JPH0513038B2 - - Google Patents
Info
- Publication number
- JPH0513038B2 JPH0513038B2 JP61198483A JP19848386A JPH0513038B2 JP H0513038 B2 JPH0513038 B2 JP H0513038B2 JP 61198483 A JP61198483 A JP 61198483A JP 19848386 A JP19848386 A JP 19848386A JP H0513038 B2 JPH0513038 B2 JP H0513038B2
- Authority
- JP
- Japan
- Prior art keywords
- processing
- laser
- nozzle
- laser beam
- processing nozzle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000001514 detection method Methods 0.000 claims description 19
- 238000010438 heat treatment Methods 0.000 claims description 3
- 238000000034 method Methods 0.000 claims 1
- 238000003754 machining Methods 0.000 description 4
- 230000000630 rising effect Effects 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000012141 concentrate Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000010355 oscillation Effects 0.000 description 3
- 229910001369 Brass Inorganic materials 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- 239000010951 brass Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 229910001209 Low-carbon steel Inorganic materials 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/1462—Nozzles; Features related to nozzles
- B23K26/1488—Means for protecting nozzles, e.g. the tip surface
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明はレーザ加工ヘツド、特にレーザ光と
同軸状に加工アシストガスを噴射して加工を行な
う加工ノズルの改良に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an improvement in a laser processing head, particularly a processing nozzle that performs processing by injecting a processing assist gas coaxially with a laser beam.
第２図および第３図は従来のレーザ加工ヘツド
を示すもので、図中、１はノズルアダプタ、２は
このノズルアダプタ１に装着された銅又は黄銅等
の銅合金製の加工ノズルで、レーザ光３をワーク
４に照射するとともに、レーザ光３と同軸状に加
工アシストガスを噴射して加工を行なう。５は上
記ノズル２の軸方向中間部に縮径加工を施して形
成された脆弱部で、加工ノズル２の先端にワーク
４が衝突した場合等、加工ノズル２の先端に外力
が負荷された際に、応力を集中させてこの部分に
破壊を生じさせ、外力を緩衝するようになつてい
る。
Figures 2 and 3 show conventional laser processing heads. In the figures, 1 is a nozzle adapter, and 2 is a processing nozzle made of copper or copper alloy such as brass that is attached to this nozzle adapter 1. The workpiece 4 is irradiated with light 3 and processing assist gas is injected coaxially with the laser light 3 to perform processing. Reference numeral 5 denotes a fragile portion formed by performing diameter reduction processing on the axially intermediate portion of the nozzle 2, and when an external force is applied to the tip of the processing nozzle 2, such as when a workpiece 4 collides with the tip of the processing nozzle 2. The structure is designed to concentrate stress and cause destruction in this area, thereby buffering external forces.
従来のレーザ加工ヘツドは上記のように構成さ
れ、例えば第３図に示すように加工ヘツドを矢印
(A)方向に移動させた際に加工ノズル２の先端がワ
ーク４に衝突すると、脆弱部５に応力が集中して
この部分が破壊され、これにより、ワーク４との
衝突に伴なう衝撃力が緩衝される。 A conventional laser processing head is constructed as described above. For example, as shown in Figure 3, the processing head is indicated by an arrow.
When the tip of the processing nozzle 2 collides with the workpiece 4 when moving in the direction (A), stress concentrates on the fragile part 5 and this part is destroyed, resulting in the impact caused by the collision with the workpiece 4. The force is buffered.
上記のような従来のレーザ加工ヘツドでは、加
工ノズル２がレーザ光を反射し易い銅又は黄銅合
金で形成されている。このため、第３図に示すよ
うに加工ノズル２がワーク４との衝突により脆弱
部５から折れた場合、レーザ光３は加工ノズル２
内面で何回も反射を繰返し、第３図に矢印(B)で示
すようにノズル開口部から散乱したり破壊口から
散乱し、場合によつてはオペレータが被曝するお
それがある等の問題があつた。
In the conventional laser processing head as described above, the processing nozzle 2 is made of copper or brass alloy, which easily reflects laser light. Therefore, as shown in FIG.
It is reflected many times on the inner surface, and as shown by arrow (B) in Figure 3, it is scattered from the nozzle opening or from the rupture port, and in some cases, there is a risk that the operator may be exposed to radiation. It was hot.
この発明は、かかる問題点を解決するためにな
されたもので、加工ノズルが外力により破壊され
たり、あるいは何等かの理由によりレーザ光が加
工ノズルから照射されなくなつた場合に、速やか
にレーザ発振を停止させる等の出力制御を行なう
ことができるレーザ加工ヘツドを得ることを目的
とする。 This invention was made to solve this problem, and when the processing nozzle is destroyed by external force or the laser beam is no longer irradiated from the processing nozzle for some reason, the laser oscillation can be performed immediately. The object of the present invention is to obtain a laser processing head that can perform output control such as stopping the laser processing.
この発明に係るレーザ加工ヘツドは、加工ノズ
ルの脆弱部より先端側の内周面に環状に配置され
レーザ光を吸収して昇温する昇温部と、昇温部の
温度を感知する感熱素子とを配設し、加工ノズル
の先端部分に外力が付与されたとき、感熱素子か
らの検出信号によりレーザ光の出力制御を行なう
ものである。
The laser processing head according to the present invention includes a heating section that is arranged in an annular shape on the inner circumferential surface of the processing nozzle on the tip side from the weakened part and that absorbs laser light to raise the temperature, and a heat-sensitive element that senses the temperature of the heating section. When an external force is applied to the tip of the processing nozzle, the output of the laser beam is controlled based on a detection signal from the heat-sensitive element.
この発明においては、加工ノズルが外力により
破壊されたり、あるいはレーザ光が加工ノズルの
内面を反射してノズル先端から照射されなくなつ
た場合に、加工ノズルの脆弱部よりも先端側の内
面に設けた検出部によりレーザ光が受光され、検
出部からの検出信号によりレーザ光の出力制御が
行なわれる。このため、散乱したレーザ光でオペ
レータが被曝する等のおそれがない。
In this invention, if the processing nozzle is destroyed by external force or the laser beam is reflected from the inner surface of the processing nozzle and is no longer irradiated from the nozzle tip, the The laser beam is received by the detection section, and the output of the laser beam is controlled based on a detection signal from the detection section. Therefore, there is no risk that the operator will be exposed to the scattered laser light.
第１図はこの発明の一実施例を示すもので、図
中、第２図および第３図と同一符号は同一又は相
当部分を示す。６は脆弱部５よりも先端側の加工
ノズル２内周面に配された環状の昇温部で比較的
レーザ光３を吸収でき、かつ耐熱性を有する材
料、例えば軟鋼材等で形成され、レーザ光３の受
光により昇温する。７は上記昇温部６とともに検
出部を構成する熱電対等の感熱素子で、昇温部６
の昇温を感知して検出信号を出力する。８はこの
検出信号を受信してインターロツク信号９をレー
ザ加工機操作盤等の制御部１０に出力する検出回
路で、その設定温度は変更可能となつている。
FIG. 1 shows an embodiment of the present invention, and in the figure, the same reference numerals as in FIGS. 2 and 3 indicate the same or corresponding parts. Reference numeral 6 denotes an annular temperature rising part disposed on the inner circumferential surface of the processing nozzle 2 on the tip side of the fragile part 5, and is made of a material that can relatively absorb the laser beam 3 and has heat resistance, such as mild steel. The temperature is increased by receiving the laser beam 3. Reference numeral 7 denotes a heat-sensitive element such as a thermocouple, which constitutes a detection section together with the temperature raising section 6;
It senses the temperature rise and outputs a detection signal. 8 is a detection circuit which receives this detection signal and outputs an interlock signal 9 to a control section 10 such as a laser processing machine operation panel, and the set temperature thereof can be changed.
上記のように構成されたレーザ加工ヘツドにお
いては、加工ノズル２の先端にワーク４が衝突す
る等、加工ノズル２に外力が負荷されると、加工
ノズル２は脆弱部５に応力が集中してこの部分か
ら折れ、衝撃力が緩衝される。 In the laser machining head configured as described above, when an external force is applied to the machining nozzle 2, such as when the workpiece 4 collides with the tip of the machining nozzle 2, stress concentrates on the fragile part 5 of the machining nozzle 2. It breaks from this part and absorbs the impact force.
ところで、加工ノズル２が脆弱部５から折れる
と、第３図に示すようにレーザ光３は加工ノズル
２の先端内面に照射されることになるが、この部
分には第１図に示すように昇温部６が配されてい
るので、昇温部６はこのレーザ光３の照射により
昇温する。昇温部６が昇温すると、感熱素子７が
これを検出し、検出信号を検出回路８に出力す
る。検出回路８は、この検出信号を受信して制御
部１０にインターロツク信号９を出力する。これ
によりレーザ発振の停止等、レーザ光３の出力制
御がなされる。 By the way, when the processing nozzle 2 is broken from the fragile part 5, the laser beam 3 will be irradiated on the inner surface of the tip of the processing nozzle 2 as shown in FIG. Since the temperature increasing section 6 is provided, the temperature of the temperature increasing section 6 is increased by irradiation with the laser beam 3. When the temperature rising section 6 rises in temperature, the heat sensitive element 7 detects this and outputs a detection signal to the detection circuit 8. Detection circuit 8 receives this detection signal and outputs interlock signal 9 to control section 10. This controls the output of the laser beam 3, such as stopping laser oscillation.
なお上記実施例では、加工ノズル２が脆弱部５
から折れ曲がつた場合を示したが、レーザ光３の
光軸がずれて昇温部６に照射される等の場合にも
同様に適用できる。 Note that in the above embodiment, the processing nozzle 2
Although the case where the laser beam 3 is bent is shown, it can be similarly applied to a case where the optical axis of the laser beam 3 is shifted and the temperature rising section 6 is irradiated.
また上記実施例では、昇温部６と感熱素子７と
により検出部を構成し、レーザ光３の照射に伴な
う温度上昇によりレーザ光３の照射を検出するも
のを示したが、光電変換素子等を用いて検出部を
構成するようにしても同様の効果が期待できる。 Further, in the above embodiment, the detection section is configured by the temperature raising section 6 and the heat sensitive element 7, and the irradiation of the laser beam 3 is detected by the temperature rise accompanying the irradiation of the laser beam 3. Similar effects can be expected even if the detection section is configured using elements or the like.
また上記実施例では、加工ノズル２に縮径加工
を施して脆弱部５とするものを示したが、外力が
加わつた際に脆弱部５で破壊が生じるようなもの
であれば他の構造でもよい。その例としては、例
えば、脆弱部５の部分に銅又は銅合金よりも弱い
金属板を配したり、あるいは脆弱部５の部分を除
き加工ノズル２の外周面に補強金属層を被覆する
等が考えられる。 Furthermore, in the above embodiment, the processing nozzle 2 is diameter-reduced to form the fragile portion 5, but other structures may be used as long as the fragile portion 5 breaks when external force is applied. good. Examples of this include, for example, placing a metal plate weaker than copper or copper alloy in the fragile portion 5, or coating the outer peripheral surface of the processing nozzle 2 except for the fragile portion 5 with a reinforcing metal layer. Conceivable.
この発明は以上説明したとおり、加工ノズルの
脆弱部よりも先端側の内面に、レーザ光の受光に
より検出信号を出力する検出部を設け、この検出
部からの検出信号によりレーザ光の出力制御を行
なうようにしているので、外力により加工ノズル
の先端が折れ曲がつたり、レーザ光の光軸がずれ
て加工ノズルの先端内面に照射される等の場合に
レーザ発振を停止させる等のレーザ光の出力制御
を迅速に行なうことができ、オペレータのレーザ
光被曝等のおそれがない等の効果がある。
As explained above, the present invention includes a detection part that outputs a detection signal by receiving laser light on the inner surface of the processing nozzle on the tip side of the fragile part, and controls the output of the laser light based on the detection signal from this detection part. Therefore, if the tip of the processing nozzle bends due to external force or the optical axis of the laser beam shifts and irradiates the inner surface of the tip of the processing nozzle, the laser oscillation will be stopped. The output control can be performed quickly, and there is no risk of the operator being exposed to laser light.
第１図はこの発明の一実施例を示すレーザ加工
ヘツドの断面図、第２図は従来のレーザ加工ヘツ
ドを示す第１図相当図、第３図は従来のレーザ加
工ヘツドにおいて加工ノズルが脆弱部から折れ曲
がつた状態を示す説明図である。
２……加工ノズル、３……レーザ光、４……ワ
ーク、５……脆弱部、６……昇温部、７……感熱
素子、９……インターロツク信号。なお各図中、
同一符号は同一又は相当部分を示すものとする。
Figure 1 is a sectional view of a laser processing head showing an embodiment of the present invention, Figure 2 is a view equivalent to Figure 1 showing a conventional laser processing head, and Figure 3 is a conventional laser processing head in which the processing nozzle is fragile. FIG. 2... Processing nozzle, 3... Laser light, 4... Workpiece, 5... Weak part, 6... Temperature rising part, 7... Heat sensitive element, 9... Interlock signal. In each figure,
The same reference numerals indicate the same or equivalent parts.
Claims (1)
してワークの加工を行なう加工ノズルの軸方向の
中間部に、前記加工ノズルの先端部分に外力が付
与されたとき、その応力が集中する脆弱部を設け
たレーザ加工ヘツドにおいて、 前記加工ノズルの脆弱部より先端側の内周面に
環状に配置されレーザ光を吸収して昇温する昇温
部と、前記昇温部の温度を感知する感熱素子とを
配設し、前記感熱素子からの検出信号によりレー
ザ光の出力制御を行なうことを特徴とするレーザ
加工ヘツド。[Claims] 1. When an external force is applied to the tip of the processing nozzle at the axially intermediate portion of the processing nozzle that processes the workpiece by injecting processing assist gas coaxially with the laser beam, In a laser processing head provided with a weakened part where stress is concentrated, a heating part is arranged in an annular shape on the inner circumferential surface of the processing nozzle on the tip side of the weakened part and absorbs laser light to raise the temperature; 1. A laser processing head comprising: a heat-sensitive element for sensing the temperature of the laser beam; and a laser beam output is controlled based on a detection signal from the heat-sensitive element.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61198483A JPS6356390A (en) | 1986-08-25 | 1986-08-25 | Laser beam processing head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61198483A JPS6356390A (en) | 1986-08-25 | 1986-08-25 | Laser beam processing head |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6356390A JPS6356390A (en) | 1988-03-10 |
| JPH0513038B2 true JPH0513038B2 (en) | 1993-02-19 |
Family
ID=16391862
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61198483A Granted JPS6356390A (en) | 1986-08-25 | 1986-08-25 | Laser beam processing head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6356390A (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0293089U (en) * | 1989-01-07 | 1990-07-24 | ||
| DE4109567C3 (en) * | 1991-03-22 | 1997-03-13 | Precitec Gmbh | Device for processing a workpiece using a laser beam |
| US10293426B2 (en) * | 2014-01-07 | 2019-05-21 | Lincoln Global, Inc. | Increased durability welding torch assembly and components |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57139489A (en) * | 1981-02-24 | 1982-08-28 | Amada Eng & Service | Working head in laser working device |
| JPS58103991A (en) * | 1981-12-17 | 1983-06-21 | Matsushita Electric Ind Co Ltd | External optical apparatus for laser processing machine |
-
1986
- 1986-08-25 JP JP61198483A patent/JPS6356390A/en active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57139489A (en) * | 1981-02-24 | 1982-08-28 | Amada Eng & Service | Working head in laser working device |
| JPS58103991A (en) * | 1981-12-17 | 1983-06-21 | Matsushita Electric Ind Co Ltd | External optical apparatus for laser processing machine |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6356390A (en) | 1988-03-10 |
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