JPS6361132U - - Google Patents
Info
- Publication number
- JPS6361132U JPS6361132U JP15588986U JP15588986U JPS6361132U JP S6361132 U JPS6361132 U JP S6361132U JP 15588986 U JP15588986 U JP 15588986U JP 15588986 U JP15588986 U JP 15588986U JP S6361132 U JPS6361132 U JP S6361132U
- Authority
- JP
- Japan
- Prior art keywords
- templates
- sealing
- plate
- parting surfaces
- cavity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007789 sealing Methods 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15588986U JPH0648842Y2 (ja) | 1986-10-09 | 1986-10-09 | 半導体装置の樹脂封止装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15588986U JPH0648842Y2 (ja) | 1986-10-09 | 1986-10-09 | 半導体装置の樹脂封止装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6361132U true JPS6361132U (enExample) | 1988-04-22 |
| JPH0648842Y2 JPH0648842Y2 (ja) | 1994-12-12 |
Family
ID=31076999
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15588986U Expired - Lifetime JPH0648842Y2 (ja) | 1986-10-09 | 1986-10-09 | 半導体装置の樹脂封止装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0648842Y2 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04350949A (ja) * | 1991-05-28 | 1992-12-04 | Toowa Kk | 電子部品の樹脂封止成形装置 |
-
1986
- 1986-10-09 JP JP15588986U patent/JPH0648842Y2/ja not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04350949A (ja) * | 1991-05-28 | 1992-12-04 | Toowa Kk | 電子部品の樹脂封止成形装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0648842Y2 (ja) | 1994-12-12 |