JP2001327025A - Cutting tool for external semiconducting layer of cable - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a cutting tool for the external semiconducting layer of a cable, by which the cutting and removing operation of the external semiconductive layer of the cable is performed easily, and by which only the external semiconductive layer can be cut and removed without externally damaging an insulator. SOLUTION: The cutting tool for the external semiconductive layer is provided with a pair of cable guides 13, 14 which sandwich and grip the cable, and a cutting edge 30, which is used to cut and remove the external semiconductive layer of the cable. The fixed cable guide 13 is installed at one end of a U-shaped frame 11, and the movable guide 14 which faces the guide 13 is installed at the other end. A V-groove 13a is formed on the cable gripping face of the guide 13, and a V-groove 14a is formed on the cable-gripping face of the guide 14. A housing space 24 is formed in the central part of the V-groove 13a on the guide 13. The cutting edge 30 is installed in the housing space 24 with its lip being situated on a tangential line in the horizontal direction on the outer circumference of the external semiconductive layer of the cable. The cutting edge 30 as a whole can be moved to the radial direction cable. An urging means 31, which always urges the cutting edge 30 to the direction of the axial center of the cable, is installed inside the housing space 24.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cable outer semiconductive layer cutting tool for cutting and removing an outer semiconductive layer of a cable, and more particularly to a tool for cutting only an outer semiconductive layer without damaging an insulator. The present invention relates to a cable outer semiconductive layer cutting tool that can be cut and removed.

[0002]

2. Description of the Related Art Wires and cables have a coating layer (insulator), an outer semiconductive layer,
And a sheath or the like.

Therefore, when connecting electric wires / cables or connecting cables to other equipment, it is necessary to cut and remove these coating layers.

Conventionally, when performing an operation of cutting and removing an external semiconductive layer at a construction site, a knife, a glass, or the like that does not require a driving source has been widely used.

[0005]

However, the work of cutting and removing the outer semiconductive layer by using a knife or the like is inferior in workability, requires a long time, and may damage the insulator inside the outer semiconductive layer. there were.

SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to solve the above-mentioned problems, to facilitate the cutting and removing operation of the outer semiconductive layer of the cable, and to cut and remove only the outer semiconductive layer without damaging the insulator. To provide a cable outer semiconductive layer cutting tool that can be used.

[0007]

In order to achieve the above object, a first aspect of the present invention is to provide a pair of cable guides for sandwiching and holding a cable, and a cutting blade for cutting and removing an outer semiconductive layer of the cable. An external semiconductive layer cutting tool having a fixed cable guide fixed to one end of a U-shaped frame and a movable cable guide opposed to the fixed cable guide provided at the other end. A V-groove is formed on each of the gripping surfaces, a storage space is formed at the center of the V-groove of the fixed cable guide, and the cutting blade is provided in the storage space.
The cutting edge is located on a horizontal tangent to the outer periphery of the outer semiconductive layer of the cable, and the entire cutting blade is provided so as to be movable in the radial direction of the cable. A cable outer semiconductive layer cutting tool, characterized in that a biasing means for constantly biasing in a direction is provided.

According to a second aspect of the present invention, the cutting blade includes a base mounted on a movable holder movably housed in a storage space, and a blade extending horizontally from an upper end of the base. A release hole for releasing cutting chips of the external semiconductive layer cut by the blade portion is formed in a portion directly below the blade portion of the base portion, and the fixed cable guide is provided with a discharge hole that is continuous with the release hole. The cutting tool according to claim 1, wherein the hole is formed.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 (a) is a front view of a cable outer semiconductive layer cutting tool according to this embodiment, FIG. 1 (b) is a side view, FIG. 2 is a bottom view, and FIG. FIG. 3 is a sectional view taken along line AA in FIG.

As shown in the figure, the cable outer semiconductive layer cutting tool 10 has a U-shaped frame 11, and a pair of cable guides 12 for holding the cable by sandwiching the cable inside the frame 11. Is provided.

The cable guide 12 includes a fixed cable guide 13 fixed to the side portion 11a of the frame 11 by bolts 15, and a movable cable guide 14 provided opposite the fixed cable guide 13.

The movable cable guide 14 is connected to the frame 11
And is fixed by bolts 17 to the inner end of a movable shaft 16 that is movable in the longitudinal direction of the frame 11 (the left-right direction in FIG. 1A).

A spring 20 is provided on the outer periphery of the movable shaft 16 located between the side portion 11b of the frame 11 and the movable cable guide 14, and the movable shaft 16
And movable cable guide 14 to fixed cable guide 1
It is biased to the 3 side.

Also, at the outer end of the movable shaft 16,
A stopper 21 and a knob 22 are provided.

The movable shaft 16 can be fixed at an arbitrary position by a thumb screw 23 provided to penetrate the side portion 11b of the frame 11 so as to cross the movable shaft 16.

The cable gripping surfaces of the fixed cable guide 13 and the movable cable guide 14, that is, the surfaces facing each other, have V grooves 13 for supporting cables.
a and 14a are respectively formed.

An accommodation space 24 for accommodating a cutting blade 30 for cutting the outer periphery of the outer semiconductive layer of the cable is formed in the center of the V-shaped groove 13a of the fixed cable guide 13.

A movable holder 25 is accommodated inside the accommodating space 24 so as to be movable in the longitudinal direction of the accommodating space 24 (the left-right direction in FIG. 1A). A movable spring 31 is provided between the movable spring 31 and the side portion 11a.

A cutting blade 30 is mounted in a groove 26 extending vertically in the center of the movable holder 25.

The cutting blade 30 will be described with reference to FIGS.

FIG. 4 is a plan view of the cutting blade 30, and FIG.
(A) is a front view of the cutting blade 30, and (b) of FIG.
FIG. 6 is a side view of the cutting blade 30, and FIG. 6 is a sectional view taken along line BB in FIG.

As shown in the figure, the cutting blade 30 is composed of an L-shaped base 32 and a blade 33 extending horizontally from an upper end 32a of the base 32. The movable holder 25 can be attached to the movable holder 25 with a bolt or the like by using an attachment hole 34 provided in the base 32.

The blade portion 33 has a flank 33a extending horizontally and a rake face 33b formed in a tapered shape.

Further, in a portion immediately below the blade portion 33 of the base portion 32,
An escape hole 35 is formed to allow the cutting chips of the external semiconductive layer cut by the blade portion 33 to escape.

Returning to FIG. 3, the fixed cable guide 13 is provided with a waste discharge hole 36 so as to be continuous with the escape hole 35 of the cutting blade 30 described above.

Next, the operation of the present invention will be described with reference to FIGS.

FIG. 7 is a perspective view showing a state in which the cable outer semiconductive layer is cut using the cable outer semiconductive layer cutting tool according to the present embodiment, and FIG. FIG. 8B is a front cross-sectional view, and FIG. 8B is a side cross-sectional view illustrating a cutting state.

First, the sheath 44 of the cable 40 composed of the conductor 41, the insulating layer 42, the outer semiconductive layer 43, and the sheath 44 is stripped to expose the outer semiconductive layer 43.

Next, the cable outer semiconductive layer cutting tool 10
, The movable shaft 16 is released, and the movable cable guide 14 is moved upward in FIG.

The cable 40 is connected to the fixed cable guide 13
And the movable cable guide 14 is moved downward in the figure after being positioned between the V-grooves 13a and 14a of the movable cable guide 14, and the cable 40 is firmly gripped.
The movable shaft 16 is fixed by tightening the thumb screw 23.

After gripping the cable 40, the cable 40
Is fixed so as not to rotate, and the cable outer semiconductive layer cutting tool 10 is rotated in the direction of arrow R.

While rotating the cable outer semiconductive layer cutting tool 10, the cable 40 is moved forward in its length direction (S in the figure).
(In the direction shown by the arrow)) to gradually move the outer semiconductive layer 43.
Is cut to the desired length.

When the cutting of the outer semiconductive layer 43 is completed, the thumbscrew 23 is loosened and the movable cable guide 14 is moved upward to take out the cable 40 from the cable outer semiconductive layer cutting tool 10.

FIG. 9 shows the relationship between the cable 40 and the cutting blade 30.
This will be described with reference to FIG.

FIG. 9 is a diagram showing the relationship between the cable 40 and the cutting blade 30 at the beginning of gripping the cable.
FIG. 5 is a diagram showing a relationship between the cable 40 and the cutting blade 30 when cutting the outer semiconductive layer 43.

As shown in FIG. 9A, when the cable 40 is gripped by both cable guides 13 and 14, the cutting blade 3
0 is arranged at right angles to the central axis C of the cable 40.

Further, as shown in FIG.
The tip of the blade portion 33 is located at the center of the cable 40,
The flank 33a is located on the horizontal tangent H around the outer semiconductive layer 43 of the cable 40.

The cutting blade 30 includes a movable spring 31.
Is urged in the axial direction of the cable 40.

When the cable outer semiconductive layer cutting tool 10 is rotated, the cutting blade 30 rotates in the direction of arrow R with respect to the cable 40 and cuts into the outer semiconductive layer 43 to perform cutting.

When cutting the outer semiconductive layer 43, the cutting blade 30
As shown in FIG. 10, biting into the external semiconductive layer 43,
It is located slightly outside the outer periphery of the inner insulating layer 42.

By appropriately selecting the elasticity of the movable spring 31, the biting amount of the cutting blade 30 can be changed.

The outer semiconductive layer 43 is cut by the cutting blade 30 and is separated from the insulating layer 42 by the shearing force of the rake face 33b.

As described above, according to the cable outer semiconductive layer cutting tool 10, since the cutting blade 30 does not contact the insulating layer 42, the insulating layer 42 is not damaged.

Also, since the cutting blade 30 is movable in the radial direction of the cable 40 and is always urged in the axial direction of the cable 40 with the same force, even if the outer diameter of the cable 40 has irregularities, It can be cut off by a certain thickness.

[0046]

In summary, according to the present invention, the following excellent effects are exhibited.

(1) Regardless of the outer diameter of the cable,
Cutting can always be performed with a constant thickness.

(2) Since the cutting blade does not contact the insulator, the insulator is not damaged.

[Brief description of the drawings]

FIG. 1A is a front view of a cable outer semiconductive layer cutting tool according to an embodiment of the present invention. (B) is a side view of the cable outer semiconductive layer cutting tool according to one embodiment.

FIG. 2 is a bottom view of the cable outer semiconductive layer cutting tool according to one embodiment.

FIG. 3 is a sectional view taken along line AA in FIG. 2;

FIG. 4 is a plan view of a cutting blade.

FIG. 5A is a front view of a cutting blade. (B)
It is a side view of a cutting blade.

FIG. 6 is a sectional view taken along the line BB in FIG.

FIG. 7 is a perspective view showing a state in which the cable outer semiconductive layer is cut using the cable outer semiconductive layer cutting tool according to one embodiment.

FIG. 8A is a front sectional view showing a cutting state. (B) is a side sectional view showing a cutting state.

FIG. 9A is a plan view showing the relationship between the cable and the cutting blade at the beginning of gripping the cable. (B) is a front view which shows the relationship between a cable and a cutting blade at the beginning of cable gripping.

FIG. 10A is a plan view showing a relationship between a cable and a cutting blade when cutting an external semiconductive layer. (B)
FIG. 4 is a front view showing the relationship between the cable and the cutting blade when cutting the outer semiconductive layer.

[Explanation of symbols]

 11 frame 13 fixed cable guide 14 movable cable guide 24 storage space 30 cutting blade 31 biasing means

Claims (2)

[Claims] 1. An outer semiconductive layer cutting tool having a pair of cable guides for sandwiching and gripping a cable and a cutting blade for cutting and removing an outer semiconductive layer of the cable. A fixed cable guide is fixedly provided, and at the other end, a movable cable guide facing the fixed cable guide is provided. In addition to forming a storage space in the section, the cutting blade is located in the storage space, and its cutting edge is located on a horizontal tangent to the outer periphery of the outer semiconductive layer of the cable, and the entire cutting blade can be moved in the radial direction of the cable. And a biasing means for constantly biasing the cutting blade in the axial direction of the cable is provided in the storage space. Semi-conductive layer cutting tool. 2. The cutting blade comprises a base mounted on a movable holder movably accommodated in a storage space, and a blade extending horizontally from an upper end of the base. A relief hole for releasing cutting chips of the external semiconductive layer cut by the blade portion is formed in a portion immediately below the blade portion, and a dust discharge hole continuous with the release hole is formed in the fixed cable guide. Item 2. A cutting tool for a cable outer semiconductive layer according to Item 1.