JP2002238123A - Cable stripper, and cutting edge used for the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To remove only the external semiconductor layer, without giving external damages to a cable. SOLUTION: A cutting edge 21 is formed into the shape of a plate, and is arranged in the direction of a circumferential tangent L of an insulator layer 3 and also is equipped with a horizontal edge 22, which extends in its width direction at the tip in the rotational direction; a vertical edge 23, which extends in the thickness direction of the cutting edge 21, at one end of the horizontal edge 22 and the vertical edge 23 is arranged in the radial direction of the cable 1; and also the horizontal edge 22 is extended obliquely frontward in the rotational direction of the cutting edge 21 from the vertical edge 23, and the tip 24 of the horizontal edge 22 parts from the surface 25 of the insulator layer 3.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cable coating layer cutting tool for cutting and removing an outer semiconductive layer of a cable having a core wire covered with an insulating layer and an outer semiconductive layer, and a tool for use in the tool. Cutting blade to be used.

[0002]

2. Description of the Related Art A cable used for an electric wire or the like has a function in which a core layer (conductor) is covered with a coating layer (insulator layer, external semiconductive layer, etc.) from the viewpoint of its function.

Therefore, when connecting these cables to each other or connecting the cables to other devices, it is necessary to cut and remove the coating layer (external semiconductive layer).

Conventionally, the cutting and removing work performed at the construction site has been manually performed by an operator using a special knife, glass, or the like.

[0005]

However, in the conventional glass-sharpening operation, the upper side of the cable can be shaved without any problem, but the lower-side shaving operation requires considerable skill and is difficult. There was a big problem that it was easy to occur. Further, since the cable cannot be routed, much work time is required.

Accordingly, the present invention has been devised to solve the above-mentioned problems, and an object of the present invention is to provide a cable covering capable of cutting and removing only an external semiconductive layer without causing damage to the cable. An object of the present invention is to provide a layer cutting tool and a cutting blade used for the tool.

[0007]

In order to solve the above-mentioned problems, the invention according to claim 1 of the present application is to cut an outer semiconductive layer of a cable having a core wire covered with an insulator layer and an outer semiconductive layer. In a cable coating layer cutting tool provided with a cutting blade that rotates around the outer periphery of the cable while removing, the cutting blade is formed in a flat plate shape, and is arranged in a tangential direction of an outer periphery of the insulator layer, and has a tip in a rotation direction. A horizontal blade portion extending in the width direction at the portion and a vertical blade portion extending in the thickness direction of the cutting blade at one end of the horizontal blade portion, and the vertical blade portion is disposed along the radial direction of the cable. A cable coating layer cutting tool in which the horizontal blade portion extends obliquely forward from the vertical blade portion toward the front in the rotational direction of the cutting blade, and the tip of the horizontal blade portion separates from the surface of the insulator layer. is there.

According to the above construction, the vertical blade cuts the outer semiconductive layer along the circumferential direction, and the horizontal blade cuts the outer semiconductive layer so as to peel off the outer semiconductive layer from the insulator layer. At this time,
Since the tip of the horizontal blade extends forward in the rotation direction of the cutting blade and is separated from the surface of the insulator layer, the corner of the tip does not contact the surface of the insulator layer, and the insulator layer Only the flat part of the horizontal blade portion comes into contact with the surface of the horizontal blade, so that no trauma occurs.

A second aspect of the present invention is a cutting blade which rotates around the outer periphery of the cable while cutting and removing the outer semi-conductive layer of the cable in which the outer periphery of the core wire is coated with an insulator layer and an outer semi-conductive layer. A horizontal blade portion extending in the width direction at the tip end in the rotation direction, and a vertical blade portion extending in the thickness direction of the cutting blade at one end of the horizontal blade portion. A cutting blade extending obliquely forward from the vertical blade portion in the rotation direction.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One preferred embodiment of the present invention will be described with reference to the accompanying drawings.

FIG. 1 is a plan view and a front view showing a preferred embodiment of a cutting blade according to the present invention. FIG. 2 is a plan view and a front view showing a cutting state of the cutting blade according to the present invention. FIG. 4 is a front view and a side view showing a preferred embodiment of a cable coating layer cutting tool according to the present invention, and FIG. 4 is a perspective view showing a preferred embodiment of the cable coating layer cutting tool according to the present invention. 5 is a perspective view showing the cutting blade, FIG. 6 is a plan view showing the cutting blade, and FIG. 7 is a bottom view showing the cutting blade.

First, the structure of the cable and the cable coating layer cutting tool will be described.

As shown in FIG. 1 to FIG.
Is constituted by covering an insulator layer 3 around a core wire 2 and covering an outer semiconductive layer 4 around the insulator layer 3.

As shown in FIGS. 3 and 4, the cable coating layer cutting tool 5 grips the cable 1 and rotates the cable coating layer cutting tool 5 around the cable 1 while externally rotating the cable 1 with a cutting blade 21 described later. The semiconductive layer 4 is cut and removed.

The cable coating layer cutting tool 5 has a fixing jig 7 for holding the cable 1 and a movable holder jig 8 provided inside a U-shaped frame 6.

The fixing jig 7 is formed in a box shape extending a predetermined length in the longitudinal direction and the circumferential direction of the cable 1, and is fixed to the frame 6. At four corners of the fixing jig 7 at the end on the cable 1 side (upper end in FIG. 3), rollers 9 are provided, which are in contact with the outer peripheral surface of the cable 1. The roller 9 and a roller 11 described later are arranged so as to rotate in the outer circumferential direction of the cable 1.

The movable holder jig 8 has four rollers 11 arranged opposite the rollers 9 of the fixing jig 7. These rollers 11 are supported at four corners of the movable shaft 12 at the cable 1 end (the lower end in FIG. 3).
The movable shaft 12 is supported through the frame 6.

A spring 14 for biasing the movable shaft 12 toward the cable 1 is interposed between the frame 6 and the movable shaft 12. A handle 15 is formed at an outer end (upper end in FIG. 3) of the movable shaft 12. The frame 6 is provided with a stopper screw 16 protruding from a side portion of the movable shaft 12 to fix the movable shaft 12.

By the way, the cable coating layer cutting tool 5 according to the present embodiment is attached and fixed to the outer periphery of the cable 1 and rotates the outer periphery of the cable 1 by holding the handle 15 so that the outer semiconductive layer 4 is removed. It is designed to be cut and removed.

At this time, by making the diameters of the plurality of rollers 9 and 11 located on the outer periphery of the cable 1 different, the cutting blade 21 can smoothly cut the outer semiconductive layer 4.

Specifically, of the rollers 9 provided on the fixing jig 7, two rollers 9a on the diagonal line shown in FIG.
By reducing the diameter of the cable coating layer cutting tool 5
Is fixed with a slight inclination, and its rotation direction is
However, it can be adjusted in the direction in which the external semiconductive layer 4 is cut.

A cutting blade 21 for cutting and removing the outer semiconductive layer 4 of the cable 1 is fixed to the movable holder jig 8.

As shown in FIGS. 1, 2, and 5 to 7,
The cutting blade 21 is manufactured by machining a steel material and then quenching it, and is formed in a rectangular flat plate shape. The cutting blade 21 has its back surface (center side of the cable 1) 2
6 are arranged along the direction of the outer circumferential tangent line L1 of the insulator layer 3, and come into contact with the insulator layer 3 at the front part in the rotation direction.

The cutting blade 21 has a horizontal blade 22 extending in the width direction (substantially the longitudinal direction of the cable 1) at the tip end in the rotation direction.
Are formed. At one end of the horizontal blade portion 22 (on the side where the external semiconductive layer 4 before cutting remains), a vertical blade portion 23 extending in the thickness direction of the cutting blade 21 is formed.

The vertical blade 23 is arranged along the radial direction of the cable 1. That is, the vertical blade portion 23 is located on the cable center line L2 extending in the longitudinal direction of the cable 1.

The horizontal blade portion 22 is formed to extend obliquely forward from the position of the vertical blade portion 23 in the rotation direction of the cutting blade 21. That is, the horizontal blade portion 22 has one end on the vertical blade portion 23 side positioned on the cable center line L2, and is formed linearly inclining forward from the cable center line L2 in the rotation direction.

As a result, the distal end portion 24 of the horizontal blade portion 22 is located on the front side in the rotational direction along the outer peripheral tangent line L1 of the insulator layer 3, so that the surface 25 of the insulator layer 3
From you.

The horizontal blade portion 22 has, on its entire length, one-half of the base end side on the vertical blade portion 23 side, the surface 25 of the insulator layer 3.
, And the inclination angle θ1 with respect to the cable center line L2 is set such that half of the tip side is separated from the surface 25 of the insulator layer 3.

That is, when the cutting blade 21 rotates around the cable 1, the half of the base end side of the horizontal blade 22 separates the external semiconductive layer 4 from the insulator layer 3 and the back surface thereof. At 26, the surface of the insulator layer 3 is finished. The back surface 26 of the cutting blade 21 is formed to have a smooth surface, so that the surface 25 of the insulator layer 3 is finished smoothly.

Of the side surfaces intersecting with the horizontal blade portion 22 of the cutting blade 21, the side surface 27 on the side where the external semiconductive layer 4 before cutting remains is a cable section direction line L3 orthogonal to the cable center line L2. With a predetermined angle θ2.

The angle θ2 is set so that the vertical blade portion 23 faces the direction in which the outer semiconductive layer 4 is cut.

The cutting blade 21 has two mounting holes 29 into which mounting screws 28 are inserted. Mounting screw 28
Is inserted from below the mounting hole 29 and screwed into a mounting portion (not shown) of the movable holder jig 8 above the fixing hole 29 to fix the cutting blade 28 to the movable holder jig 8. The mounting hole 29 is formed in a long hole shape, and the cutting blade 21 is movable with respect to the mounting screw 28, so that the fixing position of the cutting blade 21 can be finely adjusted.

On the movable holder jig 8 side, an adjusting screw 31 extending in the vertical direction (the thickness direction of the cutting blade 21) with respect to the cutting blade 21, and the longitudinal direction of the cable 1 (the width direction of the cutting blade 21). And an adjustment screw 33 extending in the radial direction of the cable 1 (the length direction of the cutting blade 21). These adjusting screws 31, 32, and 33 are provided so as to be able to protrude and retract toward the cutting blade 21, and adjust the amount of protrusion toward the cutting blade 21 by rotating in a screw hole, so that the angle and the angle of the cutting blade 21 are adjusted. The height and horizontal position can be moved and fixed at the optimum position.

Of these adjusting screws 31, 32, 33,
In particular, the angle θ2 between the side surface 27 of the cutting blade 21 and the cable section direction line L3 is adjusted by the adjustment screw 32 extending in the longitudinal direction of the cable 1.

Next, the operation will be described in conjunction with the operation procedure of coating layer cutting using the cable coating layer cutting tool 5 having the above configuration.

First, the cable coating layer cutting tool 5 is fixed to the cable 1.

First, the handle 15 is pulled up, and the movable holder jig 8 is separated from the fixed jig 7. Then, the cable 1 is positioned between the fixing jig 7 and the movable holder jig 8, and the handle 15 is returned to its original position.

As a result, the movable holder jig 8 is urged toward the fixing jig 7 by the spring 14 and the cable 1 is fixed. At this time, since the cable 1 is sandwiched between the fixing jig 7 and the movable holder jig 8 and the cable 1 is fixed via the rollers 9 and 11, the movable holder jig 8 is fixed.
Is aligned with the center of the cable 1 so that the vertical blade portion 23 of the cutting blade 21 is arranged on the cable center line L2.

Next, the handle 15 is pushed toward the outer periphery of the cable 1 and the cutting blade 21 is rotated to cut and remove the outer semiconductive layer 4 of the cable 1. For details, see FIGS. 2 and 4
As shown in FIG. 3, the vertical blade portion 23 cuts the external semiconductive layer 4 along its circumferential direction, while the horizontal blade portion 22 cuts the external semiconductive layer 4 so as to peel off the outer semiconductive layer 4. Become.

At this time, the half of the horizontal blade portion 22 on the base end side comes into contact with the surface 25 of the insulator layer 3, and the outer semiconductive layer 4 is separated from the insulator layer 3 within that range. As a result, the corner portion at the tip of the horizontal blade portion 22 does not contact the surface 25 of the insulator layer 3. Therefore, the sharp corner portion of the tip of the horizontal blade portion 22 does not scratch the surface 25 of the insulator layer 3, and the surface 25 of the insulator layer 3
Since it is only necessary to contact the back surface 26 in the middle part from the base end side of the horizontal blade portion 22 of the cutting blade 21 formed smoothly, it is possible to prevent the surface 25 of the insulator layer 3 from being damaged.

Further, by making two diagonal rollers 9a of the rollers 9 for fixing the cable 1 smaller in diameter, the rotation direction of the cable coating layer cutting tool 5 can be changed so that the cutting blade 21 Can be adjusted in the cutting direction, and the external semiconductive layer 4 can be cut accurately and quickly.

As described above, according to the present invention, the cable coating layer cutting tool 5 is fixed to the cable 1 and the outer periphery thereof is rotated only by a simple operation without causing any damage to the cable 1 without causing any external damage. Only the semiconductive layer 4 can be reliably cut and removed, and the labor, cost and time can be significantly reduced as compared with the related art.

Further, since the structure of the cutting blade 21 is simple and simple, the manufacturing cost does not increase and the mass productivity is high.

[0044]

In summary, according to the present invention, there is provided an excellent effect that only the external semiconductive layer can be reliably cut and removed without causing any damage on the surface of the insulating layer of the cable.

[Brief description of the drawings]

FIG. 1A is a plan view and FIG. 1B is a front view showing a preferred embodiment of a cutting blade according to the present invention.

FIG. 2 shows a cutting state of the cutting blade according to the present invention (a).
Is a plan view, and (b) is a front view.

3 (a) is a front view and FIG. 3 (b) is a side view showing a preferred embodiment of the cable coating layer cutting tool according to the present invention.

FIG. 4 is a perspective view showing a preferred embodiment of a cable coating layer cutting tool according to the present invention.

FIG. 5 is a perspective view showing a cutting blade.

FIG. 6 is a plan view showing a cutting blade.

FIG. 7 is a bottom view showing the cutting blade.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Cable 2 Core wire 3 Insulator layer 4 Outer semiconductive layer 5 Cable coating layer cutting tool 21 Cutting blade 22 Horizontal blade 23 Vertical blade 24 Tip (of horizontal blade) 25 Surface of insulator layer

Claims (2)

[Claims] 1. A cable coating layer cutting tool comprising a cutting blade for rotating an outer periphery of a cable formed by coating and removing an outer semiconductive layer of a cable formed by coating an outer periphery of a core wire with an insulator layer and an outer semiconductive layer. In the above, the cutting blade is formed in a flat plate shape, is arranged in a tangential direction of the outer periphery of the insulator layer, and has a cutting edge extending in the width direction at a tip end in a rotation direction and a cutting blade at one end of the horizontal cutting portion. A vertical blade portion extending in the thickness direction of the cable, the vertical blade portion is disposed along the radial direction of the cable, and the horizontal blade portion is directed forward from the vertical blade portion in the rotation direction of the cutting blade. A cable coating layer cutting tool, wherein the cutting tool extends obliquely, and the tip of the horizontal blade portion is separated from the surface of the insulator layer. 2. A cutting blade rotating around the outer periphery of the cable while cutting and removing the outer semi-conductive layer of the cable in which the outer periphery of the core wire is coated with an insulator layer and an outer semi-conductive layer, and formed into a square flat plate shape. And a vertical blade portion extending in the width direction at the tip end in the rotation direction and a vertical blade portion extending in the thickness direction of the cutting blade at one end of the horizontal blade portion, wherein the horizontal blade portion is separated from the vertical blade portion. A cutting blade extending obliquely forward in the rotation direction.