JPS635647U - - Google Patents
Info
- Publication number
- JPS635647U JPS635647U JP1986099507U JP9950786U JPS635647U JP S635647 U JPS635647 U JP S635647U JP 1986099507 U JP1986099507 U JP 1986099507U JP 9950786 U JP9950786 U JP 9950786U JP S635647 U JPS635647 U JP S635647U
- Authority
- JP
- Japan
- Prior art keywords
- conductive layer
- lead frame
- mounting portion
- element mounting
- land
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 238000000465 moulding Methods 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986099507U JPS635647U (en18) | 1986-06-27 | 1986-06-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986099507U JPS635647U (en18) | 1986-06-27 | 1986-06-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS635647U true JPS635647U (en18) | 1988-01-14 |
Family
ID=30968444
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986099507U Pending JPS635647U (en18) | 1986-06-27 | 1986-06-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS635647U (en18) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0555440A (ja) * | 1991-08-29 | 1993-03-05 | Hitachi Cable Ltd | 樹脂封止型半導体装置 |
| US7230320B2 (en) | 2003-02-18 | 2007-06-12 | Hitachi, Ltd. | Electronic circuit device with reduced breaking and cracking |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5766655A (en) * | 1980-10-09 | 1982-04-22 | Mitsubishi Electric Corp | Lead frame for semiconductor device |
| JPS59194443A (ja) * | 1983-04-19 | 1984-11-05 | Toshiba Corp | 半導体装置 |
-
1986
- 1986-06-27 JP JP1986099507U patent/JPS635647U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5766655A (en) * | 1980-10-09 | 1982-04-22 | Mitsubishi Electric Corp | Lead frame for semiconductor device |
| JPS59194443A (ja) * | 1983-04-19 | 1984-11-05 | Toshiba Corp | 半導体装置 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0555440A (ja) * | 1991-08-29 | 1993-03-05 | Hitachi Cable Ltd | 樹脂封止型半導体装置 |
| US7230320B2 (en) | 2003-02-18 | 2007-06-12 | Hitachi, Ltd. | Electronic circuit device with reduced breaking and cracking |