JPS6361162U - - Google Patents
Info
- Publication number
- JPS6361162U JPS6361162U JP15376886U JP15376886U JPS6361162U JP S6361162 U JPS6361162 U JP S6361162U JP 15376886 U JP15376886 U JP 15376886U JP 15376886 U JP15376886 U JP 15376886U JP S6361162 U JPS6361162 U JP S6361162U
- Authority
- JP
- Japan
- Prior art keywords
- emitting diode
- light emitting
- lead wire
- wire portions
- tips
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 4
Description
第１図は本考案に係る発光ダイオード素子集合
体の正面図、第２図及び第３図は第１図の発光ダ
イオード素子集合体の組立に用いるリードフレー
ムの正面図、第４図は本考案に係る発光ダイオー
ド素子集合体を使用した発光ダイオード素子の直
列接続回路の斜視図である。
第１図乃至第４図において、１……リードフレ
ーム、２・３……リード線部、２ａ……ワイヤー
ボンデイング部、３ａ……チツプボンデイング部
、４ａ・４ｂ・４ｃ……タイバー、７……透光体
、８ａ・８ｂ・８ｃ……発光ダイオード素子。
Fig. 1 is a front view of a light emitting diode element assembly according to the present invention, Figs. 2 and 3 are front views of a lead frame used for assembling the light emitting diode element assembly of Fig. 1, and Fig. 4 is a front view of a light emitting diode element assembly according to the present invention. FIG. 2 is a perspective view of a series connection circuit of light emitting diode elements using the light emitting diode element assembly according to the present invention. 1 to 4, 1... lead frame, 2, 3... lead wire section, 2a... wire bonding section, 3a... chip bonding section, 4a, 4b, 4c... tie bar, 7... Translucent body, 8a, 8b, 8c...light emitting diode elements.
Claims (1)
ボンデイング部３ａとをそれぞれ有する一対のリ
ード線部２・３を多数対平行に配列するとともに
、これらの各リード線部の先端部に近い部分とそ
の反対側の末端部分とを適数のタイバー４ａ・４
ｂ・４ｃで一体的に連結したリードフレーム１を
導電性の薄板で構成したうえ、前記各リード線部
２・３の先端部にぞれぞれワイヤーボンデイング
とチツプボンデイングを施してこの部分を透光体
７でシールドして発光ダイオード素子８ａ・８ｂ
・８ｃ……を形成したことを特徴とする発光ダイ
オード素子集合体。 A large number of pairs of lead wire portions 2 and 3 each having a wire bonding portion 2a and a chip bonding portion 3a at their tips are arranged in parallel, and a portion near the tip of each of these lead wire portions and a portion on the opposite side thereof are arranged in parallel. Connect the end portion with an appropriate number of tie bars 4a and 4.
The lead frame 1 integrally connected by b and 4c is constructed of a conductive thin plate, and the tips of the lead wire portions 2 and 3 are wire bonded and chip bonded, respectively, and this portion is transparent. Light emitting diode elements 8a and 8b are shielded by the light body 7
- A light emitting diode element assembly characterized by forming 8c...
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15376886U JPS6361162U (en) | 1986-10-08 | 1986-10-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15376886U JPS6361162U (en) | 1986-10-08 | 1986-10-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6361162U true JPS6361162U (en) | 1988-04-22 |
Family
ID=31072948
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15376886U Pending JPS6361162U (en) | 1986-10-08 | 1986-10-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6361162U (en) |
-
1986
- 1986-10-08 JP JP15376886U patent/JPS6361162U/ja active Pending
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