JPS6357215A - Equipment for molding synthetic resin - Google Patents
Equipment for molding synthetic resinInfo
- Publication number
- JPS6357215A JPS6357215A JP20247786A JP20247786A JPS6357215A JP S6357215 A JPS6357215 A JP S6357215A JP 20247786 A JP20247786 A JP 20247786A JP 20247786 A JP20247786 A JP 20247786A JP S6357215 A JPS6357215 A JP S6357215A
- Authority
- JP
- Japan
- Prior art keywords
- ejector pin
- mold
- upper mold
- base
- holding member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000465 moulding Methods 0.000 title claims description 12
- 229920003002 synthetic resin Polymers 0.000 title description 7
- 239000000057 synthetic resin Substances 0.000 title description 7
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 239000002994 raw material Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 238000001721 transfer moulding Methods 0.000 description 2
- 210000001015 abdomen Anatomy 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、複数個の合成樹脂製品を同時に成形するよう
にした成形装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a molding apparatus capable of molding a plurality of synthetic resin products simultaneously.
合成樹脂の成形装置における上型及び下型には、上型を
下型から後退したとき、成形品をその各々のキャビティ
ー内から押し出すためのエゼクターピンを設けているこ
とは周知の通りであり、従来のエゼクターピン付きトラ
ンスファ成形装置は、第６図に示すように構成している
。It is well known that the upper mold and lower mold in a synthetic resin molding device are provided with ejector pins for pushing out the molded product from the respective cavities when the upper mold is retreated from the lower mold. A conventional transfer molding apparatus with an ejector pin is constructed as shown in FIG.
すなわち、成形機の機台１に下型用ベース２を取付け、
この下型用ベース２の上面に、下型３を保持した下型用
チェイス４を取付ける一方、前記機台１に向って下降動
するようにしたヘソグー５に上型用ベース６を取付け、
該上型用ベース６の下面に、上型７を保持した上型用チ
ェイス８を取付け、ヘッダー５の下降動によって上型７
を下型３に押圧密着させた状態で、上型７の充填室９内
に供給した合成樹脂の原料タブレッ）１０を、充填室９
内へのプランジャ１１の圧入により、下型３と上型７と
の間に成形したキャビティー１２内に押し込んで、各キ
ャビティー１２で所定の形状に成形するようにし、且つ
、下型３及び上型７には、各キャビティー１２の箇所毎
にエゼクターピン１３．１４を各々設け、各下型用エゼ
クターピン１３を、下型用チェイス４及び下型用ベース
２を貫通して下型用ベース２の下面に突出することによ
って、エゼクターピン保持部材１５に支持させる一方、
各上型用エゼクターピン１４も、上型用チェイス８及び
上型用ベース６を貫通して上型用ベース６の上面に突出
することによって、エゼクターピン保持部材１６に支持
させた構成にし、そして、成形後において、上型７を下
型３から離れるように上昇したとき、各下型用エゼクタ
ーピン１３を、エゼクターピン作動部材１７にて一斉に
上昇動することによつて、成形品を下型３におけるキャ
ビティー１２から押し出すと同時に、各上型用エゼクタ
ーピン１４を、エゼクターピン作動部材１８にて一斉に
下降動することによって、成形品を上型７におけるキャ
ビティー１２から押し出すように構成している。That is, the lower mold base 2 is attached to the machine base 1 of the molding machine,
A lower die chase 4 holding the lower die 3 is attached to the upper surface of the lower die base 2, and an upper die base 6 is attached to the heel goo 5 which is configured to move downwardly toward the machine base 1.
An upper die chase 8 holding the upper die 7 is attached to the lower surface of the upper die base 6, and the upper die 7 is moved by the downward movement of the header 5.
The synthetic resin raw material tablet) 10 supplied into the filling chamber 9 of the upper mold 7 is pressed into contact with the lower mold 3.
By press-fitting the plunger 11 into the cavity 12 formed between the lower mold 3 and the upper mold 7, each cavity 12 is molded into a predetermined shape. The upper mold 7 is provided with ejector pins 13 and 14 at each location of each cavity 12, and each lower mold ejector pin 13 is inserted through the lower mold chase 4 and the lower mold base 2 to ejector pins 13 and 14 for the lower mold. By protruding from the lower surface of the base 2, it is supported by the ejector pin holding member 15, while
Each upper mold ejector pin 14 is also supported by the ejector pin holding member 16 by penetrating the upper mold chase 8 and the upper mold base 6 and protruding from the upper surface of the upper mold base 6. After molding, when the upper mold 7 is lifted away from the lower mold 3, the ejector pins 13 for each lower mold are moved upward simultaneously by the ejector pin actuating member 17, thereby lowering the molded product. At the same time as the molded product is pushed out from the cavity 12 in the mold 3, the ejector pins 14 for each upper mold are simultaneously moved downward by the ejector pin actuating member 18, so that the molded product is pushed out from the cavity 12 in the upper mold 7. are doing.
そして、成形品をキャビティー１２から押し出すための
下型用エゼクターピン１３及び上型用エゼクターピン１
４を配設する位置は、下型３及び上型７におけるキャビ
ティー１２の位置によって決るもので、下型３及び上型
７を別の成形品のための下型及び上型に交換することに
よって、キャビティーの位置が代わると、これに応じて
、エゼクターピンの設置位置も代える必要がある。A lower mold ejector pin 13 and an upper mold ejector pin 1 for extruding the molded product from the cavity 12 are provided.
4 is determined by the position of the cavity 12 in the lower mold 3 and upper mold 7, and the lower mold 3 and upper mold 7 can be replaced with lower molds and upper molds for different molded products. When the position of the cavity changes, the installation position of the ejector pin must also change accordingly.
然るに、前記従来のものは、下型用エゼクターピン１３
を、下型用チェイス４及び下型用ベース２に貫通させた
構成とすると共に、上型用エゼククーピン１４も、上型
用チェイス８及び上型用ベース６に貫通させた構成にし
ているので、下型３及び上型７を別の成形品のための下
型及び上型に交換する場合には、下型用チェイス４及び
上型用チェイス８に加えて、下型用ベース２及び上型用
ベース６をも交換するようにしなければならないのであ
る。However, in the conventional type, the lower mold ejector pin 13
is configured so that it passes through the lower die chase 4 and the lower die base 2, and the upper die Ezeku coupin 14 is also configured so that it passes through the upper die chase 8 and the upper die base 6. When replacing the lower mold 3 and upper mold 7 with lower molds and upper molds for different molded products, in addition to the chase 4 for the lower mold and the chase 8 for the upper mold, the base 2 for the lower mold and the upper mold Therefore, the base 6 must also be replaced.
つまり、従来のエゼククーピン付き成形装置では、下型
及び上型の交換に際して、これら下型及び上型の各々を
支持する大型のベースをも交換しなければならないから
、多大の手数と時間とを必要とするばかりか、部品の管
理も厄介であった。In other words, in the conventional molding device with an Ezeku coupin, when replacing the lower mold and upper mold, the large base that supports each of the lower mold and upper mold must also be replaced, which requires a great deal of effort and time. Not only that, but managing parts was also troublesome.
本発明は、下型及び上型の交換に際して、これら下型及
び上型の各々を支持するベースを交換する必要のないエ
ゼクターピン付き成形装置を提供するものである。The present invention provides a molding device with an ejector pin that eliminates the need to replace the bases that support the lower mold and upper mold when replacing the lower mold and the upper mold.
このため本発明は、下型用ベースの上面に取付く下型用
チェイスにて保持した下型と、上型用ベースの下面に取
付く上型用チェイスにて保持した上型とから成り、前記
下型に、成形品をキャビティー内から押し出すための下
型用エゼクターピンを、前記上型に、成形品をキャビテ
ィー内から押し出すための上型用エゼクターピンを各々
設けて成る成形装置において、前記下型用チェイスの下
面と下型用ベースの上面との間に空間部を形成して、該
空間部に、前記下型用ベースの下部に配設したエゼクタ
ーピン作動部材にて上下動されるエゼクターピン保持部
材を設けて、該エゼクターピン保持部材に前記下型用エ
ゼクターピンを連結する一方、前記上型用チェイスの上
面と上型用ベースの下面との間に空間部を形成して、該
空間部に、前記上型用ベースの上部に配設したエゼクタ
ーピン作動部材にて上下動されるエゼクターピン保持部
材を設けて、該エゼクターピン保持部材に前記上型用エ
ゼクターピンを連結した構成にしたものである。Therefore, the present invention consists of a lower mold held by a lower mold chaser attached to the upper surface of the lower mold base, and an upper mold held by an upper mold chaser attached to the lower surface of the upper mold base. In the molding device, the lower mold is provided with a lower mold ejector pin for extruding the molded product from inside the cavity, and the upper mold is provided with an upper mold ejector pin for extruding the molded product from the cavity. A space is formed between the lower surface of the lower die chase and the upper surface of the lower die base, and an ejector pin actuating member disposed at the lower part of the lower die base is moved up and down in the space. an ejector pin holding member is provided, and the lower mold ejector pin is connected to the ejector pin holding member, while a space is formed between the upper surface of the upper mold chaser and the lower surface of the upper mold base. An ejector pin holding member that is moved up and down by an ejector pin operating member disposed above the upper mold base is provided in the space, and the upper mold ejector pin is connected to the ejector pin holding member. This is the configuration that was used.
〔発明の作用・効果〕
このように構成すると、下型用エゼクターピンは下型用
チェイスのみを、上型用エゼクターピンは上型用チェイ
スのみを各々貫通させるだけ良いことになる。[Operations and Effects of the Invention] With this structure, it is sufficient that the ejector pin for the lower die only passes through the chase for the lower die, and the ejector pin for the upper die only passes through the chase for the upper die.
従って、下型及び上型を別の下型及び上型に交換するに
際しては、下型用チェイス及び上型用チェイスを交換す
るだけで良く、この下型用チェイス及び−上型用チェイ
スが取イ」＜下型用ヘース及び上型用ベースを交換する
必要がないから、下型及び上型を別の下型及び上型に交
換する手数を著しく軽減できると共に、部品の点数も少
なくできて、部品の管理を簡単化できる効果を有する。Therefore, when replacing the lower mold and upper mold with another lower mold and upper mold, it is only necessary to replace the lower mold chase and the upper mold chase. Since there is no need to replace the base for the lower mold and the base for the upper mold, it is possible to significantly reduce the labor involved in replacing the lower mold and upper mold with different lower molds and upper molds, and the number of parts can be reduced. This has the effect of simplifying the management of parts.
以下本発明の実施例を図面（第１図〜第５図）について
説明するに、図面はマルチ式のトランスファ成形装置を
示し、この成形装置は、機台１に取付く下型用ベース２
と、前記機台１に向って下降動するようにしたヘソグー
５に取付く上型ベース６を備え、前記下型用ベース２の
上面には、下型３を保持した下型チェイス４が、前記上
型ベース６の下面には、上型７を保持した上型チェイス
８が各々取付けられている。Embodiments of the present invention will be described below with reference to the drawings (FIGS. 1 to 5).
and an upper die base 6 attached to the belly button 5 which moves downwardly toward the machine base 1, and on the upper surface of the lower die base 2, a lower die chase 4 holding the lower die 3, Upper mold chases 8 holding upper molds 7 are attached to the lower surfaces of the upper mold bases 6, respectively.
前記下型３と上型７との合せ面には、第４図に示すよう
に例えば４個のキャビティー１２ａを一群とするキャビ
ティー群１２を複数群（例えば、４群）設け、上型７に
は、前記キャビティー群１２の箇所ごとに、熱硬化性合
成樹脂の原料タブレット１０の充填室９を設げて、この
各充填室９にプランジャ１１を各々挿入する一方、下型
３にば、前記充填室９に連通し、且つ、当該充填室９に
対応する複数のキャビティー１２２にランナー１９を介
して連通ずる分配室２０を、各充填室９の箇所ごとに設
ける。As shown in FIG. 4, a plurality of cavity groups 12 (for example, four groups) each having four cavities 12a are provided on the mating surface of the lower mold 3 and the upper mold 7, and the upper mold 7 is provided with a filling chamber 9 for the thermosetting synthetic resin raw material tablet 10 at each location in the cavity group 12, and the plunger 11 is inserted into each filling chamber 9, while the lower mold 3 is filled with a filling chamber 9. For example, a distribution chamber 20 communicating with the filling chamber 9 and communicating with a plurality of cavities 122 corresponding to the filling chamber 9 via a runner 19 is provided at each location of each filling chamber 9.
更に、前記下型３には、下型用エゼクターピン１３が、
前記各キャビティー１２８の箇所ごとに下型用チェイス
４に貫通して設けられ、また、前記上型７にも、上型用
エゼクターピン１４が、前記各キャビティー１２２の箇
所ごとに上型用チェイス８に貫通して設けられている。Further, the lower mold 3 has a lower mold ejector pin 13,
An ejector pin 14 for the upper mold is provided in each of the cavities 122 so as to penetrate through the chaser 4 for the lower mold. It is provided to penetrate the chase 8.
そして、前記下型用チェイス４の下面には、空間部２１
を形成しくなお、この空間部２１は、下型用ベース２の
上面に設けるようにしても良い）、この空間部２１内に
ばね２２にて下向きに付勢されたエゼクターピン保持部
材１５を上下動自在に挿入し、該エゼクターピン保持部
材１５に、前記各下型用エゼクターピン１３を各々連結
すると共に、このエゼクターピン保持部材１５の下面に
、下型用ベース２の下部に配設したエゼクターピン作動
部材１７から突出のロッド２３を接当させることにより
、エゼクターピン作動部材１７にて、各下型用エゼクタ
ーピン１３を下型３から一斉に突出させるように構成す
る。A space 21 is provided on the lower surface of the lower mold chaser 4.
However, this space 21 may be provided on the upper surface of the lower mold base 2), and the ejector pin holding member 15, which is biased downward by a spring 22, is moved up and down within this space 21. The lower mold ejector pins 13 are inserted into the ejector pin holding member 15 so as to be movable, and the ejector pins 13 are connected to the ejector pin holding member 15. By bringing the rods 23 protruding from the pin actuating member 17 into contact with each other, the ejector pin actuating member 17 is configured to cause the ejector pins 13 for each lower die to protrude all at once from the lower die 3.
また、前記上型用チェイス８の下面にも、空間部２４を
形成しくなお、この空間部２４は、上型用ベース６の下
面に設けるようにしても良い）、この空間部２３内にば
ね２５にて上向きに付勢されたエゼクターピン保持部材
１６を上下動自在に挿入し、該エゼクターピン保持部材
１６に、前記各上型用エゼクターピン１４を各々連結す
ると共に、このエゼクターピン保持部材１６の上面に、
上型用ベース６の上部に配設したエゼクターピン作動部
材１８から突出のロッド２６を接当させることにより、
エゼクターピン作動部材１８にて、各上型用エゼクター
ピン１４を上型７から一斉に突出させるように構成する
。Further, a space 24 is also formed on the lower surface of the upper mold chaser 8 (although this space 24 may be provided on the lower surface of the upper mold base 6), a spring is inserted into this space 23. At 25, the ejector pin holding member 16 urged upward is inserted so as to be vertically movable, and each of the ejector pins 14 for the upper die is connected to the ejector pin holding member 16, and the ejector pin holding member 16 on the top of the
By abutting the rod 26 protruding from the ejector pin operating member 18 disposed on the upper part of the upper mold base 6,
The ejector pin operating member 18 is configured to cause the respective upper mold ejector pins 14 to project from the upper mold 7 all at once.
このように構成すると、下型用エゼクターピン１３は下
型用チェイス４のみを、上型用エゼクターピン１４は上
型用チェイス８のみを各々貫通させるだけで良いことに
なるから、下型３及び上型７を別の下型及び上型に交換
するに際しては、下型用チェイス４及び上型用チェイス
８を交換するだけで良（、この下型用チェイス４及び上
型用チェイス８が取付く下型用ベース２及び上型用ベー
ス８までも交換する必要がないのである。With this configuration, the lower mold ejector pin 13 only needs to pass through the lower mold chaser 4, and the upper mold ejector pin 14 only needs to pass through the upper mold chaser 8, so that the lower mold 3 and When replacing the upper die 7 with another lower die and upper die, all you need to do is replace the chase 4 for the lower die and the chase 8 for the upper die. There is no need to replace even the lower mold base 2 and the upper mold base 8.
なお、前記実施例は、熱硬化性合成樹脂のトランスファ
成形装置の場合であったが、本発明は、これに限らず、
熱可塑性合成樹脂の射出成形装置にも適用できることは
言うまでもない。In addition, although the above embodiment was a case of a transfer molding apparatus for thermosetting synthetic resin, the present invention is not limited to this.
Needless to say, the invention can also be applied to injection molding equipment for thermoplastic synthetic resins.
第１図〜第５図は本発明の実施例を示し、第１図は縦断
正面図、第２図は第１図の要部拡大図、第３図は第２図
のｌ−１１１視断面図、第４図は第３図のＩＶ−ＩＶ視
平面図、第５図は作用状態を示し断面図、第６図は従来
の成形装置の縦断正面図である。
１・・・・機台、２・・・・下型用ベース、３・・・・
下型、４・・・・下型用チェイス、５・・・・ヘソグー
、６・・・・上型用ベース、７・・・・上型、８・・・
・上型用チェイス、９・・・・充填室、１ｏ・・・・原
料タブレット、１１・・・・プランジャ、Ｉ２・・・・
キャビティー群、１２ａ・・・・キャヒ７−イー、１３
・・・・下型用エゼククーヒン、１４・・・・上型用エ
ゼククーピン、１５゜１６・・・・エゼクターピン保持
部材、１７．１８・・・・エゼクターピン作動部材、２
１．２４・・・・空間部。1 to 5 show embodiments of the present invention, FIG. 1 is a longitudinal sectional front view, FIG. 2 is an enlarged view of the main part of FIG. 1, and FIG. 4 is a plan view taken along the line IV-IV in FIG. 3, FIG. 5 is a sectional view showing the operating state, and FIG. 6 is a longitudinal sectional front view of the conventional molding apparatus. 1...Machine base, 2...Base for lower mold, 3...
Lower mold, 4...Chase for lower mold, 5...Heso goo, 6...Base for upper mold, 7...Upper mold, 8...
・Chase for upper mold, 9... Filling chamber, 1o... Raw material tablet, 11... Plunger, I2...
Cavity group, 12a...Cahi 7-E, 13
... Ezekkupin for lower mold, 14 ... Ezekkupin for upper mold, 15° 16 ... Ejector pin holding member, 17.18 ... Ejector pin operating member, 2
1.24...Space part.
Claims (1)
て保持した下型と、上型用ベースの下面に取付く上型用
チェイスにて保持した上型とから成り、前記下型に、成
形品をキャビティー内から押し出すための下型用エゼク
ターピンを、前記上型に、成形品をキャビティー内から
押し出すための上型用エゼクターピンを各々設けて成る
成形装置において、前記下型用チェイスの下面と下型用
ベースの上面との間に空間部を形成して、該空間部に、
前記下型用ベースの下部に配設したエゼクターピン作動
部材にて上下動されるエゼクターピン保持部材を設けて
、該エゼクターピン保持部材に前記下型用エゼクターピ
ンを連結する一方、前記上型用チェイスの上面と上型用
ベースの下面との間に空間部を形成して、該空間部に、
前記上型用ベースの上部に配設したエゼクターピン作動
部材にて上下動されるエゼクターピン保持部材を設けて
、該エゼクターピン保持部材に前記上型用エゼクターピ
ンを連結したことを特徴とする合成樹脂の成形装置。(1) Consists of a lower mold held by a lower mold chaser attached to the upper surface of the lower mold base, and an upper mold held by an upper mold chaser attached to the lower surface of the upper mold base, In the molding device, the mold is provided with a lower mold ejector pin for extruding the molded product from inside the cavity, and the upper mold is provided with an upper mold ejector pin for extruding the molded product from the cavity. A space is formed between the lower surface of the lower die chase and the upper surface of the lower die base, and in the space,
An ejector pin holding member is provided which is moved up and down by an ejector pin operating member disposed at the lower part of the lower mold base, and the lower mold ejector pin is connected to the ejector pin holding member, while the upper mold base is connected to the ejector pin holding member. A space is formed between the upper surface of the chaser and the lower surface of the upper mold base, and in the space,
A composition characterized in that an ejector pin holding member is provided that is moved up and down by an ejector pin operating member disposed on the upper part of the upper mold base, and the upper mold ejector pin is connected to the ejector pin holding member. Resin molding equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61202477A JPH0747288B2 (en) | 1986-08-28 | 1986-08-28 | Synthetic resin molding equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61202477A JPH0747288B2 (en) | 1986-08-28 | 1986-08-28 | Synthetic resin molding equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6357215A true JPS6357215A (en) | 1988-03-11 |
| JPH0747288B2 JPH0747288B2 (en) | 1995-05-24 |
Family
ID=16458161
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61202477A Expired - Fee Related JPH0747288B2 (en) | 1986-08-28 | 1986-08-28 | Synthetic resin molding equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0747288B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02153716A (en) * | 1988-12-06 | 1990-06-13 | Toyama Nippon Denki Kk | Mold forming mold |
| JPH04133711A (en) * | 1990-09-26 | 1992-05-07 | Fanuc Ltd | Ejection system |
| SG103364A1 (en) * | 2002-10-11 | 2004-04-29 | Tung Jung Chen | Mold article ejecting device used for an injection molding apparatus |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5440863A (en) * | 1977-09-07 | 1979-03-31 | Hitachi Ltd | Mold for transfer molding |
| JPS5522947A (en) * | 1978-08-09 | 1980-02-19 | Hitachi Ltd | Moulding die |
| JPS595015A (en) * | 1982-07-02 | 1984-01-11 | Hitachi Ltd | Mold structure |
| JPS62269327A (en) * | 1986-05-17 | 1987-11-21 | Michio Osada | Manufacture of semiconductor device fit for multple-product small-quantity production |
-
1986
- 1986-08-28 JP JP61202477A patent/JPH0747288B2/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5440863A (en) * | 1977-09-07 | 1979-03-31 | Hitachi Ltd | Mold for transfer molding |
| JPS5522947A (en) * | 1978-08-09 | 1980-02-19 | Hitachi Ltd | Moulding die |
| JPS595015A (en) * | 1982-07-02 | 1984-01-11 | Hitachi Ltd | Mold structure |
| JPS62269327A (en) * | 1986-05-17 | 1987-11-21 | Michio Osada | Manufacture of semiconductor device fit for multple-product small-quantity production |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02153716A (en) * | 1988-12-06 | 1990-06-13 | Toyama Nippon Denki Kk | Mold forming mold |
| JPH04133711A (en) * | 1990-09-26 | 1992-05-07 | Fanuc Ltd | Ejection system |
| SG103364A1 (en) * | 2002-10-11 | 2004-04-29 | Tung Jung Chen | Mold article ejecting device used for an injection molding apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0747288B2 (en) | 1995-05-24 |
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| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |