JPS6355535U - - Google Patents

Info

Publication number
JPS6355535U
JPS6355535U JP14932786U JP14932786U JPS6355535U JP S6355535 U JPS6355535 U JP S6355535U JP 14932786 U JP14932786 U JP 14932786U JP 14932786 U JP14932786 U JP 14932786U JP S6355535 U JPS6355535 U JP S6355535U
Authority
JP
Japan
Prior art keywords
ion beam
sample
film
crystal oscillator
etching
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14932786U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP14932786U priority Critical patent/JPS6355535U/ja
Publication of JPS6355535U publication Critical patent/JPS6355535U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Drying Of Semiconductors (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
JP14932786U 1986-09-29 1986-09-29 Pending JPS6355535U (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14932786U JPS6355535U (enrdf_load_stackoverflow) 1986-09-29 1986-09-29

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14932786U JPS6355535U (enrdf_load_stackoverflow) 1986-09-29 1986-09-29

Publications (1)

Publication Number Publication Date
JPS6355535U true JPS6355535U (enrdf_load_stackoverflow) 1988-04-14

Family

ID=31064428

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14932786U Pending JPS6355535U (enrdf_load_stackoverflow) 1986-09-29 1986-09-29

Country Status (1)

Country Link
JP (1) JPS6355535U (enrdf_load_stackoverflow)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006344745A (ja) * 2005-06-08 2006-12-21 Tdk Corp エッチング量計測装置、エッチング装置及びエッチング量計測方法
JP2019510374A (ja) * 2016-03-11 2019-04-11 アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated マイクロセンサを有するウエハ処理ツール
CN109937471A (zh) * 2016-11-14 2019-06-25 应用材料公司 选择性蚀刻速率监控器
JPWO2022157908A1 (enrdf_load_stackoverflow) * 2021-01-22 2022-07-28

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006344745A (ja) * 2005-06-08 2006-12-21 Tdk Corp エッチング量計測装置、エッチング装置及びエッチング量計測方法
JP2019510374A (ja) * 2016-03-11 2019-04-11 アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated マイクロセンサを有するウエハ処理ツール
JP2022020718A (ja) * 2016-03-11 2022-02-01 アプライド マテリアルズ インコーポレイテッド マイクロセンサを有するウエハ処理ツール
CN109937471A (zh) * 2016-11-14 2019-06-25 应用材料公司 选择性蚀刻速率监控器
JP2019536281A (ja) * 2016-11-14 2019-12-12 アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated 選択的エッチング速度モニタ
JP2021106272A (ja) * 2016-11-14 2021-07-26 アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated 選択的エッチング速度モニタ
CN109937471B (zh) * 2016-11-14 2023-08-22 应用材料公司 选择性蚀刻速率监控器
JPWO2022157908A1 (enrdf_load_stackoverflow) * 2021-01-22 2022-07-28
WO2022157908A1 (ja) * 2021-01-22 2022-07-28 株式会社日立ハイテク イオンミリング装置
TWI821868B (zh) * 2021-01-22 2023-11-11 日商日立全球先端科技股份有限公司 離子銑削裝置

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