15449886 U JP 15449886U JP 15449886 U JP15449886 U JP 15449886U JP S6362271 U JPS6362271 U JP S6362271U
Authority
JP
Japan
Prior art keywords
paste
supply device
arm
feeder
holding arm
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15449886U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0434934Y2 (
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP15449886U priority Critical patent/JPH0434934Y2/ja
Publication of JPS6362271U publication Critical patent/JPS6362271U/ja
Application granted granted Critical
Publication of JPH0434934Y2 publication Critical patent/JPH0434934Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/743—Apparatus for manufacturing layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Basic Packing Technique (AREA)
  • Coating Apparatus (AREA)
  • Die Bonding (AREA)
JP15449886U 1986-10-08 1986-10-08 Expired JPH0434934Y2 ( )

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15449886U JPH0434934Y2 ( ) 1986-10-08 1986-10-08

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15449886U JPH0434934Y2 ( ) 1986-10-08 1986-10-08

Publications (2)

Publication Number Publication Date
JPS6362271U true JPS6362271U ( ) 1988-04-25
JPH0434934Y2 JPH0434934Y2 ( ) 1992-08-19

Family

ID=31074341

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15449886U Expired JPH0434934Y2 ( ) 1986-10-08 1986-10-08

Country Status (1)

Country Link
JP (1) JPH0434934Y2 ( )

Also Published As

Publication number Publication date
JPH0434934Y2 ( ) 1992-08-19

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