JPS635540A - Metal mold for resin sealing - Google Patents
Metal mold for resin sealingInfo
- Publication number
- JPS635540A JPS635540A JP14881186A JP14881186A JPS635540A JP S635540 A JPS635540 A JP S635540A JP 14881186 A JP14881186 A JP 14881186A JP 14881186 A JP14881186 A JP 14881186A JP S635540 A JPS635540 A JP S635540A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- gate
- runner
- resin flow
- gates
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 title claims abstract description 61
- 229920005989 resin Polymers 0.000 title claims abstract description 61
- 238000007789 sealing Methods 0.000 title claims description 19
- 239000002184 metal Substances 0.000 title 1
- 230000007423 decrease Effects 0.000 claims description 3
- 101100298222 Caenorhabditis elegans pot-1 gene Proteins 0.000 abstract description 7
- 238000000465 moulding Methods 0.000 description 4
- 230000007547 defect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/27—Sprue channels ; Runner channels or runner nozzles
- B29C45/2701—Details not specific to hot or cold runner channels
- B29C45/2703—Means for controlling the runner flow, e.g. runner switches, adjustable runners or gates
- B29C45/2704—Controlling the filling rates or the filling times of two or more mould cavities by controlling the cross section or the length of the runners or the gates
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、リードフレーム上の半導体素子を樹脂封止す
る場合に使用して好適な樹脂封止用金型に関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a mold for resin sealing which is suitable for use in resin sealing a semiconductor element on a lead frame.
従来、この種の樹脂封止用金型は第４図に示すように構
成されており、これを同図に基づいて概略説明すると、
同図において、１は樹脂注入用のポット（カル）、２は
このポット１から樹脂が流入するランナ、３はこのラン
ナ２の両側にゲート４を介して接続されかつ各々がラン
ナ２の延在方間に所定の間隔を隔てて並設された複数の
キャビティである。また、５はこれらキャビティ３をも
つフレームである。なお、図中斜線は樹脂を、また矢印
は樹脂の流れ方向を示す。Conventionally, this type of resin sealing mold has been constructed as shown in FIG. 4, and this will be briefly explained based on the same figure.
In the figure, 1 is a pot (cul) for resin injection, 2 is a runner into which resin flows from the pot 1, and 3 is connected to both sides of the runner 2 via a gate 4, and each is an extension of the runner 2. A plurality of cavities are arranged in parallel at predetermined intervals in the direction of the cavity. Further, 5 is a frame having these cavities 3. Note that the diagonal lines in the figure indicate the resin, and the arrows indicate the flow direction of the resin.
このように構成された樹脂封止用金型においては、ポッ
ト１に注入された樹脂がランナ２．ゲート４を経てキャ
ビティ３内に流入する。In the resin sealing mold configured in this way, the resin injected into the pot 1 is transferred to the runner 2. It flows into the cavity 3 through the gate 4.
ところで、従来の樹脂封止用金型においては、ランナ２
に対するゲート４の傾斜角度が第５図に示すように全て
同一に設定されているため、樹脂のキャビティ３への流
入に対して同一の樹脂流れ抵抗をもち、この結果樹脂流
れ速度が同一になってポット１から近い順序すなわち第
４図に示すＡ。By the way, in the conventional resin molding mold, the runner 2
Since the inclination angles of the gates 4 are all set to be the same as shown in FIG. In the order closest to pot 1, that is, A shown in FIG.
Ｂ、Ｃの順序でキャビティ３内に樹脂が充填される。し
たがって、キャビティ３内の樹脂はポット１から離間す
るにつれて硬化反応が進んでいるため、樹脂封止時にボ
ット１に遠いキャビティ３内に空間部が形成されて成形
不良が発生するという問題があった。The resin is filled into the cavity 3 in the order of B and C. Therefore, since the curing reaction of the resin in the cavity 3 progresses as it moves away from the pot 1, there is a problem in that a space is formed in the cavity 3 that is far from the pot 1 during resin sealing, resulting in molding defects. .
本発明はこのような事情に鑑みなされたもので、樹脂封
止時にキャビティ内に樹脂を同時に流入させることがで
き、もって成形不良の発生を防止することができる樹脂
封止用金型を提供するものである。The present invention was made in view of the above circumstances, and provides a mold for resin sealing that allows resin to simultaneously flow into the cavity during resin sealing, thereby preventing the occurrence of molding defects. It is something.
本発明に係る樹脂封止用金型は、複数のゲートを各ゲー
ト内の樹脂流れ抵抗がランチの樹脂流入側から離間する
つれて順次小さくなる構造に形成したものである。The resin sealing mold according to the present invention has a plurality of gates formed in such a structure that the resin flow resistance within each gate gradually decreases as the gate moves away from the resin inflow side of the launch.
本発明においては、ゲート内の樹脂流れ速度をランナの
樹脂流入側から離間するにつれて順次大きくすることが
できる。In the present invention, the resin flow speed within the gate can be gradually increased as the distance from the resin inflow side of the runner increases.
第１図は本発明に係る樹脂封止用金型を示す平面図、第
２図は同じく樹脂封止用金型のランナとゲートの配置状
態を示す簡略図で、同図以下において第４図および第５
図と同一の部材については同一の符号を付し、詳細な説
明は省略する。同図において、符号１１で示す６個のゲ
ートは各ゲート内の樹脂流れ抵抗が前記ランナ２の樹脂
流入側から離間するにつれて順次小さくなる構造に形成
されている。すなわち、これらゲート１１のうち前記ボ
ット１に最も近いゲート、最も遠いゲート。FIG. 1 is a plan view showing a mold for resin sealing according to the present invention, and FIG. 2 is a simplified diagram showing the arrangement of runners and gates of the mold for resin sealing. and the fifth
The same members as those in the figures are given the same reference numerals, and detailed explanations will be omitted. In the figure, six gates indicated by reference numeral 11 are formed in such a structure that the resin flow resistance within each gate decreases successively as the distance from the resin inflow side of the runner 2 increases. That is, among these gates 11, the gate closest to the bot 1 and the farthest gate.
これら両ゲート間のゲートを各々Ｄ、Ｅ、Ｆとすると、
ゲートＤは前記ランナ２内の樹脂流れ方間に反対側に傾
斜し、前記ゲートＥは樹脂流れ方向側に傾斜し、またゲ
ートＦはその樹脂流れ方向と直角な方向に延在する構造
に形成されている。そして、ゲー）Ｅ、Ｆ、Ｄの順にゲ
ート内の断面積が大きくなるように設定されている。If the gates between these two gates are D, E, and F, respectively,
Gate D is inclined in the direction opposite to the resin flow direction in the runner 2, gate E is inclined in the resin flow direction, and gate F is formed to extend in a direction perpendicular to the resin flow direction. has been done. The cross-sectional area within the gate is set to increase in the order of gates E, F, and D.
このように構成された樹脂封止用金型においては、ゲー
ト１１内の樹脂流れ速度をランナ２の樹脂流入側から離
間するにつれて順次太き（することができる。すなわち
、ゲート１１内の単位時間当たりの樹脂流れ量はゲート
Ｅ、Ｆ、Ｄの順に大きくなり、全てのキャビティ３内に
はボット１に注入された樹脂をランナ２．ゲート４を経
て同時に流入させることができる。In the resin sealing mold configured in this way, the resin flow velocity within the gate 11 can be gradually increased as the velocity increases away from the resin inflow side of the runner 2. That is, the unit time within the gate 11 can be increased. The resin flow rate increases in the order of gates E, F, and D, and the resin injected into the bot 1 can flow into all the cavities 3 via the runner 2 and gate 4 at the same time.
なお、本実施例においては、ゲート１１の延在方向を考
慮する構造としたが、本発明はこれに限定されるもので
はなく、各ゲートの大きさと長さが異なる構造としてゲ
ート内の樹脂流れ抵抗を変更するものでも実施例と同様
の効果を奏する。この場合、第３図に示すようにランナ
２に対するフレーム５の配置角度αによってゲート長さ
を変更することができる。In this embodiment, a structure is adopted in which the extending direction of the gate 11 is taken into consideration, but the present invention is not limited to this, and a structure in which each gate has a different size and length is used to control the flow of resin within the gate. Even if the resistance is changed, the same effect as in the embodiment can be obtained. In this case, the gate length can be changed by changing the arrangement angle α of the frame 5 with respect to the runner 2, as shown in FIG.
また、本発明におけるキャビティ３の個数は前述した実
施例に限定されず、例えば５個、７個でもよく、その個
数は適宜変更することが自由である。Furthermore, the number of cavities 3 in the present invention is not limited to the embodiments described above, and may be, for example, five or seven, and the number can be changed as appropriate.
以上説明したように本発明によれば、複数のゲートを各
ゲート内の樹脂流れ抵抗がランナの樹脂流入側から離間
するつれて順次小さくなる構造に形成したので、ゲート
内の樹脂流れ速度をランチの樹脂流入側から離間するに
つれて大きくすることができ、全てのキャビティ内に樹
脂を同時に流入させることができる。したがって、従来
のように樹脂封止時にキャビティ内に空間部が形成され
ることがないから、成形不良の発生を確実に防止するこ
とができ、半導体素子を樹脂封止する場合に使用してき
わめて有効である。As explained above, according to the present invention, the plurality of gates are formed in a structure in which the resin flow resistance in each gate becomes smaller as the resin flow resistance increases as the distance from the resin inflow side of the runner increases. The size can be increased as the distance from the resin inflow side increases, and resin can flow into all cavities at the same time. Therefore, unlike conventional methods, no space is formed in the cavity during resin sealing, and molding defects can be reliably prevented, making it extremely useful when sealing semiconductor elements with resin. It is valid.
第１図は本発明に係る樹脂封止用金型を示す平面図、第
２図は同じく樹脂封止用金型のランナとゲートの配置状
態を示す簡略図、第３図は他の実施例におけるゲートの
配置状態を示す簡略図、第４図は従来の樹脂封止用金型
を示す平面図、第５図はそのランナとゲートの配置状態
を示す簡略図である。
１・・・・ポット、２・・・・ランナ、３・・・・キャ
ビティ、１１・・・・ゲート。Fig. 1 is a plan view showing a mold for resin sealing according to the present invention, Fig. 2 is a simplified diagram showing the arrangement of runners and gates of the mold for resin sealing, and Fig. 3 is another embodiment. FIG. 4 is a plan view showing a conventional resin sealing mold, and FIG. 5 is a simplified diagram showing the arrangement of the runner and gate. 1... Pot, 2... Runner, 3... Cavity, 11... Gate.
Claims (1)
ナの延在方向に所定の間隔を隔てて並設された複数のキ
ャビティを備えた樹脂封止用金型において、前記ゲート
を各ゲート内の樹脂流れ抵抗が前記ランナの樹脂流入側
から離間するにつれて順次小さくなる構造に形成したこ
とを特徴とする樹脂封止用金型。In a resin sealing mold having a plurality of cavities connected to both sides of a runner via gates and arranged in parallel at predetermined intervals in the extending direction of the runner, A mold for resin sealing, characterized in that the resin flow resistance is formed in such a structure that the resin flow resistance gradually decreases as the distance from the resin inflow side of the runner increases.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14881186A JPS635540A (en) | 1986-06-25 | 1986-06-25 | Metal mold for resin sealing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14881186A JPS635540A (en) | 1986-06-25 | 1986-06-25 | Metal mold for resin sealing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS635540A true JPS635540A (en) | 1988-01-11 |
Family
ID=15461240
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14881186A Pending JPS635540A (en) | 1986-06-25 | 1986-06-25 | Metal mold for resin sealing |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS635540A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0486862U (en) * | 1990-11-30 | 1992-07-28 | ||
| JP2013522086A (en) * | 2010-03-15 | 2013-06-13 | クラフト・フーヅ・リサーチ・アンド・ディベロップメント・インコーポレイテッド | Improved co-injection molding |
-
1986
- 1986-06-25 JP JP14881186A patent/JPS635540A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0486862U (en) * | 1990-11-30 | 1992-07-28 | ||
| JP2013522086A (en) * | 2010-03-15 | 2013-06-13 | クラフト・フーヅ・リサーチ・アンド・ディベロップメント・インコーポレイテッド | Improved co-injection molding |
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