JPS6359098B2 - - Google Patents

Info

Publication number
JPS6359098B2
JPS6359098B2 JP58156579A JP15657983A JPS6359098B2 JP S6359098 B2 JPS6359098 B2 JP S6359098B2 JP 58156579 A JP58156579 A JP 58156579A JP 15657983 A JP15657983 A JP 15657983A JP S6359098 B2 JPS6359098 B2 JP S6359098B2
Authority
JP
Japan
Prior art keywords
plate
test piece
width
shaped test
shaped
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP58156579A
Other languages
Japanese (ja)
Other versions
JPS6047942A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP15657983A priority Critical patent/JPS6047942A/en
Publication of JPS6047942A publication Critical patent/JPS6047942A/en
Publication of JPS6359098B2 publication Critical patent/JPS6359098B2/ja
Granted legal-status Critical Current

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Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N3/00Investigating strength properties of solid materials by application of mechanical stress
    • G01N3/08Investigating strength properties of solid materials by application of mechanical stress by applying steady tensile or compressive forces

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  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Strength Of Materials By Application Of Mechanical Stress (AREA)

Description

【発明の詳細な説明】 本発明は、固定側チヤツクと可動側チヤツクと
の間に板状試験片を架設して試験する材料引張試
験装置に関する。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a material tensile testing device for testing by installing a plate-shaped test piece between a stationary chuck and a movable chuck.

鋼板等の板状材料を引張試験する場合、引張開
始から破断に至るまでの荷重と伸びとの関係は、
従来周知の引張試験装置で容易に数値あるいは線
図として求めることができる。
When tensile testing a plate material such as a steel plate, the relationship between load and elongation from the start of tension to breakage is as follows:
It can be easily determined as a numerical value or a diagram using a conventionally well-known tensile test device.

しかしながら、鋼板等では、プレス成形性等の
ために深絞り性を評価するとともに破断時の状態
を正確に把握して材料の品質を評価する必要があ
り、前者を評価するパラメータとしてr値、n値
が多く用いられる。
However, in the case of steel plates, etc., it is necessary to evaluate the deep drawability for press formability, etc., and to evaluate the quality of the material by accurately understanding the state at break, and the parameters used to evaluate the former are r value, n Values are often used.

r値とは、塑性歪比と呼ばれているものであ
り、r=εw/εtで定義され、塑性変形中体積一
定の条件を用いれば、 r=−εw/εl+εw εw:体積歪 εl:板長歪 εt:板厚歪 で表わすことができ、測定精度を上げにくい板厚
によることなく板巾と標点距離によりr値を求め
ることができる。
The r value is called the plastic strain ratio, and is defined as r=εw/εt. Using the condition of constant volume during plastic deformation, r=-εw/εl+εw εw: Volumetric strain εl: Plate Long strain εt: Can be expressed as plate thickness strain, and the r value can be determined from the plate width and gauge length without depending on the plate thickness, which makes it difficult to improve measurement accuracy.

第1図に示すように、板状試験片Aはそのほぼ
中央部で破断するのが正常であつて、もし偏つて
破断したような場合は材質不良と判断される。
As shown in FIG. 1, it is normal for the plate-shaped test piece A to break approximately at the center, and if it breaks unevenly, it is determined that the material is defective.

従来の材料引張試験装置では、r値等各種特性
値を算出するために必要な板状試験片Aの寸法を
測定する装置を備えていないので、試験の途中で
板状試験片Aを外してマイクロメータで巾測定を
したり、第2図に示すように、接触式巾計1の接
触子11で板状試験片Aを挾むように手でセツト
して測定したりしていた。
Conventional material tensile testing equipment does not have a device to measure the dimensions of the plate-shaped test piece A, which is necessary to calculate various characteristic values such as the r value, so the plate-shaped test piece A is removed during the test. The width was measured using a micrometer, or by manually setting the plate-shaped test piece A between the contacts 11 of the contact width meter 1 as shown in FIG.

また、板状試験片Aの破断時の様子は人が視認
して判定していた。
Moreover, the appearance of the plate-shaped test piece A at the time of breakage was determined visually by a person.

しかしながら、このような従来の材料試験装置
では、各種測定が極めて煩雑であり、大量の板状
試験片Aを処理しなければならないような場合
は、試験時間および工数がかさみ、能率が悪く、
コストも高くなるという問題点があつた。
However, with such conventional material testing equipment, various measurements are extremely complicated, and when a large number of plate-shaped test pieces A have to be processed, testing time and man-hours increase, resulting in poor efficiency.
The problem was that the cost was also high.

本発明は、このような従来の問題点に着目して
なされたもので、試験中に光線を板状試験片に走
査して各種寸法を測定して各種の引張特性値の検
出を自動的にできるようにした材料試験装置を提
供することを目的としている。
The present invention was made by focusing on such conventional problems, and it automatically scans a light beam onto a plate-shaped test piece during a test to measure various dimensions and automatically detect various tensile property values. The purpose is to provide a material testing device that enables

かかる目的を達成するため、本発明において
は、板状試験片の標点間隔の推移により板状試験
片の伸びを測定する伸び計を備えるとともに、板
状試験片に引つ張り荷重を加える試験装置本体を
設け、板状試験片を間にして板状試験片の板面方
向で相対するとともに、制御されて上下に移動可
能に支持された入射ミラーおよび受光ミラーと、
該入射ミラーに光線を入射するとともに該入射ミ
ラーで反射された光線を板状試験片の板面に照射
しその巾方向に往復して振りながら長手方向に変
位させる走査部と、板状試験片の位置を通過して
から前記受光ミラーで反射された光線を受け、前
記試験装置本体が板状試験片へ荷重をかけていて
板状試験片が破断していないとき、前記走査部に
より走査された光線の遮断時間でその板巾のみを
検出する通常測定モードと、板状試験片が破断し
て引つ張り荷重をかけることができなくなつたと
き、前記走査された光線が破断溝の両側では遮断
されるが破断溝は通過することで、破断溝巾をも
加えて板巾を検出するとともに、板状試験片の長
手方向の光線の変位位置で破断位置を検出する破
断測定モードとを有する受光部とより成る板巾測
定装置を設けたことを特徴とする材料引張試験装
置とし、板巾測定装置により、板巾を自動的に測
定し、これにより各種特性値を速やかに検出する
とともに、破断状態も自動的に判定できるように
したものである。
In order to achieve such an objective, the present invention includes an extensometer that measures the elongation of a plate-shaped test piece based on changes in the gauge interval of the plate-shaped test piece, and a test in which a tensile load is applied to the plate-shaped test piece. A device main body is provided, and an entrance mirror and a light receiving mirror are opposed to each other in the direction of the plate surface of the plate-shaped test piece with a plate-shaped test piece in between, and are supported so as to be able to move up and down in a controlled manner;
a scanning unit that makes a light beam incident on the incident mirror and irradiates the plate surface of the plate-shaped test piece with the light beam reflected by the incident mirror, and displaces the plate-shaped test piece in the longitudinal direction while swinging back and forth in the width direction; When the test device main body applies a load to the plate-shaped test piece and the plate-shaped test piece is not broken, the light beam is reflected by the light-receiving mirror after passing through the position of , and is scanned by the scanning unit. In the normal measurement mode, only the width of the plate is detected by the interruption time of the light beam, and when the plate-shaped test piece breaks and it is no longer possible to apply a tensile load, the scanned light beam detects the width of the plate on both sides of the fracture groove. However, by passing through the fracture groove, the width of the plate is detected by adding the width of the fracture groove, and the fracture measurement mode detects the fracture position based on the displacement position of the light beam in the longitudinal direction of the plate-shaped specimen. A material tensile testing device is characterized in that it is equipped with a board width measuring device consisting of a light-receiving section, and the board width measuring device automatically measures the board width, thereby quickly detecting various characteristic values. , the fracture state can also be automatically determined.

以下、図面に基づき本発明の一実施例を説明す
る。
Hereinafter, one embodiment of the present invention will be described based on the drawings.

第3図〜第5図は本発明の一実施例に係る材料
引張試験装置を一部省略して示したものである。
3 to 5 show a material tensile testing apparatus according to an embodiment of the present invention, with some parts omitted.

板状試験片Aに荷重をかけて引つ張る試験装置
本体2は、荷重負荷用の駆動機構および駆動制御
機構を内蔵した本体ベース21から支柱22,2
2立設され、支柱22,22の上部に固定チヤツ
ク23が固設支持され、夫々の支柱22の内部に
駆動ねじ棒24が設けられ、駆動ねじ棒24の回
転により上下動する可動チヤツク25が固定チヤ
ツク23の下方に設けられており、固定チヤツク
23には固定側チヤツク刃26設けられ、可動チ
ヤツク25には可動側チヤツク刃27が設けられ
ている。
The test device main body 2 that applies a load to and pulls the plate-shaped test piece A is connected from a main body base 21 that has a built-in drive mechanism and drive control mechanism for applying a load to struts 22, 2.
A fixed chuck 23 is fixedly supported on the upper part of the pillars 22, 22, a driving threaded rod 24 is provided inside each pillar 22, and a movable chuck 25 moves up and down by the rotation of the driving threaded rod 24. The chuck 23 is provided below the fixed chuck 23, and the fixed chuck 23 is provided with a fixed chuck blade 26, and the movable chuck 25 is provided with a movable chuck blade 27.

板巾測定装置支持ベース3が、支持脚31を試
験装置本体2の本体ベース21にまたがせるよう
にして配設され、板巾測定装置支持ベース3の支
持梁32に板巾測定装置4が設けられている。
The board width measuring device support base 3 is arranged so that the support legs 31 straddle the main body base 21 of the testing device main body 2, and the board width measuring device 4 is mounted on the support beam 32 of the board width measuring device support base 3. It is provided.

板巾測定装置4はその移動ベース5可動チヤツ
ク25に隣接して設けられ、移動ベース5はガイ
ドシリンダ51,51を介して板巾測定装置支持
ベース3の支持梁32に上下動移動可能に支持さ
れ、支持梁32に固着された上下駆動シリンダ5
2の駆動ロツド53の先端54が移動ベース5に
連結されている。
The board width measuring device 4 is provided adjacent to the movable chuck 25 of its movable base 5, and the movable base 5 is supported via guide cylinders 51, 51 on the support beam 32 of the board width measuring device support base 3 so as to be movable up and down. and a vertical drive cylinder 5 fixed to the support beam 32.
The tip end 54 of the second drive rod 53 is connected to the movable base 5.

移動ベース5の一方の端部には走査部6が固設
され、他方の端部には受光部7が固設され、走査
部8および受光部7は移動ベース5から固定チヤ
ツク23と可動チヤツク25との間に延ばされ、
走査部6の先端には入射ミラー61が延設され、
受光部7の先端には受光ミラー71が延設されて
いる。
A scanning section 6 is fixed to one end of the movable base 5, and a light receiving section 7 is fixed to the other end. extended between 25 and
An entrance mirror 61 is extended at the tip of the scanning unit 6.
A light-receiving mirror 71 extends from the tip of the light-receiving section 7 .

走査部6は光線の一種であるレーザー光Lを入
射ミラー61に入射するとともに入射ミラー61
で反射されたレーザー光Lを板状試験片Aの板面
に照射し、板状試験片Aの巾方向に往復して振り
ながら長手方向に変位させるものであり、受光部
7は板状試験片Aの位置を通過して受光ミラー7
1で反射されたレーザー光Lを受けて解析するも
のである。
The scanning unit 6 inputs a laser beam L, which is a type of light beam, into an input mirror 61 and
The laser beam L reflected by the plate-shaped test piece A is irradiated onto the plate surface of the plate-shaped test piece A, and the plate-shaped test piece A is moved back and forth in the width direction and displaced in the longitudinal direction. Passing through the position of piece A, the light receiving mirror 7
The laser beam L reflected by the laser beam L is received and analyzed.

入射ミラー61と受光ミラー71とは固定チヤ
ツク23の固定側チヤツク刃26と可動チヤツク
25の可動側チヤツク刃27とに挾まれてその間
に取り付けられるべき板状試験片Aを間にして相
対しており、入射ミラー61は走査部6から入射
したレーザー光Lを板状試験片Aの板面に反射す
る位置に所定の角度で設けられ、受光ミラー71
は入射ミラー61で反射されたレーザー光Lが板
状試験片Aの位置を通過した後に達する位置に、
レーザー光Lを受けて受光部7に反射する角度に
して設けられている。
The entrance mirror 61 and the light receiving mirror 71 are sandwiched between the fixed chuck blade 26 of the fixed chuck 23 and the movable chuck blade 27 of the movable chuck 25, and face each other with the plate-shaped test piece A to be attached between them. The incident mirror 61 is provided at a predetermined angle at a position where the laser beam L incident from the scanning section 6 is reflected onto the plate surface of the plate-shaped test piece A.
is the position where the laser beam L reflected by the incident mirror 61 reaches after passing through the position of the plate-shaped test piece A,
It is provided at an angle to receive the laser beam L and reflect it to the light receiving section 7.

また、試験装置本体2には板状試験片Aの伸び
を測定する伸び計8が備えられており、板状試験
片A、に向けて進退する進退バー81の先端の上
下に夫々一対の挾持アーム82,82が設けら
れ、各挾持アーム82の先には把持子83,83
が取り付けられ、上下に夫々一対ある把持子8
3,83により上下の標点を把持するようになつ
ていて、板状試験片Aの交換時には邪魔にならな
いよう把持子83,83が開くとともに挾持アー
ム82が引込むようになつている。
In addition, the test device main body 2 is equipped with an extensometer 8 for measuring the elongation of the plate-shaped test piece A, and a pair of clamps are placed at the top and bottom of the tip of a reciprocating bar 81 that advances and retreats toward the plate-shaped test piece A. Arms 82, 82 are provided, and grippers 83, 83 are provided at the tip of each clamping arm 82.
is attached, and there are a pair of grippers 8 on the upper and lower sides.
3 and 83 are adapted to grip the upper and lower gauge points, and when the plate-shaped test piece A is replaced, the grippers 83 and 83 are opened and the clamping arm 82 is retracted so as not to get in the way.

第6図に示すように、固定側チヤツク刃26と
可動側チヤツク刃27とに両端が夫々挾持されて
固定チヤツク23と可動チヤツク25との間に架
設された板状試験片Aは、引張荷重が加えられて
初期状態(a)、10%伸び状態(b)、15%伸び状態(c)、
20%伸び状態(d)、破断状態(e)と伸ばされる。この
実施例では、初期状態(a)において、両端の把持端
A1の巾が35mm、中間の測定部A2は巾が25mm、
長さが略90mmに設定され、測定部A2の長さを等
分した中心線A3から両側に25mmづつ振り分けた
区間の50mmを測定区間とし、測定区間の両端が延
びを測定するため伸び計8の把持子83,83に
より把持され、把持子83,83とともに間隔が
広がる標点A4,A4をなしている。
As shown in FIG. 6, the plate-shaped test piece A, which is held between the fixed chuck blade 26 and the movable chuck blade 27 at both ends and is installed between the fixed chuck 23 and the movable chuck 25, is subjected to a tensile load. is added to the initial state (a), 10% elongated state (b), 15% elongated state (c),
It is stretched to 20% elongation state (d) and fractured state (e). In this example, in the initial state (a), the width of the gripping ends A1 at both ends is 35 mm, the width of the middle measurement part A2 is 25 mm,
The length is set to approximately 90 mm, and the measurement section is a 50 mm section divided by 25 mm on both sides from the center line A3, which equally divides the length of the measurement section A2, and the extensometer 8 is used at both ends of the measurement section to measure the extension. It is gripped by grippers 83, 83, and together with the grippers 83, 83, it forms gauge points A4, A4 with a widening interval.

第7図に示すように、板状試験片Aが破断した
場合、破断溝A5が中心線A3から振り分けて測
定区間の1/4以内(両側に各々12.5mm、合計25mm
以内)にあるときは正常な破断であるA破断と判
定し、それ以外のときは異常な破断であるB破断
と判定する。また、板巾測定装置4のレーザー光
Lは一点鎖線に示すように板状試験片Aの板面に
照射して巾方向に走査され、板面に当つたレーザ
ー光Lは通過できないので、板状試験片Aの両側
端を通過したレーザー光Lを受光部7が受けて板
状試験片Aの巾を測定できるものである。そし
て、板状試験片Aの破断の有無は試験装置本体2
の荷重の状態で知ることができ、板巾測定装置4
の受光部7は板状試験片Aが破断していないとき
は、板巾wのみを検出する通常巾測定モードで作
動し、板状試験片Aが破断したときは、光線を通
過させる破断溝巾sに、光線を通過させない破断
溝巾sの両側にあらわれる板巾w1,w2を合計
したものを検出する破断測定モードで作動する。
As shown in Figure 7, when the plate-shaped test piece A breaks, the break groove A5 is within 1/4 of the measurement section distributed from the center line A3 (12.5 mm on each side, 25 mm in total).
(within), the fracture is determined to be A fracture, which is a normal fracture, and otherwise, it is determined to be a B fracture, which is an abnormal fracture. In addition, the laser beam L of the plate width measuring device 4 is irradiated onto the plate surface of the plate-shaped specimen A and scanned in the width direction as shown by the dashed line, and the laser beam L that has hit the plate surface cannot pass through the plate. The width of the plate-shaped specimen A can be measured by receiving the laser beam L that has passed through both ends of the plate-shaped specimen A by the light receiving section 7. The presence or absence of breakage of the plate-shaped test piece A is determined by the testing device main body 2.
It can be determined from the load condition of board width measuring device 4.
When the plate-shaped test piece A is not broken, the light-receiving unit 7 operates in the normal width measurement mode that detects only the plate width w, and when the plate-shaped test piece A is broken, it operates in the normal width measurement mode that detects the width w of the plate, and when the plate-shaped test piece A is broken, it detects the fracture groove through which the light beam passes. It operates in a fracture measurement mode that detects the sum of the width s and the widths w1 and w2 appearing on both sides of the fracture groove width s that does not allow light to pass through.

次に作用を説明する。 Next, the effect will be explained.

まず、板状試験片Aをセツトする。板状試験片
Aは例えばマニピユレータ等で自動的に固定チヤ
ツク23と可動チヤツク25との間に供給され、
その両端の把持端A1が固定側チヤツク刃26と
可動側チヤツク刃27とに夫々挾持され、測定区
間の両側の中心線A3を伸び計8の把持子83,
83が夫々挾持して初期状態が定まる。このとき
板巾測定装置4は通常測定モードにされている。
First, a plate-shaped test piece A is set. The plate-shaped test piece A is automatically supplied between the fixed chuck 23 and the movable chuck 25 using, for example, a manipulator,
The gripping ends A1 at both ends thereof are clamped by the fixed chuck blade 26 and the movable chuck blade 27, respectively, and the gripper 83 of the extensometer 8,
83 are held together to determine the initial state. At this time, the board width measuring device 4 is in the normal measurement mode.

試験装置本体2を駆動して駆動ねじ棒24を回
動させ、可動チヤツク25を下降させると板状試
験片Aは次第に伸び、試験装置本体2により荷重
の推移が記録される。
When the testing device main body 2 is driven to rotate the driving threaded rod 24 and the movable chuck 25 is lowered, the plate-shaped test piece A gradually stretches, and the test device main body 2 records the change in load.

板状試験片Aが破断に至るまでの板巾測定装置
4の動作を第8図により説明すれば、板巾測定装
置4は伸び計8による板状試験片Aの伸び状態を
ステツプ1により常に監視しており、その設定伸
びは例えば前記のように10%、15%、20%に設定
されている。板状試験片Aが10%伸びとステツプ
2により上下駆動シリンダ52の駆動ロツド53
が作動して板巾測定装置4が下降し、板状試験片
Aの測定部A2の略中央部にレーザー光Lが照射
する位置になる。
The operation of the plate width measuring device 4 until the plate-like test piece A breaks is explained with reference to FIG. For example, the growth rate is set to 10%, 15%, and 20% as mentioned above. The plate-shaped test piece A is elongated by 10% and the drive rod 53 of the vertical drive cylinder 52 is
is activated, the plate width measuring device 4 is lowered, and reaches a position where the laser beam L is irradiated approximately at the center of the measurement portion A2 of the plate-shaped test piece A.

そこで板巾測定装置4の走査部6からレーザー
光Lを発射するとともに入射ミラー61を介して
レーザー光Lを板状試験片Aの板巾方向に振り、
同時に板巾測定装置4を下降させれば、レーザー
光Lは第7図に示すように板状試験片Aの板面に
沿つて走査する。レーザー光Lは板状試験片Aの
位置を通過してから受光ミラー71に反射された
受光部7に入り、そこで解析されて板巾が自動的
に求められる。
Therefore, a laser beam L is emitted from the scanning unit 6 of the plate width measuring device 4, and the laser beam L is swung in the width direction of the plate-shaped test piece A through the incident mirror 61.
When the width measuring device 4 is lowered at the same time, the laser beam L scans along the surface of the plate-shaped test piece A as shown in FIG. After passing through the position of the plate-shaped test piece A, the laser beam L enters the light-receiving section 7 where it is reflected by the light-receiving mirror 71, where it is analyzed and the plate width is automatically determined.

ステツプ3〜5に示すように板巾測定装置4は
板状試験片Aの測定部A2の中心線A3を中心と
して25mm測定してその平均値を算出して板巾wと
する。その後板巾測定装置4はステツプ6〜8に
より上昇して復帰する。さらに、ステツプ9に示
すように前記算出した板巾wを用いて前述したr
値を計算する。なお、ステツプ9ではr値の外に
n値等のパラメータを算出することが可能であ
る。
As shown in steps 3 to 5, the board width measuring device 4 measures 25 mm around the center line A3 of the measuring portion A2 of the plate-shaped test piece A, calculates the average value, and uses the measured value as the board width w. Thereafter, the board width measuring device 4 is raised and returned to its original position in steps 6 to 8. Furthermore, as shown in step 9, the above-mentioned r
Calculate the value. Note that in step 9, it is possible to calculate parameters such as the n value in addition to the r value.

上記のように、板状試験片Aが破断に至るま
で、板巾測定装置4は通常巾測定モードで作動
し、さらに、15%、20%の伸び状態でも同様に板
巾wおよび各種パラメータを算出する。
As mentioned above, the plate width measuring device 4 operates in the normal width measurement mode until the plate-shaped specimen A breaks, and further measures the plate width w and various parameters in the same way even in the elongated state of 15% and 20%. calculate.

第9図により板状試験片Aが破断した場合にお
ける板巾測定装置4の作動を説明する。
The operation of the plate width measuring device 4 when the plate-shaped test piece A breaks will be explained with reference to FIG.

第9図におけるステツプ1は第8図のステツプ
1に相当するもので、板状試験片Aの破断を検知
すると板巾測定装置4はステツプ2により破断測
定モードに切り換わる。そこでステツプ3により
板巾測定装置4が下降し、前記第8図によるもの
と同様にレーザー光Lが板状試験片Aの板面を走
査するのであるが、破断時においては、破断位置
が問題であり、前記のように板状試験片Aの測定
部A2の中心線A3から所定の区間内で破断して
いなければB破断と判定しなければならない。
Step 1 in FIG. 9 corresponds to step 1 in FIG. 8, and when a break in the plate-shaped test piece A is detected, the board width measuring device 4 switches to the break measurement mode in step 2. Then, in step 3, the plate width measuring device 4 is lowered, and the laser beam L scans the plate surface of the plate-shaped test piece A in the same manner as shown in FIG. As mentioned above, if the fracture does not occur within a predetermined section from the center line A3 of the measurement portion A2 of the plate-shaped test piece A, it must be determined as a B fracture.

そこで板巾測定装置4は前記所定の区間内をレ
ーザー光Lが走査するように下降移動するものと
し、破断溝A5の有無は受光部7で受けたレーザ
ー光Lのパターンにより検知する。すなわち、通
常巾測定モードであれば微小な破断溝巾sは生じ
ないのでレーザー光Lのパターンは単純である
が、破断測定モードでは、破断溝巾sと板巾W
1,W2と交互に生じるパターンとなるので、こ
のパターンをあらかじめ予定しておくことで破断
後のこれら破断溝巾sと板巾W1,W2を知るこ
とができる。また、このパターンが予想外のもの
であつた場合は異常破断ということになる。これ
が第9図のステツプ4であり、さらにステツプ5
〜7を加え、板巾wは板巾w1+破断溝A5+板
巾w2であらわされ、測定区間内での最低値が巾
データとして登録される。
Therefore, the board width measuring device 4 is moved downward so that the laser beam L scans within the predetermined section, and the presence or absence of the fracture groove A5 is detected by the pattern of the laser beam L received by the light receiving section 7. That is, in the normal width measurement mode, the minute fracture groove width s does not occur, so the pattern of the laser beam L is simple, but in the fracture measurement mode, the fracture groove width s and the board width W
1 and W2 occur alternately, so by planning this pattern in advance, it is possible to know the fracture groove width s and the board widths W1 and W2 after fracture. Moreover, if this pattern is unexpected, it will be an abnormal breakage. This is step 4 in Figure 9, and further step 5.
7 is added, and the board width w is represented by board width w1+rupture groove A5+board width w2, and the lowest value within the measurement section is registered as width data.

測定区間内での測定が終るとステツプ8により
板巾測定装置4は停止し、ステツプ9により通常
巾測定モードに切換わり、ステツプ10〜12により
待機位置に復帰する。
When the measurement within the measurement section is completed, the board width measuring device 4 is stopped in step 8, switched to the normal width measurement mode in step 9, and returned to the standby position in steps 10 to 12.

その後、ステツプ13ではステツプ6に巾データ
が登録されているかどうか判断し、登録されてい
ればステツプ14によりその巾データを最終的なデ
ータとして認めて各種パラメータの算出に利用す
るとともにA破断と判定する。もし登録されてい
なければ、板状試験片Aの破断溝A5が測定区間
内になかつたことになるので、ステツプ15により
B破断と判定する。
After that, in step 13, it is determined whether the width data has been registered in step 6, and if it has been registered, in step 14, the width data is recognized as final data and used for calculating various parameters, and it is determined that the A fracture has occurred. do. If it is not registered, it means that the fracture groove A5 of the plate-shaped test piece A has not been formed within the measurement area, and therefore, in step 15, it is determined that the fracture is B.

ここで一つの板状試験片Aの試験は終了し、セ
ツトされていた板状試験片Aを取り外してから次
の板状試験片Aを前記のようにセツトして次の試
験を行う。
At this point, the test on one plate-shaped test piece A is completed, and after removing the set plate-shaped test piece A, the next plate-shaped test piece A is set as described above and the next test is performed.

本発明に係る材料引張試験装置によれば、板状
試験片の板巾を人手を要することなく自動的に得
ることができ、試験装置本体の有する機能を加え
て板状試験片の試験に際し、各種特性値を極めて
容易に求めることができるようになり、試験能率
が著しく向上し、特に大量の板状試験片を処理す
るときに威力を発揮する。
According to the material tensile testing device according to the present invention, the width of the plate-shaped test piece can be automatically obtained without requiring any manual labor, and by adding the functions of the test device main body, when testing the plate-shaped test piece, It is now possible to obtain various characteristic values extremely easily, significantly improving testing efficiency, and is especially effective when processing a large number of plate-shaped test pieces.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は板状試験片の破断状態を示す正面図、
第2図は従来の板巾の測定状態を示す板状試験片
の正面図、第3図〜第5図は本発明の一実施例に
係る材料引張試験装置を一部省略して示したもの
で、第3図は正面図、第4図は板巾測定装置を第
3図より拡大して示した正面図、第5図は同じく
平面図、第6図は板状試験片の伸び状態を順に示
した正面図、第7図は板状試験片の破断位置を第
6図より拡大して示した正面図、第8図および第
9図は作用説明のための流れ図であつて、第8図
は板状試験片が破断に至るまで、第9図は破断時
を示している。 A……板状試験片、L……レーザー光、2……
試験装置本体、23……固定チヤツク、25……
可動チヤツク、3……板巾測定装置支持ベース、
32……支持梁、4……板巾測定装置、5……移
動ベース、6……走査部、61……入射ミラー、
7……受光部、71……受光ミラー、8……伸び
計。
Figure 1 is a front view showing the fractured state of a plate-shaped test piece;
Fig. 2 is a front view of a plate-shaped test piece showing a conventional measurement state of plate width, and Figs. 3 to 5 show a material tensile test device according to an embodiment of the present invention with some parts omitted. Figure 3 is a front view, Figure 4 is a front view of the board width measuring device enlarged from Figure 3, Figure 5 is a plan view, and Figure 6 shows the state of elongation of the plate-shaped test piece. 7 is a front view showing the fracture position of the plate-shaped test piece enlarged from FIG. 6, and FIGS. 8 and 9 are flowcharts for explaining the operation. The figure shows the plate-shaped test piece until it breaks, and FIG. 9 shows the time at which it breaks. A...Plate test piece, L...Laser light, 2...
Test device main body, 23... fixed chuck, 25...
Movable chuck, 3... Board width measuring device support base,
32... Support beam, 4... Board width measuring device, 5... Moving base, 6... Scanning section, 61... Incoming mirror,
7... Light receiving section, 71... Light receiving mirror, 8... Extensometer.

Claims (1)

【特許請求の範囲】 1 固定側クロスヘツドと可動側クロスヘツドと
の間に板状試験片を架設して試験する材料引張試
験装置において、 板状試験片の標点間隔の推移により板状試験片
の伸びを測定する伸び計を備えるとともに、板状
試験片に引つ張り荷重を加える試験装置本体を設
け、 板状試験片を間にして板状試験片の板面方向で
相対するとともに、制御されて上下に移動可能に
支持された入射ミラーおよび受光ミラーと、 前記入射ミラーに光線を入射するとともに該入
射ミラーで反射された光線を板状試験片の板面に
照射しその巾方向に往復して振りながら長手方向
に変位させる走査部と、 板状試験片の位置を通過してから前記受光ミラ
ーで反射された光線を受け、前記試験装置本体が
板状試験片へ荷重をかけていて板状試験片が破断
していないとき、前記走査部により走査された光
線の遮断時間でその板巾のみを検出する通常測定
モードと、板状試験片が破断して引つ張り荷重を
かけることができなくなつたとき、前記走査され
た光線が破断溝の両側では遮断されるが破断溝は
通過することで、破断溝巾をも加えて板巾を検出
するとともに、板状試験片の長手方向の光線の変
位位置で破断位置を検出する破断測定モードとを
有する受光部とを具備した板巾測定装置を設けた
ことを特徴とする材料引張試験装置。
[Scope of Claims] 1. In a material tensile testing device in which a plate-shaped test piece is installed between a fixed side crosshead and a movable side crosshead for testing, the plate-shaped test piece is In addition to being equipped with an extensometer to measure elongation, the main body of the test device applies a tensile load to the plate-shaped test piece. An incident mirror and a light receiving mirror are supported so as to be movable up and down, and a beam is incident on the incident mirror, and the beam reflected by the incident mirror is irradiated onto the plate surface of a plate-shaped specimen and reciprocated in the width direction. a scanning unit that displaces the plate-shaped test piece in the longitudinal direction while shaking it; There is a normal measurement mode in which only the plate width is detected by the interruption time of the light beam scanned by the scanning section when the plate-shaped specimen is not broken, and a normal measurement mode in which only the plate width is detected when the plate-shaped specimen is broken and a tensile load is applied. When this happens, the scanned light beam is blocked on both sides of the fracture groove, but passes through the fracture groove, and the width of the plate is detected by adding the fracture groove width. What is claimed is: 1. A material tensile testing device comprising a board width measuring device having a light receiving section having a break measurement mode for detecting a break position based on the displacement position of a light beam.
JP15657983A 1983-08-26 1983-08-26 Material tensile testing equipment Granted JPS6047942A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15657983A JPS6047942A (en) 1983-08-26 1983-08-26 Material tensile testing equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15657983A JPS6047942A (en) 1983-08-26 1983-08-26 Material tensile testing equipment

Publications (2)

Publication Number Publication Date
JPS6047942A JPS6047942A (en) 1985-03-15
JPS6359098B2 true JPS6359098B2 (en) 1988-11-17

Family

ID=15630845

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15657983A Granted JPS6047942A (en) 1983-08-26 1983-08-26 Material tensile testing equipment

Country Status (1)

Country Link
JP (1) JPS6047942A (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10153729B4 (en) 2001-10-31 2013-09-12 Grob Textile Ag Supporting body for a weave
CN103884596B (en) * 2012-12-20 2016-05-11 国家核电技术有限公司 Workpiece tensile test apparatus

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5625251B2 (en) * 1977-01-20 1981-06-11

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5625251U (en) * 1979-08-03 1981-03-07
JPS6120517Y2 (en) * 1979-11-30 1986-06-20

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5625251B2 (en) * 1977-01-20 1981-06-11

Also Published As

Publication number Publication date
JPS6047942A (en) 1985-03-15

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