JPS635395Y2 - - Google Patents

Info

Publication number
JPS635395Y2
JPS635395Y2 JP16400483U JP16400483U JPS635395Y2 JP S635395 Y2 JPS635395 Y2 JP S635395Y2 JP 16400483 U JP16400483 U JP 16400483U JP 16400483 U JP16400483 U JP 16400483U JP S635395 Y2 JPS635395 Y2 JP S635395Y2
Authority
JP
Japan
Prior art keywords
cable
cutting
disc
plate
cutting mechanism
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP16400483U
Other languages
Japanese (ja)
Other versions
JPS5995722U (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP16400483U priority Critical patent/JPS5995722U/en
Publication of JPS5995722U publication Critical patent/JPS5995722U/en
Application granted granted Critical
Publication of JPS635395Y2 publication Critical patent/JPS635395Y2/ja
Granted legal-status Critical Current

Links

Description

【考案の詳細な説明】 本考案はケーブルの絶縁被覆を一定の厚みだけ
(特に外部半導電層を)切削するに適したケーブ
ル絶縁被覆切削装置に関するものである。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a cable insulation sheath cutting device suitable for cutting the insulation sheath of a cable by a predetermined thickness (particularly the outer semiconductive layer).

従来上記作業は実公昭52−3653で示された電線
ケーブルの絶縁被覆切削装置を用いてケーブルの
絶縁被覆を一定の厚みだけ切削しているが、この
場合手動でケーブル横断面の接線方向に回転させ
るため回転トルクが一定にできず切削されたケー
ブルの仕上面には凸凹が生じ、又切削された外部
半導電層がケーブル表面に巻きつきこれを取除く
のに別の刃物で切落したりするので、ケーブルの
切削仕上表面を傷つけるおそれがあつた。更にケ
ーブルの大容量化,高圧化に伴ないケーブルサイ
ズが大きくなると切削されるケーブル長が長くな
り、上記手動作業及び巻きついた切削屑の取除き
作業には非常な労力を必要とする欠点がある。
Conventionally, the above-mentioned work has been carried out by cutting the insulation coating of the cable to a certain thickness using the electric wire/cable insulation coating cutting device shown in Japanese Utility Model Publication No. 52-3653, but in this case, the cable must be rotated manually in the tangential direction of the cross section of the cable. Because of this, the rotational torque cannot be kept constant, resulting in unevenness on the finished surface of the cut cable, and the cut outer semiconducting layer wraps around the cable surface and has to be cut off with another knife to remove it. Therefore, there was a risk of damaging the cut surface of the cable. Furthermore, as the cable size increases due to the increase in cable capacity and pressure, the length of the cable to be cut becomes longer, and the above-mentioned manual work and removal of entangled cutting debris has the disadvantage of requiring a great deal of effort. be.

本考案は上記欠点を解決するためになされたも
のである。すなわち中央にケーブルを挿通せしめ
るための円形切欠きを有する略円盤状板のツバ部
の表面に前記円形切欠きの中心に刃先を向けてバ
イトをその固定位置が変位可能に取付け、かつ前
記円形切欠きの内部に挿通されるケーブルの表面
を挾持するとともに装置全体の移動を案内するた
めのロール(通常3個以上)をその固定位置が変
位可能にかつその自由端がケーブル横断面の接線
方向に傾くように取付けられてなる切削機構の裏
面に、円形切欠きを有する円盤状ギヤを前記円盤
状板と同心的に取付けかつ前記円盤状ギヤの外側
面に、ケーブルの挿通できる円形切欠きを有する
ホルダープレート板を密接し、円盤状板とホルダ
ープレート板は独立して回転できるよう係合し、
ホルダープレート板にモーターを取付け固定する
とともに、該モーターにより駆動されるギヤが前
記円盤状ギヤと噛合うように設置し、モーターの
駆動により切削機構をケーブルの周囲に回転でき
るようにし、かつこの切削機構のツバ部に回転可
能に貫挿されたシヤフトで回転するように装着さ
れた外部半導電層切削屑巻取用ボビンを設け、ケ
ーブル切削仕上面を傷つけることなく切削し、切
削屑を巻取り除去するようにした。
The present invention has been made to solve the above-mentioned drawbacks. That is, a cutting tool is attached to the surface of the collar of a substantially disc-shaped plate having a circular notch in the center for passing a cable through, with the cutting edge directed toward the center of the circular notch, and the cutting tool is attached so that its fixed position can be displaced. Rolls (usually 3 or more) that clamp the surface of the cable inserted into the notch and guide the movement of the entire device are movable in their fixed position and their free ends are oriented in the tangential direction of the cross section of the cable. A disc-shaped gear having a circular notch is attached concentrically to the disc-shaped plate on the back surface of the cutting mechanism mounted so as to be tilted, and the disc-shaped gear has a circular notch on the outer surface through which a cable can be inserted. The holder plate is brought into close contact with the disc-shaped plate and the holder plate are engaged so that they can rotate independently.
A motor is attached and fixed to the holder plate, and a gear driven by the motor is installed so as to mesh with the disc-shaped gear, so that the cutting mechanism can be rotated around the cable by the drive of the motor, and the cutting mechanism can be rotated around the cable by driving the motor. A bobbin for winding up cutting waste from the external semiconductive layer is provided, which is mounted so as to be rotated by a shaft that is rotatably inserted into the collar of the mechanism, so that the cable can be cut without damaging the finished surface of the cable, and the cutting waste can be wound up. I tried to remove it.

次に本考案の実施例を第1図〜第2図を参照し
て説明する。
Next, an embodiment of the present invention will be described with reference to FIGS. 1 and 2.

切削機構は実公昭52−3653で示された切削機構
を改良したもので、1は中央に円形切欠きを有す
る略円形状の円盤状板、12は前記円盤状板1の
表面に一体に取付けたバイト固定台、13は前記
円盤に刻設したロール固定台の摺動溝、14はロ
ール固定台の位置決めを行うための長孔、2はケ
ーブルの表面を挾持するためのロール、21は前
記ロールをボールベアリングを介して支持するた
めの支持軸でこの軸の自由端はX軸すなわちケー
ブル横断面の接線方向に傾いている。22は前記
支持軸21の一端を固定せしめる小判形のロール
固定台で前記摺動溝13に沿つて移動する。23
は前記固定台22を前記円盤状板1に位置決めし
て固定させるためのボルトでこれは長孔14に係
合する。16は位置決め用目盛である。24は前
記ロール固定台22を座金,ストツプリングによ
つて前記ボルト23と係合して固定させる押えボ
ルトである。3は先端に切刃を有するバイト、3
2はバイト3の位置決め用ボルト、33はバイト
の送り微調整用ネジでこれらがケーブルの周囲を
回転し、ケーブルの被覆の一定の厚みを切削する
切削機構10を構成している。4は導体41,絶
縁被覆42,外部半導電層44よりなるケーブル
であり、43はバイト3によつて切削された外部
半導電層切削屑である。55は前記切削機構10
と後述するモーター6によつて切削機構10がケ
ーブルの周囲を回転できるようにさせるための同
じく後述するホルダープレート板5とを回転可能
に係合させるための円盤で中央にケーブル4を挿
通できる円形切欠きを有し、該円形切欠きは前記
ホルダープレート板5の円形切欠きと同じ内径を
有している。56は前記円盤55を回転可能に支
持するために円盤状板1の表面上に円盤状板1の
円形切欠きの円周に沿つて同心的に刻設された凹
部である。5はケーブル4を挿通する円形切欠き
を有するホルダープレート板でこれが前記円盤5
5でネジ止され(図示されていないが)円盤状板
1と同心的であつて相互に係合し独立して回転可
能になつている。更にこれにモーター6と切削機
構10を駆動するためのギヤ51が設けられてお
り、ギヤ51は切削機構10の裏面に円盤状板1
と同心的に取付固定されているギヤ52に噛み合
い、モーター6の駆動はギヤ51,52を介して
切削機構10を回転し得るようになつている。な
おギヤ52にはケーブル4を挿通する円形切欠き
が設けられている。9はモーター6の移動を案内
させるための把手でホルダープレート板5の側面
に取付けられている。
The cutting mechanism is an improved version of the cutting mechanism shown in Utility Model Publication No. 52-3653, in which 1 is a substantially circular disc-shaped plate with a circular notch in the center, and 12 is integrally attached to the surface of the disc-shaped plate 1. 13 is a sliding groove for the roll fixing base carved in the disc; 14 is a long hole for positioning the roll fixing base; 2 is a roll for clamping the surface of the cable; 21 is the roll fixing base; A support shaft for supporting the rolls via ball bearings, the free end of which is inclined in the direction of the X-axis, that is, tangential to the cross section of the cable. Reference numeral 22 denotes an oval-shaped roll fixing base that fixes one end of the support shaft 21 and moves along the sliding groove 13. 23
is a bolt for positioning and fixing the fixing base 22 to the disc-shaped plate 1; this bolt engages with the elongated hole 14; 16 is a positioning scale. Reference numeral 24 denotes a presser bolt that engages with and fixes the roll fixing base 22 to the bolt 23 using a washer and a stop ring. 3 is a cutting tool with a cutting edge at the tip, 3
Numeral 2 is a bolt for positioning the cutting tool 3, and numeral 33 is a screw for finely adjusting the feed of the cutting tool.These rotate around the cable and constitute a cutting mechanism 10 that cuts a certain thickness of the cable coating. 4 is a cable consisting of a conductor 41, an insulating coating 42, and an outer semiconducting layer 44, and 43 is cutting waste of the outer semiconducting layer cut by the cutting tool 3. 55 is the cutting mechanism 10
A disk for rotatably engaging a holder plate 5, which will also be described later, to allow the cutting mechanism 10 to rotate around the cable by a motor 6, which will be described later, and a circular shape through which the cable 4 can be inserted through the center. It has a notch, and the circular notch has the same inner diameter as the circular notch of the holder plate plate 5. Reference numeral 56 denotes a recess concentrically carved on the surface of the disk-like plate 1 along the circumference of the circular cutout of the disk-like plate 1 in order to rotatably support the disk 55. 5 is a holder plate plate having a circular notch through which the cable 4 is inserted; this is the disk 5;
It is screwed at 5 (not shown) and is concentric with the disk-shaped plate 1, so that they engage with each other and can rotate independently. Furthermore, a gear 51 for driving the motor 6 and the cutting mechanism 10 is provided.
The motor 6 is driven to rotate the cutting mechanism 10 via the gears 51 and 52. Note that the gear 52 is provided with a circular notch through which the cable 4 is inserted. A handle 9 is attached to the side surface of the holder plate 5 to guide the movement of the motor 6.

本実施例では切削機構10とホルダープレート
板5とは円盤55を介して係合したが他の手段例
えば円盤状板1の円形切欠きの内部にベアリング
を介して係合させてもよいことは勿論である。
In this embodiment, the cutting mechanism 10 and the holder plate 5 are engaged with each other via the disk 55, but they may be engaged with each other through other means such as a bearing inside a circular notch in the disk-shaped plate 1. Of course.

ケーブル4の表面に巻きついた切削屑43を切
削機構10に一体に取付けた切削屑巻取機8によ
つて巻取る機構は第2図に示されている。81は
切削屑巻取用のボビン、82はボビン81を切削
機構10のツバ部に回転可能に貫挿させるための
シヤフト、83は切削機構10のツバ部に設けら
れた貫挿用孔でシヤフト82が貫挿される。84
はシヤフト82の一端部に一体に固定取付けられ
た円盤状ギヤ、85はギヤ84と噛合い、かつホ
ルダープレート板5に一体固定されている円盤状
のギヤでケーブルが挿通されるべき円形の切欠き
を有する。
A mechanism for winding up cutting waste 43 wound around the surface of the cable 4 by a cutting waste winder 8 integrally attached to the cutting mechanism 10 is shown in FIG. 81 is a bobbin for winding up cutting waste, 82 is a shaft for rotatably inserting the bobbin 81 into the collar of the cutting mechanism 10, and 83 is a shaft with a penetration hole provided in the collar of the cutting mechanism 10. 82 is penetrated. 84
85 is a disc-shaped gear that is integrally fixed to one end of the shaft 82, and 85 is a disc-shaped gear that meshes with the gear 84 and is integrally fixed to the holder plate 5, and a circular cut through which the cable is to be inserted. It has a chip.

次に本考案の作用を述べる。 Next, the function of the present invention will be described.

まず円盤状板1の中央の円形切欠きに対して垂
直に挿通せしめたケーブル4の表面に向つて各ロ
ール2がケーブルの表面に接し、かつ表面をしつ
かりと挾持する位置迄ロール固定台22を摺動溝
13に沿つて摺動させ、この位置においてボルト
23及び押えボルト24を調整して締付円盤状板
1のツバ部に前記固定台22を一体に固定せしめ
る。
First, move the roll fixing base 22 toward the surface of the cable 4 inserted perpendicularly to the circular notch in the center of the disc-shaped plate 1 until each roll 2 touches the surface of the cable and firmly clamps the surface. is slid along the sliding groove 13, and at this position, the bolt 23 and presser bolt 24 are adjusted to integrally fix the fixing base 22 to the collar portion of the tightening disc-shaped plate 1.

次にバイト3をその先端の切刃を所定の深さだ
け外部半導電層43に食込ませた後、バイト3を
ネジ32によりバイト固定台に固定する。このよ
うにセツトした後モーター6で切削機構10を回
転させると切削機構10がケーブル4の横断面の
接線方向を回転し、切削加工を行なうとともに把
手9によつて切削機構10及びモーター6をケー
ブルの軸方向であるY軸に移動させる。
Next, the cutting edge of the tip of the cutting tool 3 is bitten into the external semiconductive layer 43 by a predetermined depth, and then the cutting tool 3 is fixed to the cutting tool fixing base with the screw 32. After setting in this way, when the cutting mechanism 10 is rotated by the motor 6, the cutting mechanism 10 rotates in the tangential direction of the cross section of the cable 4, performs cutting, and the handle 9 connects the cutting mechanism 10 and the motor 6 to the cable. , along the Y-axis.

切削機構10がモーター6の作用で回転しバイ
ト3で外部半導電層44が切削されると切削屑4
3がボビン81に巻きつき、ボビン81が切削機
構10とともに回転しながら、かつギヤ84,ギ
ヤ85の作用により切削機構10と反対方向に自
転していくので、上記切削屑43はボビン81に
巻き取られて行く。
When the cutting mechanism 10 rotates under the action of the motor 6 and the external semiconductive layer 44 is cut by the cutting tool 3, cutting waste 4 is generated.
3 is wound around the bobbin 81, and the bobbin 81 rotates together with the cutting mechanism 10 and rotates in the opposite direction to the cutting mechanism 10 due to the action of the gears 84 and 85, so the cutting waste 43 is wound around the bobbin 81. It will be taken away.

上記第2図に示した切削屑巻取に於てはギヤ8
4,ギヤ85の作用でボビン81が自転しながら
切削屑43を巻取つたが、前記ギヤ84,ギヤ8
5を取除きシヤフト82を貫挿用孔83に一体固
定して切削機構10とともに回転させ、ボビン8
1は自転させなくても切削屑43を巻取れること
は勿論である。
In the cutting waste take-up shown in Fig. 2 above, gear 8
4. The bobbin 81 rotates and winds up the cutting waste 43 due to the action of the gear 85, but the gear 84 and the gear 8
5 is removed, the shaft 82 is integrally fixed in the penetration hole 83 and rotated together with the cutting mechanism 10, and the bobbin 8
1 can of course wind up the cutting waste 43 without rotating.

なお上記実施例ではいずれも切削屑43がケー
ブル4の囲りに巻きついていかない前に巻き取つ
たが、これが巻きついた後でも巻取れることは勿
論である。更に切削屑43が切削されて行く方向
に沿つて既に巻きついている切削屑の上に重なつ
て巻きついている場合には外部半導電層切削完了
後逆方向に本装置を戻していけばケーブル4の囲
りに巻きついた切削屑43は容易に巻取ることが
できる。
In each of the above embodiments, the cutting waste 43 is wound up before it is wrapped around the cable 4, but it is of course possible to wind it up even after the cutting waste 43 is wound around the cable 4. Furthermore, if the cutting waste 43 is wrapped around the cutting waste already wrapped in the cutting direction, the cable 4 can be removed by returning the device in the opposite direction after cutting the external semiconductive layer. The cutting waste 43 wrapped around can be easily rolled up.

本考案によれば上記のようにケーブルを切削機
構に挿通しセツトするだけで自動的にケーブルの
外部半導電層が切削でき、しかも切削屑も容易に
巻取りにより取除くことができ、従来の手動作業
に比べ労力がかからず又ケーブルの切削仕上面が
平滑になり、切削屑を取除くのにケーブルの切削
仕上面を傷つけることもなくなつた。
According to the present invention, the external semiconductive layer of the cable can be automatically cut by simply inserting the cable into the cutting mechanism and setting it as described above, and the cutting waste can also be easily removed by winding up. It requires less effort than manual work, and the cut surface of the cable becomes smoother, so there is no need to damage the cut surface of the cable when removing cutting debris.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の装置の一部切載正面図、第2
図は本考案の装置の実施例の断面図である。 1……円盤状板、2……ロール、3……バイ
ト、4……ケーブル、42……絶縁被覆、43…
…切削屑、44……外部半導電層、5……ホルダ
ープレート、51,52……ギヤ、6……モータ
ー、8……切削屑巻取機、10……切削機構。
Figure 1 is a partially cutaway front view of the device of the present invention;
The figure is a sectional view of an embodiment of the device of the invention. DESCRIPTION OF SYMBOLS 1...Disc-shaped plate, 2...Roll, 3...Bite, 4...Cable, 42...Insulation coating, 43...
... Cutting waste, 44... External semiconductive layer, 5... Holder plate, 51, 52... Gear, 6... Motor, 8... Cutting waste winder, 10... Cutting mechanism.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 中央にケーブルを挿通せしめるための円形切欠
きを有する略円盤状板1のツバ部の表面に前記円
形切欠きの中心に刃先を向けてバイト3をその固
定位置が変位可能に取付け、かつ前記円形切欠き
の内部に挿通されるケーブルの表面を挾持するロ
ール2をその固定位置が変位可能に取付けられて
なる切削機構10の裏面に、円形切欠きを有する
円盤状ギヤ52を前記円盤状板1と同心的に取付
け、かつ前記円盤状ギヤ52の外側面に、ケーブ
ルの挿通できる円形切欠きを有するホルダープレ
ート板5を密接し、円盤状板1とホルダープレー
ト板5は独立して回転できるよう係合し、ホルダ
ープレート板5にモーター6を取付け固定すると
ともに、該モーター6により駆動されるギヤ51
が前記円盤状ギヤ52と噛合うように設置し、モ
ーター6の駆動により切削機構10をケーブルの
周囲に回転できるようにし、かつ切削機構10の
ツバ部に回転可能に貫挿されたシヤフト82で回
転するように装着された外部半導電層切削屑巻取
用ボビンを設けたことを特徴とするケーブルの絶
縁被覆切削装置。
A cutting tool 3 is attached to the surface of the brim portion of a substantially disc-shaped plate 1 having a circular notch in the center for passing a cable through, with the cutting edge directed toward the center of the circular notch, and the fixed position of the cutting tool 3 is movable. A disc-shaped gear 52 having a circular notch is attached to the disc-shaped plate 1 on the back side of a cutting mechanism 10 in which a roll 2 that clamps the surface of a cable inserted into the notch is attached so that its fixed position can be changed. A holder plate plate 5 having a circular notch through which a cable can be inserted is closely attached to the outer surface of the disc-shaped gear 52, so that the disc-shaped plate 1 and the holder plate plate 5 can rotate independently. A gear 51 that engages with the holder plate 5 to attach and fix the motor 6 to the holder plate 5 and is driven by the motor 6.
is installed so as to mesh with the disc-shaped gear 52, so that the cutting mechanism 10 can be rotated around the cable by the drive of the motor 6, and a shaft 82 is rotatably inserted into the collar of the cutting mechanism 10. A cable insulation coating cutting device, characterized in that a bobbin for winding up external semiconductive layer cuttings is rotatably mounted.
JP16400483U 1983-10-25 1983-10-25 Cable insulation coating cutting equipment Granted JPS5995722U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16400483U JPS5995722U (en) 1983-10-25 1983-10-25 Cable insulation coating cutting equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16400483U JPS5995722U (en) 1983-10-25 1983-10-25 Cable insulation coating cutting equipment

Publications (2)

Publication Number Publication Date
JPS5995722U JPS5995722U (en) 1984-06-29
JPS635395Y2 true JPS635395Y2 (en) 1988-02-15

Family

ID=30359682

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16400483U Granted JPS5995722U (en) 1983-10-25 1983-10-25 Cable insulation coating cutting equipment

Country Status (1)

Country Link
JP (1) JPS5995722U (en)

Also Published As

Publication number Publication date
JPS5995722U (en) 1984-06-29

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