JPS6356390A - Laser beam processing head - Google Patents
Laser beam processing headInfo
- Publication number
- JPS6356390A JPS6356390A JP61198483A JP19848386A JPS6356390A JP S6356390 A JPS6356390 A JP S6356390A JP 61198483 A JP61198483 A JP 61198483A JP 19848386 A JP19848386 A JP 19848386A JP S6356390 A JPS6356390 A JP S6356390A
- Authority
- JP
- Japan
- Prior art keywords
- laser beam
- laser
- processing
- processing nozzle
- detection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001514 detection method Methods 0.000 claims abstract description 32
- 230000002093 peripheral effect Effects 0.000 claims abstract description 3
- 238000000034 method Methods 0.000 claims abstract 2
- 238000010438 heat treatment Methods 0.000 claims description 5
- 239000002245 particle Substances 0.000 claims description 2
- 230000001678 irradiating effect Effects 0.000 claims 1
- 230000010355 oscillation Effects 0.000 abstract description 5
- 230000000630 rising effect Effects 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 230000003139 buffering effect Effects 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229910001369 Brass Inorganic materials 0.000 description 2
- 239000010951 brass Substances 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910001209 Low-carbon steel Inorganic materials 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000011946 reduction process Methods 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/1462—Nozzles; Features related to nozzles
- B23K26/1488—Means for protecting nozzles, e.g. the tip surface
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明はレーザ加工ヘッド、特にレーザ光と同軸状に
加工アシストガスを噴射して加工を行なう加工ノズルの
改良に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a laser processing head, particularly to an improvement of a processing nozzle that performs processing by injecting a processing assist gas coaxially with a laser beam.
第２図および第３図は従来のレーザ加工ヘッドを示すも
ので、図中５（１）ｌ’ｌ：ノズルアダプタ、（２）は
このノズルアダプタ（１）に装着され几銅又は黄銅等の
調合金製の加工ノズルで、レーザ光（８）ヲワーク（４
）に照射するとともに、レーザ光（８）と同軸状に加工
アシストガスを噴射して加工を行なう。（５）ハ上記ノ
ズル（２）の軸方向中間部に縮径加工を施して形成され
た脆弱部で、加工ノズル（２）の先端にワーク（４）が
衝突した場合等、加工ノズル（２）の先端に外力が負荷
された際に、応力を集中させてこの部分に破壊を生じさ
せ、外力を緩衝するようになっている。Figures 2 and 3 show conventional laser processing heads. In the figures, 5 (1) l'l: nozzle adapter, (2) is attached to this nozzle adapter (1), and is made of solid copper or brass. Laser light (8) workpiece (4
), and machining is performed by injecting a machining assist gas coaxially with the laser beam (8). (5) C) This is a fragile part formed by performing diameter reduction processing on the axially intermediate part of the nozzle (2), and when the workpiece (4) collides with the tip of the processing nozzle (2), etc. ) When an external force is applied to the tip, the stress is concentrated and breaks in this part, thereby buffering the external force.
従来のレーザ加工ヘッドは上記のように構成され、例え
ば第３図に示すように加工ヘッドを矢印（Ａ）方向に移
動させた際に加工ノズル（２）の先端がワ−り（４）に
衝突すると、脆弱部（５）に応力が集中してこの部分が
破壊され、これにより、ワーク（４）との衝突に伴なう
衝撃力が緩衝される。The conventional laser processing head is constructed as described above, and for example, as shown in Fig. 3, when the processing head is moved in the direction of arrow (A), the tip of the processing nozzle (2) touches the workpiece (4). When a collision occurs, stress concentrates on the fragile portion (5) and this portion is destroyed, thereby buffering the impact force accompanying the collision with the workpiece (4).
上記のような従来のレーザ加工ヘッドでは、加工ノズル
（２）がレーザ光を反射し易い銅又は黄銅合金で形成さ
れている。このため、第３図に示すように加工ノズル（
２）がワーク（４）との衝突により脆弱部（６）から折
れた場合、レーザ光（８）は加工ノズル（２）内面で何
回も反射を繰返し、第６図に矢印（Ｂ）で示すようにノ
ズル開口部から散乱したり破壊口から散乱し、場合によ
ってはオペレータが被曝するおそれがある等の問題があ
った。In the conventional laser processing head as described above, the processing nozzle (2) is made of copper or brass alloy, which easily reflects laser light. For this reason, as shown in Figure 3, the processing nozzle (
2) is broken from the fragile part (6) due to a collision with the workpiece (4), the laser beam (8) is reflected many times on the inner surface of the processing nozzle (2), and as shown by the arrow (B) in Fig. As shown, there was a problem in that the particles were scattered from the nozzle opening or from the rupture port, and in some cases, the operator could be exposed to radiation.
この発明は、かかる問題点を解決するためになされたも
ので、加工ノズルが外力により破壊されたり、あるいは
何等かの理由によりレーザ光が加工ノズルから照射され
なくなった場合に、速やかにレーザ発振を停止させる等
の出力制御を行なうことができるレーザ加工ヘッドを得
ることを目的とする。This invention was made in order to solve this problem, and when the processing nozzle is destroyed by external force or the laser beam is no longer irradiated from the processing nozzle for some reason, the laser oscillation can be immediately stopped. The object of the present invention is to obtain a laser processing head that can perform output control such as stopping.
この発明に係るレーザ加工ヘッドは、加工ノズルの脆弱
部よりも先端側の内面に、レーザ光の受光により検出信
号を出力する検出部を設け、この検出部からの検出信号
によりレーザ光の出力制御を行なうようにしたものであ
る。The laser processing head according to the present invention includes a detection section that outputs a detection signal by receiving laser light on the inner surface of the processing nozzle on the tip side of the fragile part, and controls the output of the laser light based on the detection signal from the detection section. It was designed to do this.
この発明においては、加工ノズルが外力により破壊され
たり、あるいはレーザ光が加工ノズルの内面を反射して
ノズル先端から照射されなくなった場合に、加工ノズル
の脆弱部よりも先端側の内面に設けた検出部によりレー
ザ光が受光され、検出部からの検出信号によりレーザ光
の出力制御が行なわれる。このため、散乱したレーザ光
でオペレータが被曝する等のおそれがない。In this invention, if the processing nozzle is destroyed by external force or the laser beam is reflected from the inner surface of the processing nozzle and is no longer irradiated from the nozzle tip, a The laser beam is received by the detection section, and the output of the laser beam is controlled based on the detection signal from the detection section. Therefore, there is no risk that the operator will be exposed to the scattered laser light.
第１図はこの発明の一実施例を示すもので、図中、第２
図および第６図と同一符号は同−又は相当部分を示す。FIG. 1 shows an embodiment of the present invention.
The same reference numerals as those in the figures and FIG. 6 indicate the same or corresponding parts.
（６）は脆弱部（５）よりも先端側の加工ノズル（２）
内周面に配された環状の昇温部で比較的レーザ光（８）
を吸収でき、かつ耐熱性を有する材料、例えば軟鋼材等
で形成され、レーザ光（８）の受光により昇温する。（
７）は上記昇温部（６）とともに検出部を構成する熱電
対等の感熱素子で、昇温部（６）の昇温を感知して検出
信号を出力する。（８）はこの検出信号を受信してイン
ターロック信号（９）をレーザ加工機操作盤等の制御部
叫に出力する検出回路で、その設定温度は変更可能とな
っている。(6) is the processing nozzle (2) on the tip side of the weak part (5)
A relatively large amount of laser light is generated at the annular heating section placed on the inner circumferential surface (8)
It is made of a material that can absorb heat and has heat resistance, such as mild steel, and is heated by receiving the laser beam (8). (
7) is a heat-sensitive element such as a thermocouple that constitutes a detection section together with the temperature rising section (6), which senses the temperature rise of the temperature rising section (6) and outputs a detection signal. (8) is a detection circuit which receives this detection signal and outputs an interlock signal (9) to a control unit such as a laser processing machine operation panel, and its set temperature can be changed.
上記のように構成されたレーザ加工ヘッドにおいては、
加工ノズル（２）の先端にワーク（４）が衝突する等、
加工ノズル（２）に外力が負荷されると、加工ノズル（
２）は脆弱部（５）に応力が集中してこの部分から折れ
、衝撃力が緩衝される。In the laser processing head configured as above,
The workpiece (4) collides with the tip of the processing nozzle (2), etc.
When an external force is applied to the processing nozzle (2), the processing nozzle (
2), the stress is concentrated on the weak part (5) and it breaks from this part, thereby buffering the impact force.
ところで、加工ノズル（２）が脆弱部（５）から折れる
と、第３図に示すようにレーザ光（８）ハ加工ノズル（
２）の先端内面に照射されることになるが、この部分に
は第１図に示すように昇温部（６）が配されているので
、昇温部（６）はこのレーザ光（８）の照射により昇温
する。昇温部（６）が昇温すると、感熱素子（７）がこ
れを検出し、検出信号を検出回路（８）に出力する。By the way, when the processing nozzle (2) breaks from the weak part (5), the laser beam (8) is ejected from the processing nozzle (
The inner surface of the tip of the laser beam (2) is irradiated with the laser beam (8), and since the heating section (6) is arranged in this part as shown in Fig. 1, the heating section (6) ) temperature rises by irradiation. When the temperature rising section (6) rises in temperature, the heat sensitive element (7) detects this and outputs a detection signal to the detection circuit (8).
検出回路（８）は、この検出信号を受信して制御部α＠
にインターロック信号（９）を出力する。これによりレ
ーザ発振の停止等、レーザ光（８）の出力制御がなされ
る。The detection circuit (8) receives this detection signal and controls the control unit α@
An interlock signal (9) is output to the terminal. This controls the output of the laser light (8), such as stopping laser oscillation.
なお上記実施例では、加工ノズル（２）が脆弱部（５）
から折れ曲がった場合を示したが、レーザ光（８）の光
軸がずれて昇温部（６）に照射される等の場合にも同様
に適用できる。In the above embodiment, the processing nozzle (2) is the weak part (5).
Although the case where the laser beam (8) is bent is shown, it can be similarly applied to a case where the optical axis of the laser beam (8) is shifted and the temperature rising part (6) is irradiated.
また上記実施例では、昇温部（６）と感熱素子（γ）と
により検出部を構成し、レーザ光（８）の照射に伴なう
温度上昇によりレーザ光（８）の照射を検出するものを
示したが、光電変換素子等を用いて検出部を構成するよ
うにしても同様の効果が期待できる。Further, in the above embodiment, the detection section is configured by the temperature raising section (6) and the heat sensitive element (γ), and the irradiation of the laser beam (8) is detected by the temperature rise accompanying the irradiation of the laser beam (8). Although the present invention has been shown, similar effects can be expected even if the detection section is configured using a photoelectric conversion element or the like.
また上記実施例では、加工ノズル（２）に縮径加工を施
して脆弱部（５）とするものを示したが、外力が加わっ
た際に脆弱部（５）で破壊が生じるようなものであれば
他の構造でもよい。その例としては、例えば、脆弱部（
５）の部分に銅又は銅合金よりも弱い金属板を配したり
、あるいは脆弱部（６）の部分を除き加工ノズル（２）
の外周面に補強金属層を被覆する等が考えられる。Furthermore, in the above embodiment, the processing nozzle (2) is subjected to a diameter reduction process to form a weakened portion (5), but this is not a type in which breakage occurs in the weakened portion (5) when external force is applied. Other structures may be used if necessary. Examples include, for example, weak parts (
Place a metal plate weaker than copper or copper alloy in the part 5), or use the processing nozzle (2) except for the weak part (6).
It is conceivable to cover the outer peripheral surface with a reinforcing metal layer.
この発明は以上説明したとおり、加工ノズルの脆弱部よ
りも先端側の内面に、レーザ光の受光により検出信号を
出力する検出部を設け、この検出部からの検出信号によ
りレーザ光の出力制御を行なうようにしているので、外
力により加工ノズルの先端が折れ曲がったり、レーザ光
の光軸がずれて加工ノズルの先端内面に照射される等の
場合にレーザ発振を停止させる等のレーザ光の出力制御
を迅速に行なりことができ、オペレータのレーザ光被曝
等のおそれがない等の効果がある。As explained above, the present invention includes a detection part that outputs a detection signal by receiving laser light on the inner surface of the processing nozzle on the tip side of the fragile part, and controls the output of the laser light based on the detection signal from this detection part. Therefore, if the tip of the processing nozzle is bent due to external force or the optical axis of the laser beam is shifted and the inner surface of the tip of the processing nozzle is irradiated, the output of the laser beam can be controlled such as stopping laser oscillation. can be carried out quickly, and there is no risk of the operator being exposed to laser light.
第１図はこの発明の一実施例を示すレーザ加工ヘッドの
断面図、第２図は従来のレーザ加工ヘッドを示す第１図
相当図、第５図は従来のレーザ加工ヘッドにおいて加工
ノズルが脆弱部から折れ曲がった状態を示す説明図であ
る。
（２）・・加工ノズル （８）・・レーザ光（４）・
・ワーク （５）・ｅ脆弱部（６）・・昇温部
（γ）・・感熱素子（９）＠、インターロック信
号
なお各図中、同一符号は同−又は相当部分を示すものと
する。Figure 1 is a sectional view of a laser processing head showing an embodiment of the present invention, Figure 2 is a view equivalent to Figure 1 showing a conventional laser processing head, and Figure 5 is a conventional laser processing head in which the processing nozzle is fragile. It is an explanatory view showing a state bent from the part. (2)...Processing nozzle (8)...Laser light (4)...
・Workpiece (5)・e Weak part (6)...Temperature rising part
(γ)...Heat-sensitive element (9)@, interlock signal Note that in each figure, the same reference numerals indicate the same or corresponding parts.
Claims (2)
を噴射してワークの加工を行なう加工ノズルを備え、こ
の加工ノズルの軸方向中間部に、加工ノズルの先端に外
力が負荷された際に応力が集中する脆弱部を設けたレー
ザ加工ヘッドにおいて、上記加工ノズルの脆弱部より先
端側の内面に、レーザ光の受光により検出信号を出力す
る検出部を設け、この検出部からの検出信号によりレー
ザ光の出力制御を行なうことを特徴とするレーザ加工ヘ
ッド。(1) Equipped with a processing nozzle that processes the workpiece by irradiating laser light and injecting processing assist gas, the axially intermediate part of this processing nozzle is exposed to stress when an external force is applied to the tip of the processing nozzle. In a laser processing head that is provided with a fragile part where the particles are concentrated, a detection part is provided on the inner surface of the processing nozzle on the tip side from the fragile part, and the detection part outputs a detection signal by receiving the laser beam, and the detection signal from this detection part causes the laser to A laser processing head characterized by controlling light output.
レーザ光を吸収して昇温する昇温部と、この昇温部の昇
温を感知する感熱素子とを有していることを特徴とする
特許請求の範囲第１項記載のレーザ加工ヘッド。(2) The detection unit includes a heating part that is arranged in an annular shape on the inner peripheral surface of the processing nozzle and increases the temperature by absorbing laser light, and a heat-sensitive element that senses the temperature rise of this heating part. A laser processing head according to claim 1, characterized in that:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61198483A JPS6356390A (en) | 1986-08-25 | 1986-08-25 | Laser beam processing head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61198483A JPS6356390A (en) | 1986-08-25 | 1986-08-25 | Laser beam processing head |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6356390A true JPS6356390A (en) | 1988-03-10 |
| JPH0513038B2 JPH0513038B2 (en) | 1993-02-19 |
Family
ID=16391862
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61198483A Granted JPS6356390A (en) | 1986-08-25 | 1986-08-25 | Laser beam processing head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6356390A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0293089U (en) * | 1989-01-07 | 1990-07-24 | ||
| US5366164A (en) * | 1991-03-22 | 1994-11-22 | Precitec Gmbh | Nozzle comprising break-off region |
| JP2017507783A (en) * | 2014-01-07 | 2017-03-23 | リンカーン グローバル， インコーポレイテッドＬｉｎｃｏｌｎ Ｇｌｏｂａｌ， Ｉｎｃ． | Welding torch assembly and components with improved durability |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57139489A (en) * | 1981-02-24 | 1982-08-28 | Amada Eng & Service | Working head in laser working device |
| JPS58103991A (en) * | 1981-12-17 | 1983-06-21 | Matsushita Electric Ind Co Ltd | External optical apparatus for laser processing machine |
-
1986
- 1986-08-25 JP JP61198483A patent/JPS6356390A/en active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57139489A (en) * | 1981-02-24 | 1982-08-28 | Amada Eng & Service | Working head in laser working device |
| JPS58103991A (en) * | 1981-12-17 | 1983-06-21 | Matsushita Electric Ind Co Ltd | External optical apparatus for laser processing machine |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0293089U (en) * | 1989-01-07 | 1990-07-24 | ||
| US5366164A (en) * | 1991-03-22 | 1994-11-22 | Precitec Gmbh | Nozzle comprising break-off region |
| JP2017507783A (en) * | 2014-01-07 | 2017-03-23 | リンカーン グローバル， インコーポレイテッドＬｉｎｃｏｌｎ Ｇｌｏｂａｌ， Ｉｎｃ． | Welding torch assembly and components with improved durability |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0513038B2 (en) | 1993-02-19 |
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