JPS6358674U - - Google Patents

Info

Publication number
JPS6358674U
JPS6358674U JP15241386U JP15241386U JPS6358674U JP S6358674 U JPS6358674 U JP S6358674U JP 15241386 U JP15241386 U JP 15241386U JP 15241386 U JP15241386 U JP 15241386U JP S6358674 U JPS6358674 U JP S6358674U
Authority
JP
Japan
Prior art keywords
sealing device
resin sealing
resin
ellipse
elongated shape
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15241386U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0536538Y2 (cg-RX-API-DMAC7.html
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986152413U priority Critical patent/JPH0536538Y2/ja
Publication of JPS6358674U publication Critical patent/JPS6358674U/ja
Application granted granted Critical
Publication of JPH0536538Y2 publication Critical patent/JPH0536538Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Coating Apparatus (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP1986152413U 1986-10-03 1986-10-03 Expired - Lifetime JPH0536538Y2 (cg-RX-API-DMAC7.html)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986152413U JPH0536538Y2 (cg-RX-API-DMAC7.html) 1986-10-03 1986-10-03

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986152413U JPH0536538Y2 (cg-RX-API-DMAC7.html) 1986-10-03 1986-10-03

Publications (2)

Publication Number Publication Date
JPS6358674U true JPS6358674U (cg-RX-API-DMAC7.html) 1988-04-19
JPH0536538Y2 JPH0536538Y2 (cg-RX-API-DMAC7.html) 1993-09-16

Family

ID=31070370

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986152413U Expired - Lifetime JPH0536538Y2 (cg-RX-API-DMAC7.html) 1986-10-03 1986-10-03

Country Status (1)

Country Link
JP (1) JPH0536538Y2 (cg-RX-API-DMAC7.html)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02121168U (cg-RX-API-DMAC7.html) * 1989-03-13 1990-10-01
JPH051242U (ja) * 1991-06-20 1993-01-08 富士通テン株式会社 粘性液体の供給装置
JP2010110737A (ja) * 2008-11-10 2010-05-20 Toshiba Corp 塗布装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56115650A (en) * 1980-02-15 1981-09-10 Aron Kasei Co Ltd Production of nozzle for injection of filler
JPS60171580U (ja) * 1984-04-20 1985-11-13 クラリオン株式会社 デイスペンサ−ニ−ドル塗布機
JPS6151974U (cg-RX-API-DMAC7.html) * 1984-09-12 1986-04-08

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56115650A (en) * 1980-02-15 1981-09-10 Aron Kasei Co Ltd Production of nozzle for injection of filler
JPS60171580U (ja) * 1984-04-20 1985-11-13 クラリオン株式会社 デイスペンサ−ニ−ドル塗布機
JPS6151974U (cg-RX-API-DMAC7.html) * 1984-09-12 1986-04-08

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02121168U (cg-RX-API-DMAC7.html) * 1989-03-13 1990-10-01
JPH051242U (ja) * 1991-06-20 1993-01-08 富士通テン株式会社 粘性液体の供給装置
JP2010110737A (ja) * 2008-11-10 2010-05-20 Toshiba Corp 塗布装置

Also Published As

Publication number Publication date
JPH0536538Y2 (cg-RX-API-DMAC7.html) 1993-09-16

Similar Documents

Publication Publication Date Title
JPS6358674U (cg-RX-API-DMAC7.html)
JPS59143985U (ja) アイスクリ−ム容器
JPS6364046U (cg-RX-API-DMAC7.html)
JPH01127248U (cg-RX-API-DMAC7.html)
JPH0275745U (cg-RX-API-DMAC7.html)
JPS6268246U (cg-RX-API-DMAC7.html)
JPS61158953U (cg-RX-API-DMAC7.html)
JPS6390860U (cg-RX-API-DMAC7.html)
JPS6424848U (cg-RX-API-DMAC7.html)
JPH0410338U (cg-RX-API-DMAC7.html)
JPS59184952U (ja) 半導体チップの樹脂モールド用ノズル
JPH02122436U (cg-RX-API-DMAC7.html)
JPS61182036U (cg-RX-API-DMAC7.html)
JPS6042183U (ja) そうめん流し装置
JPS62188149U (cg-RX-API-DMAC7.html)
JPS59172151U (ja) 密封びん
JPS5878633U (ja) 樹脂溶解装置
JPS6273554U (cg-RX-API-DMAC7.html)
JPH01160854U (cg-RX-API-DMAC7.html)
JPS61129350U (cg-RX-API-DMAC7.html)
JPS6298237U (cg-RX-API-DMAC7.html)
JPS58194754U (ja) ポンプ注液式液体容器
JPS6387843U (cg-RX-API-DMAC7.html)
JPH0295249U (cg-RX-API-DMAC7.html)
JPS6327048U (cg-RX-API-DMAC7.html)