JPS6351495U - - Google Patents
Info
- Publication number
- JPS6351495U JPS6351495U JP14526886U JP14526886U JPS6351495U JP S6351495 U JPS6351495 U JP S6351495U JP 14526886 U JP14526886 U JP 14526886U JP 14526886 U JP14526886 U JP 14526886U JP S6351495 U JPS6351495 U JP S6351495U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- heat dissipation
- dissipation fin
- solid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims description 4
- 238000005266 casting Methods 0.000 claims description 2
- 239000000463 material Substances 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims description 2
- 239000006096 absorbing agent Substances 0.000 description 1
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14526886U JPS6351495U (zh) | 1986-09-22 | 1986-09-22 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14526886U JPS6351495U (zh) | 1986-09-22 | 1986-09-22 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6351495U true JPS6351495U (zh) | 1988-04-07 |
Family
ID=31056650
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14526886U Pending JPS6351495U (zh) | 1986-09-22 | 1986-09-22 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6351495U (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015053385A (ja) * | 2013-09-06 | 2015-03-19 | Tdk株式会社 | 電源装置 |
-
1986
- 1986-09-22 JP JP14526886U patent/JPS6351495U/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015053385A (ja) * | 2013-09-06 | 2015-03-19 | Tdk株式会社 | 電源装置 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS6351495U (zh) | ||
JPS6351462U (zh) | ||
JPS6351464U (zh) | ||
JPS6351463U (zh) | ||
JPH0331092Y2 (zh) | ||
JPH0350970U (zh) | ||
JPH02142599U (zh) | ||
JPH0326105U (zh) | ||
JPH0179887U (zh) | ||
JPS6365208U (zh) | ||
KR960044013A (ko) | 인쇄 회로 기판을 제조하기 위한 방법 및 인쇄 회로 기판 | |
JPH0467312U (zh) | ||
JPH0217810U (zh) | ||
JPH0472646U (zh) | ||
JPH038484U (zh) | ||
JPH0463147U (zh) | ||
JPH0455192U (zh) | ||
JPS6183097U (zh) | ||
JPS606244U (ja) | モ−ルド・パツケ−ジ形半導体素子 | |
JPS6398656U (zh) | ||
JPS62178593U (zh) | ||
JPS6387884U (zh) | ||
JPS6312893U (zh) | ||
JPH0375594U (zh) | ||
JPS58148961U (ja) | 浸漬液冷用プリント基板 |