JPS6355460U - - Google Patents
Info
- Publication number
- JPS6355460U JPS6355460U JP14771186U JP14771186U JPS6355460U JP S6355460 U JPS6355460 U JP S6355460U JP 14771186 U JP14771186 U JP 14771186U JP 14771186 U JP14771186 U JP 14771186U JP S6355460 U JPS6355460 U JP S6355460U
- Authority
- JP
- Japan
- Prior art keywords
- metal
- metal core
- wiring board
- hole
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 14
- 230000017525 heat dissipation Effects 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 3
- 239000011347 resin Substances 0.000 claims 2
- 229920005989 resin Polymers 0.000 claims 2
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14771186U JPS6355460U (en:Method) | 1986-09-29 | 1986-09-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14771186U JPS6355460U (en:Method) | 1986-09-29 | 1986-09-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6355460U true JPS6355460U (en:Method) | 1988-04-13 |
Family
ID=31061322
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14771186U Pending JPS6355460U (en:Method) | 1986-09-29 | 1986-09-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6355460U (en:Method) |
-
1986
- 1986-09-29 JP JP14771186U patent/JPS6355460U/ja active Pending