JPS6351460U - - Google Patents
Info
- Publication number
- JPS6351460U JPS6351460U JP14483186U JP14483186U JPS6351460U JP S6351460 U JPS6351460 U JP S6351460U JP 14483186 U JP14483186 U JP 14483186U JP 14483186 U JP14483186 U JP 14483186U JP S6351460 U JPS6351460 U JP S6351460U
- Authority
- JP
- Japan
- Prior art keywords
- board
- circuit
- hybrid
- ground circuit
- frequency
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000008878 coupling Effects 0.000 claims description 5
- 238000010168 coupling process Methods 0.000 claims description 5
- 238000005859 coupling reaction Methods 0.000 claims description 5
- 239000007787 solid Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の一実施例を示す概略斜視図、
第２図は第１図中の線方向からみた概略側面図
、第３図はリード端子の斜視図、第４図はＩＣ基
板の表面での接合例を示す説明図、第５図はＩＣ
基板の裏面での接合例を示す説明図である。
２……ハイブリツドＩＣ、８……ＩＣ基板、１
０，…，１０……リード端子、１０Ａ……アース
結合機構の一部を成す上面挟持部、１０Ｂ，１０
Ｂ……アース結合機構の一部を成す下面挟持部、
１０Ｃ……アース結合機構の一部を成す差込用リ
ード部、１２……高周波回路、１４……べたアー
ス回路。
FIG. 1 is a schematic perspective view showing an embodiment of the present invention;
Fig. 2 is a schematic side view seen from the line direction in Fig. 1, Fig. 3 is a perspective view of a lead terminal, Fig. 4 is an explanatory diagram showing an example of bonding on the surface of an IC board, and Fig. 5 is an IC
FIG. 6 is an explanatory diagram showing an example of bonding on the back surface of the substrate. 2...Hybrid IC, 8...IC board, 1
0,...,10...Lead terminal, 10A...Top clamping part forming part of the earth coupling mechanism, 10B, 10
B... lower surface clamping part forming part of the earth coupling mechanism,
10C...Plug-in lead part forming part of the earth coupling mechanism, 12...High frequency circuit, 14...Solid earth circuit.
Claims (1)
載した高硬度なＩＣ基板と、このＩＣ基板に結合
され該ＩＣ基板を実装するためのリード端子とを
備えた高周波回路用ハイブリツドＩＣにおいて、 前記ＩＣ基板の他方の面に、「べたアース回路
」を形成するとともに、 前記リード端子に、前記一方の面の高周波回路
のアース回路と他方の面のべたアース回路とを当
該ＩＣ基板の側面部を介して結合させるアース結
合機構を付加する構成としたことを特徴とする高
周波回路用ハイブリツドＩＣ。[Claims for Utility Model Registration] For high-frequency circuits comprising a high-hardness IC board on which a high-frequency circuit is hybridized and mounted on one side, and lead terminals that are coupled to this IC board and used to mount the IC board. In a hybrid IC, a "solid ground circuit" is formed on the other side of the IC board, and the ground circuit of the high frequency circuit on the one side and the solid ground circuit on the other side are connected to the lead terminal of the IC. A hybrid IC for high frequency circuits, characterized in that it has a configuration in which an earth coupling mechanism is added for coupling via a side surface of a substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14483186U JPS6351460U (en) | 1986-09-20 | 1986-09-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14483186U JPS6351460U (en) | 1986-09-20 | 1986-09-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6351460U true JPS6351460U (en) | 1988-04-07 |
Family
ID=31055802
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14483186U Pending JPS6351460U (en) | 1986-09-20 | 1986-09-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6351460U (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5067962A (en) * | 1973-10-20 | 1975-06-06 | ||
| JPS5342168B2 (en) * | 1976-04-20 | 1978-11-09 |
-
1986
- 1986-09-20 JP JP14483186U patent/JPS6351460U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5067962A (en) * | 1973-10-20 | 1975-06-06 | ||
| JPS5342168B2 (en) * | 1976-04-20 | 1978-11-09 |