JPS6354472A - Electrically conductive paste - Google Patents
Electrically conductive pasteInfo
- Publication number
- JPS6354472A JPS6354472A JP61108118A JP10811886A JPS6354472A JP S6354472 A JPS6354472 A JP S6354472A JP 61108118 A JP61108118 A JP 61108118A JP 10811886 A JP10811886 A JP 10811886A JP S6354472 A JPS6354472 A JP S6354472A
- Authority
- JP
- Japan
- Prior art keywords
- metal
- conductive metal
- electrically conductive
- conductive
- conductive paste
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims abstract description 36
- 229910052751 metal Inorganic materials 0.000 claims abstract description 36
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 17
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 13
- 230000005012 migration Effects 0.000 claims abstract description 10
- 238000013508 migration Methods 0.000 claims abstract description 10
- 229910052802 copper Inorganic materials 0.000 claims abstract description 8
- 239000010949 copper Substances 0.000 claims abstract description 8
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 6
- 238000004898 kneading Methods 0.000 claims abstract 3
- 239000002923 metal particle Substances 0.000 claims description 10
- 239000011342 resin composition Substances 0.000 claims description 2
- 239000002245 particle Substances 0.000 abstract description 7
- 230000003647 oxidation Effects 0.000 abstract description 4
- 238000007254 oxidation reaction Methods 0.000 abstract description 4
- 239000011347 resin Substances 0.000 abstract description 3
- 229920005989 resin Polymers 0.000 abstract description 3
- 239000013528 metallic particle Substances 0.000 abstract 2
- 239000003973 paint Substances 0.000 description 7
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- 244000062175 Fittonia argyroneura Species 0.000 description 3
- 239000000463 material Substances 0.000 description 2
- 235000017166 Bambusa arundinacea Nutrition 0.000 description 1
- 235000017491 Bambusa tulda Nutrition 0.000 description 1
- 241001330002 Bambuseae Species 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 235000015334 Phyllostachys viridis Nutrition 0.000 description 1
- 239000011425 bamboo Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Paints Or Removers (AREA)
- Conductive Materials (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
この発明は導電性ペーストに関し、詳しくは印！ｇｌｉ
ｂｉ″ｆＨ板など川の導電塗料として適した々１電竹ベ
ーストに係わるｂのである。[Detailed Description of the Invention] (Industrial Application Field) This invention relates to a conductive paste. gli
This is related to the electric bamboo base, which is suitable as a conductive paint for materials such as bi″fH boards.
（従来の技術）
従来、導電性）ｉ！利は導電性の高い銀粒子を配合した
銀糸の塗料が広く使用されている。しふしながら、銀糸
の塗料は高価であり、かつ形成した塗膜内の銀が湿気に
対しＣイオン化してしまい、いわゆるマイグレーション
を生ずる問題があることより、銀糸の塗料に代えるもの
として最近Ｃは銅粒子を配合した銅系の塗料が開発され
ている。(Conventional technology) Conventional, conductive) i! Silver thread paint containing highly conductive silver particles is widely used. However, silver thread paints are expensive, and the silver in the formed coating film becomes C ionized by moisture, causing so-called migration, so C has recently been used as an alternative to silver thread paints. Copper-based paints containing copper particles have been developed.
（発明が解決しようとする問題点）
しかしながら、銅系の塗料塗膜においては銅粒子の酸化
が早くて導体抵抗が大きくなるとともに、前記銀と同様
マイグレーションの問題が残１１Ｌ、実用化しにくい問
題点があった。(Problems to be Solved by the Invention) However, in copper-based paint coatings, the copper particles oxidize quickly, increasing the conductor resistance, and there remains the same migration problem as with silver, making it difficult to put it into practical use. was there.
そこで本発明は、上記間ｉｆに鑑み、良好な々電？す料
となし得る導電性ペーストをＥ供りるものである。すな
わち、本発明の目的は、配合された導電性金属粒子のマ
グレーション防止および酸化防止がされ、かつ安価にし
実用化し得る導電性ぺ−ストを提供することにある。Therefore, in view of the above-mentioned conditions, the present invention provides a good electric current. It provides a conductive paste that can be used as a material. That is, an object of the present invention is to provide a conductive paste which prevents migration and oxidation of the conductive metal particles contained therein, and which can be made inexpensive and put to practical use.
（問題点を解決するための手段）
上記問題点を解決するためにこの発明の手段は、微ＩＩ
など）電性金属粒子と樹脂組成物とを混ｖＡすることに
より構成された導電性ペーストにおいて、前記金属粒子
は、第１の導電性金属よりなる核の表面に第２の導電性
金属よりなる被膜を形成することにより構成されたｍ
Ｗ性ペーストとされる。(Means for Solving the Problems) In order to solve the above problems, the means of the present invention are
etc.) In a conductive paste constituted by mixing conductive metal particles and a resin composition, the metal particles have a core made of a first conductive metal and a core made of a second conductive metal on the surface of the core made of the first conductive metal. m constructed by forming a film
It is considered to be a W paste.
そして、前記第２の導電性金属は、前記第１の導電性金
属よりもマイグレーションが発生しにくい金属よりなる
もののとされる。前記第１のＩ！導電性金属、例えば銅
であり、前記第２の導電性金属は、例えばニッケルとさ
れる。The second conductive metal is made of a metal that is less likely to undergo migration than the first conductive metal. Said first I! The conductive metal is, for example, copper, and the second conductive metal is, for example, nickel.
（作 用）
第１の導電性金属は酸化されにくくかつマイグレーショ
ンの生じにくい金属が使用されることより、
第１の導電性金属の金属粒子は第２の導電性金属の被膜
にて保護される。保護の程度は第２の導電性金属の性質
にて相異し、両導電性金属の金属粒子は安価なものが選
択使用される。(Function) Since the first conductive metal is a metal that is less likely to be oxidized and less prone to migration, the metal particles of the first conductive metal are protected by the coating of the second conductive metal. . The degree of protection differs depending on the properties of the second conductive metal, and inexpensive metal particles are selected for both conductive metals.
（実施例） 次に、本発明の一実施例を説明する。(Example) Next, one embodiment of the present invention will be described.
ニッケルの被膜を形成した微細な銅粉の所定量が用意さ
れる。本例の被膜形成銅粉は粒径０．０３〜３．００μ
の銅粉に化学メッキあるいは電気メッキのメッキ付は処
理がされ、銅粉の核の外面全体に０．２〜０．５μのニ
ッケルの被膜が形成されているものである。被膜形成し
た本例の銅粉単体の比抵抗は第１表に示す通りであり、
同表に示した対照の金属粒子銀粉、銅粉、ニッケル粉、
炭素粉の単体に較べて小さい値であり、導電性は銀粒子
。A predetermined amount of fine copper powder coated with nickel is prepared. The film-forming copper powder of this example has a particle size of 0.03 to 3.00μ.
The copper powder is treated with chemical plating or electroplating to form a nickel film of 0.2 to 0.5 μm on the entire outer surface of the core of the copper powder. The specific resistance of the copper powder of this example formed into a film is as shown in Table 1,
Control metal particles shown in the same table: silver powder, copper powder, nickel powder,
This value is smaller than that of carbon powder alone, and the conductivity is that of silver particles.
銅粒子と同等に良好である。As good as copper particles.
第１表
しかして、本例の被ｌＩＱ形成銅粉はエボギシ樹脂およ
び溶剤と第２表の／、１１合にて配合し混練して導電性
ペーストとされる。As shown in Table 1, the IQ-forming copper powder of this example is blended with Evogishi resin and a solvent in amounts of / and 11 in Table 2 and kneaded to form a conductive paste.
（ｑられた本例の５ｇ電性ペーストは従来の導電性塗料
と同様の粘性を有していて、印刷回路基板の回路パター
ン形成に印刷塗布される。回路パターンを印刷塗布した
印刷回路基板は、例えば１２０℃５分の熱処理がされ回
路パターンの塗膜が乾燥されるが、本例の回路パターン
番は塗膜内のニッケル被膜形成した銅粉が酸化されるこ
となく、回路パターンの導電性は良好であった。(The 5g conductive paste of this example has a viscosity similar to that of conventional conductive paint, and is applied by printing to form a circuit pattern on a printed circuit board.The printed circuit board on which the circuit pattern is printed and applied is For example, the circuit pattern coating film is dried by heat treatment at 120°C for 5 minutes, but the circuit pattern number in this example is such that the copper powder forming the nickel film in the coating film is not oxidized and the conductivity of the circuit pattern is was in good condition.
（発明の効果）
本発明の導電性ペーストにおジノる導電性金属粒子は、
第１の導電性金属の核の表面を第２の導電性金属にで被
膜形成した８Ｓ造にされていることにより、被膜形成し
た金属粒子は、導電性良好であり、かつ第１の導電性金
属の核ｔよ第２の導電性金属の被膜にて保護され、核の
マイグレーションや酸化が防止される。このため、第１
の導電性金属の核は銅粉などの酸化され易い導電性金属
であっても差し支えなく、第２の導電性金属において酸
化防止あるいはマイグレーション防止を考虐すれば良い
ことより、被膜形成した金属粒子は安価にすることがで
き、かつ実施し易いものである。(Effect of the invention) The conductive metal particles included in the conductive paste of the present invention are
Due to the 8S construction in which the surface of the core of the first conductive metal is coated with the second conductive metal, the coated metal particles have good conductivity, and the first conductive metal core has good conductivity. The metal core t is protected by the second conductive metal film, thereby preventing migration and oxidation of the core. For this reason, the first
The core of the conductive metal may be a conductive metal that is easily oxidized, such as copper powder, and it is sufficient to prevent oxidation or migration in the second conductive metal. can be made inexpensive and easy to implement.
なお、本発明による３ＩＪ電性ペーストは従来のものと
同様に回路基板の回路パターンの印刷などに使用される
。Incidentally, the 3IJ electric paste according to the present invention can be used for printing circuit patterns on circuit boards, etc. in the same way as conventional pastes.
Claims (3)
ことにより構成された導電性ペーストにおいて、 前記金属粒子は、第１の導電性金属よりなる核の表面に
第２の導電性金属よりなる被膜を形成することにより構
成されたことを特徴とする導電性ペースト。(1) In a conductive paste formed by kneading fine conductive metal particles and a resin composition, the metal particles have a second conductive metal on the surface of a core made of a first conductive metal. A conductive paste characterized in that it is constituted by forming a film consisting of:
よりもマイグレーションが発生しにくい金属よりなるこ
とを特徴とする特許請求の範囲第１項記載の導電性ペー
スト。(2) The conductive paste according to claim 1, wherein the second conductive metal is made of a metal that is less likely to undergo migration than the first conductive metal.
導電性金属はニッケルであることを特徴とする特許請求
の範囲第２項記載の導電性ペースト。(3) The conductive paste according to claim 2, wherein the first conductive metal is copper and the second conductive metal is nickel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61108118A JPS6354472A (en) | 1986-05-12 | 1986-05-12 | Electrically conductive paste |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61108118A JPS6354472A (en) | 1986-05-12 | 1986-05-12 | Electrically conductive paste |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6354472A true JPS6354472A (en) | 1988-03-08 |
Family
ID=14476372
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61108118A Pending JPS6354472A (en) | 1986-05-12 | 1986-05-12 | Electrically conductive paste |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6354472A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4857233A (en) * | 1988-05-26 | 1989-08-15 | Potters Industries, Inc. | Nickel particle plating system |
| CN104801709A (en) * | 2015-03-20 | 2015-07-29 | 邱羽 | Nickel-coated copper clad metal powder and preparation method and application thereof |
-
1986
- 1986-05-12 JP JP61108118A patent/JPS6354472A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4857233A (en) * | 1988-05-26 | 1989-08-15 | Potters Industries, Inc. | Nickel particle plating system |
| CN104801709A (en) * | 2015-03-20 | 2015-07-29 | 邱羽 | Nickel-coated copper clad metal powder and preparation method and application thereof |
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