JPS6351400B2 - - Google Patents
Info
- Publication number
- JPS6351400B2 JPS6351400B2 JP56019873A JP1987381A JPS6351400B2 JP S6351400 B2 JPS6351400 B2 JP S6351400B2 JP 56019873 A JP56019873 A JP 56019873A JP 1987381 A JP1987381 A JP 1987381A JP S6351400 B2 JPS6351400 B2 JP S6351400B2
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- chip
- storage case
- chip component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000001125 extrusion Methods 0.000 claims description 2
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 238000000034 method Methods 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Supply And Installment Of Electrical Components (AREA)
Description
【発明の詳細な説明】
本発明は予め筒状に形成されたチツプ部品収納
ケースの中に詰められたチツプ部品と１個づつ押
し出して、プリント配線基板上にこれを取付ける
ためのチツプ部品取付装置に関し、多くの種類の
プリント配線基板に、簡単な手法によつて容易に
かつ正確にチツプ部品を取付けることができるよ
うにしたものである。DETAILED DESCRIPTION OF THE INVENTION The present invention provides a chip component mounting device for extruding chip components one by one from a chip component storage case previously formed into a cylindrical shape and mounting the chip components onto a printed wiring board. With regard to this, it is possible to easily and accurately attach chip components to many types of printed wiring boards by a simple method.
以下、本発明のプリント配線基板へのチツプ部
品取付装置について一実施例の図面と共に説明す
る。 DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The apparatus for attaching chip components to a printed wiring board according to the present invention will be described below with reference to drawings of one embodiment.
第１図は予め多数のチツプ部品を収納しておく
ために筒状に形成されたチツプ部品収納ケースを
示し、１はチツプ部品、２は筒状体、３はチツプ
部品１を保持するための板バネである。そして、
この収納ケースは第２図に示すように板バネ３が
下になるよう複数個１列に並べて取付体１０に取
付けられている。取付体１０は図示されていない
取付体駆動装置によつて一定寸法づつ横方向に移
送されるように構成されている。そして、取付体
１０と共に予め定められた一定の位置に送られた
収納ケースは１本だけが図示されていない装置に
より一定寸法だけ縦方向に送られ、プリント配線
基板４に近づくように構成されている。また、プ
リント配線基板４はモータ５，６等の駆動手段に
よつてＸ−Ｙ方向に駆動されるプリント配線基板
取付体１１に取り付けられている。そして、縦方
向に一定寸法だけ送られた収納ケースの上部に
は、チツプ部品１を収納ケースから１個づつ突き
出すためのチツプ部品押出手段を構成するピン７
が設けられており、このピン７はローラ８によつ
て上下運動するように構成されている。 FIG. 1 shows a chip parts storage case formed into a cylindrical shape to store a large number of chip parts in advance, where 1 is a chip part, 2 is a cylindrical body, and 3 is a case for holding a chip part 1. It is a leaf spring. and,
As shown in FIG. 2, a plurality of the storage cases are arranged in a row and attached to the mounting body 10 with the leaf springs 3 facing downward. The mounting body 10 is configured to be laterally transferred in fixed size increments by a mounting body driving device (not shown). Then, only one of the storage cases sent to a predetermined fixed position together with the mounting body 10 is sent vertically by a fixed dimension by a device not shown, so that it approaches the printed wiring board 4. There is. Further, the printed wiring board 4 is attached to a printed wiring board mounting body 11 that is driven in the X-Y direction by driving means such as motors 5 and 6. At the top of the storage case that has been fed by a certain distance in the vertical direction, a pin 7 constituting a chip component extrusion means for ejecting the chip components 1 one by one from the storage case is provided.
is provided, and this pin 7 is configured to move up and down by rollers 8.
上記実施例においてチツプ部品１をプリント配
線基板４に取り付ける場合には、まず、予め作成
されたプログラムに従つてモータ５及び６を駆動
し、プリント配線基板取付体１１をＸ−Ｙ方向に
移動させる。そして、ここに取付けられたプリン
ト基板４を一定の位置に位置決めする。次にチツ
プ部品収納ケース取付体１０を図示されていない
駆動装置によつて横方向に移動させ、希望するチ
ツプ部品収納ケースがピン７の下方に位置するよ
うに位置決めする。そしてさらにこの収納ケース
を図示されていない装置によつて縦方向に移動さ
せプリント配線基板４に近づける。すなわち、第
３図に示すようにチツプ部品１の１個の厚さより
もやや広い間隔が、プリント配線基板４との間に
保たれるように上記収納ケースを縦方向に移行し
プリント配線基板に近ずける。そして、この状態
でローラ８を図示されていないモータ等で駆動
し、ピン７を下方向に移行させる。このようにす
ると第３図に示すように、最も下にあるチツプ部
品１が収納ケースより突き出され、プリント配線
基板４に当たる。したがつて、この状態でピン７
の移行が停止しローラ８とピン７がスリツプす
る。プリント配線基板４には図示されていない装
置によつて接着剤９が印刷されており、したがつ
てこの接着剤９の上にチツプ部品１が突き出され
ると上記チツプ部品１はプリント配線基板４上に
接着剤９によつて仮固定されることになる。チツ
プ部品１がプリント配線基板４上に仮固定される
と、次にピン７がローラ８によつて上向きに送ら
れ、さらに収納ケースが図示されていない装置に
よつて縦方向に送られ、プリント配線基板４より
遠ざかる。この時、予め収納ケースに詰められた
チツプ部品１のうち最下部の１個は接着剤９によ
つてプリント配線基板４に仮固定され、下部より
２個目のチツプ部品１は、板バネ３によつて収納
ケースの中に保持されるので、収納ケースの中の
チツプ部品１は、収納ケースと共にプリント配線
基板４より遠ざかり、プリント配線基板４には１
個のチツプ部品１のみが取付けられる。 In the above embodiment, when attaching the chip component 1 to the printed wiring board 4, first, the motors 5 and 6 are driven according to a pre-written program to move the printed wiring board mounting body 11 in the X-Y direction. . Then, the printed circuit board 4 attached thereto is positioned at a fixed position. Next, the chip component storage case mounting body 10 is moved laterally by a drive device (not shown), and the desired chip component storage case is positioned below the pin 7. Then, this storage case is further moved in the vertical direction by a device (not shown) to bring it closer to the printed wiring board 4. That is, as shown in FIG. 3, the storage case is moved vertically to the printed wiring board so that a gap slightly wider than the thickness of one chip component 1 is maintained between the printed wiring board 4 and the printed wiring board 4. Get closer. Then, in this state, the roller 8 is driven by a motor (not shown) or the like to move the pin 7 downward. In this way, as shown in FIG. 3, the lowest chip component 1 is projected from the storage case and hits the printed wiring board 4. Therefore, in this state, pin 7
The movement of the pin 7 stops and the roller 8 and pin 7 slip. An adhesive 9 is printed on the printed wiring board 4 by a device not shown, so that when the chip component 1 is pushed out onto the adhesive 9, the chip component 1 sticks to the printed wiring board 4. It will be temporarily fixed on top with adhesive 9. When the chip component 1 is temporarily fixed on the printed wiring board 4, the pin 7 is then sent upward by the roller 8, and the storage case is further sent vertically by a device (not shown) to print. It moves away from the wiring board 4. At this time, among the chip components 1 packed in the storage case in advance, the lowest one is temporarily fixed to the printed wiring board 4 with adhesive 9, and the second chip component 1 from the bottom is fixed to the plate spring 3. Since the chip component 1 in the storage case is moved away from the printed wiring board 4 along with the storage case, the chip component 1 is held in the storage case by
Only one chip part 1 is attached.
以上説明した工程を繰り返すことにより、多く
のチツプ部品１をプリント配線基板４の種々の位
置に取り付けることができる。 By repeating the steps described above, many chip components 1 can be attached to various positions on the printed wiring board 4.
以上実施例より明らかなように本発明によれば
簡単にチツプ部品をプリント配線基板に自動的に
取り付けることができる。また、予めチツプ部品
を収納した収納ケースの取付け順序を変え、さら
にＸ−Ｙ駆動手段の制御プログラムを変えること
により、種々のプリント配線基板の各々の異なつ
た多くの位置にチツプ部品を取り付けることが可
能となり、容易に多品種のプリント配線基板への
チツプ部品取り付けができるという利点を有し、
量産化も同時に図ることができる。さらに、チツ
プ部品を詰める収納ケースは繰り返し使用するこ
とができるので、従来使用されているテープ状の
チツプ部品供給方法に比べ、安価にチツプ部品を
プリント配線基板に取り付けることができ、実用
上きわめて有利である。 As is clear from the above embodiments, according to the present invention, chip components can be easily and automatically attached to a printed wiring board. Furthermore, by changing the installation order of the storage cases in which chip parts are stored in advance and by changing the control program of the X-Y drive means, it is possible to mount chip parts in many different positions on various printed wiring boards. It has the advantage of being able to easily attach chip components to a wide variety of printed wiring boards.
Mass production can also be achieved at the same time. Furthermore, since the storage case in which chip components are packed can be used repeatedly, chip components can be attached to printed wiring boards at a lower cost than the conventional tape-shaped chip component supply method, which is extremely advantageous in practice. It is.
第１図Ａ，Ｂは予めチツプ部品を収納するチツ
プ部品収納ケースの斜視図および断面図、第２図
は本発明の一例を示す投影図、第３図はチツプ部
品がプリント配線基板に取り付けられる状態を示
す断面図である。
１……チツプ部品、２……筒状体、３……板バ
ネ、４……プリント配線基板、５……モータ、６
……モータ、７……ピン、８……ローラ、９……
接着剤、１０……チツプ部品収納ケース取付体、
１１……プリント配線基板取付体。
1A and 1B are a perspective view and a sectional view of a chip component storage case that stores chip components in advance, FIG. 2 is a projection view showing an example of the present invention, and FIG. 3 is a diagram showing the chip components attached to a printed wiring board. It is a sectional view showing a state. 1... Chip parts, 2... Cylindrical body, 3... Leaf spring, 4... Printed wiring board, 5... Motor, 6
...Motor, 7...Pin, 8...Roller, 9...
Adhesive, 10...Chip parts storage case mounting body,
11...Printed wiring board mounting body.
Claims (1)
と、この取付体をＸ−Ｙ方向に移動させプリント
配線基板の希望するチツプ部品取付位置を予め定
められた一定位置に持ち来たすＸ−Ｙ駆動手段
と、上記取付体に対向して配置され、筒状に形成
された複数のチツプ部品収納ケースが１列に配列
されているチツプ部品収納ケース取付体とこのチ
ツプ部品収納ケース取付体を長手方向に移動さ
せ、希望するチツプ部品収納ケースを予め定めら
れた上記一定の位置に持ち来たす取付体駆動手段
と、上記駆動手段によつて上記一定の位置に持ち
来たされた上記希望するチツプ部品収納ケース内
の複数のチツプ部品を一方より押圧し、他方より
一個ずつ上記収納ケースより上記プリント配線基
板の上記希望するチツプ部品を取付位置に押し出
し接着するチツプ部品押出手段とを備えてなるプ
リント配線基板へのチツプ部品取付装置。1. A mounting body for mounting a printed wiring board, an X-Y drive means for moving this mounting body in the X-Y direction and bringing the desired chip component mounting position on the printed wiring board to a predetermined constant position; The chip component storage case mounting body is disposed opposite to the mounting body and has a plurality of cylindrical chip component storage cases arranged in a row, and the chip component storage case mounting body is moved in the longitudinal direction. , a mounting body driving means for bringing the desired chip parts storage case to the predetermined position; A chip component extrusion means for pressing a plurality of chip components from one side and pushing out and bonding the desired chip components of the printed wiring board from the storage case one by one from the other side to the mounting position. Parts mounting device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56019873A JPS57133696A (en) | 1981-02-12 | 1981-02-12 | Device for mounting chip part on printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56019873A JPS57133696A (en) | 1981-02-12 | 1981-02-12 | Device for mounting chip part on printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57133696A JPS57133696A (en) | 1982-08-18 |
| JPS6351400B2 true JPS6351400B2 (en) | 1988-10-13 |
Family
ID=12011326
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56019873A Granted JPS57133696A (en) | 1981-02-12 | 1981-02-12 | Device for mounting chip part on printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57133696A (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1438252A1 (en) * | 2001-10-19 | 2004-07-21 | MonoGen, Inc. | Container uncapping apparatus and method |
| US10172270B2 (en) | 2013-03-15 | 2019-01-01 | John S. Youngquist | Pick-and-place feeder module assembly |
| JP6389481B2 (en) * | 2013-03-15 | 2018-09-12 | ヤングクイスト，ジョン・エスＹｏｕｎｇｑｕｉｓｔ， Ｊｏｈｎ Ｓ． | Multi-part nozzle system |
| US11026361B2 (en) | 2013-03-15 | 2021-06-01 | John S. Youngquist | Linear/angular correction of pick-and-place held component and related optical subsystem |
-
1981
- 1981-02-12 JP JP56019873A patent/JPS57133696A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57133696A (en) | 1982-08-18 |
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