JPS6351151A - Multielectrode head and its preparation - Google Patents

Abstract

PURPOSE:To inexpensively prepare a multielectrode head having high resolving power, by receiving conductive wire materials exposed at one ends thereof in the grooves of a fixing material to fix the same and taking out the other ends thereof at every definite number of the wire materials to connect the same to the terminals formed on a circuit board at a specific pitch. CONSTITUTION:Conductive wire materials 102 coated with an insulating resin having high photothermal conversion efficiency are received in the grooves of a fixing material 32 having a large number of grooves at a definite pitch to be fixed thereto so as to expose the leading ends of one ends thereof and other ends thereof are taken out at every definite number of the wire materials to be connected to the terminals 109 for soldering 105 formed on circuit boards 110, 111 at a pitch larger than the above mentioned definite pitch and a plurality of said circuit boards 110, 111 are used to connect all of the coated wire materials 102 to the circuit boards. By this constitution, since the density of the connection parts can be made low even when the wire density of a writing part is high, manufacturing becomes easy. Since the resin having high photothermal conversion efficiency is used in coating when the coated wire materials 102 are connected to the soldering terminals 109 of the circuit boards, the coating films and solder can be melted simultaneously by the irradiation of laser beam and, therefore, connection becomes easy.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a multi-electrode head for writing in a recording device that records electrical signals as visible images, and a method for manufacturing the same.

BACKGROUND OF THE INVENTION Among various recording apparatuses, recording apparatuses that conduct electricity through electrode needles, such as discharge recording apparatuses, electrolytic recording apparatuses, and energization recording apparatuses, are superior in terms of high speed, record storage stability, and economical efficiency. However, these devices use a writing electrode head (hereinafter referred to as an electric bridge head) to ensure contact by protruding an electrode needle 41 as shown in Fig. 4 in order to print by pressing the Ti needle against the recording medium. is being made. (42 is a fixed part, 43 is a lead) Therefore, the resolution is not very good, 5 to 6 dots/1
1 was common, and the print quality was not very good. (Japan Industrial Technology Center; Hardcopy Technology P221-227) As a high-resolution electrode head,
Using orthogonal boron nitride as a fixing material, grooves are formed in the fixing material,
An electrode head (for example, Japanese Patent Application No. 178537/1982) has been proposed in which an electrical conductor is fitted into a groove in a fixing member.

In the electrode head with protruding electrode needles, since the electrode needles have a wide interval (low resolution), it is easy to solder the electrode needles one by one to the circuit board. However, with high-resolution electrode heads, it is difficult to solder the electrode needles one by one to a circuit board, and no method has been proposed for easily connecting them to a circuit board.

Problems to be Solved by the Invention The above-mentioned recording device, for example, a discharge recorder! Regarding the three devices, the resolution of the discharge phenomenon itself is higher, and regarding the recording speed, if there is a multi-stylus (multi-electrode head) in the paper, it is possible to write in one second per A4 sheet. be. However, in the case of a multi-electrode head, many leads (A
The 4th edition required 16 donts/3300 wires in the case of the 4th edition), and the problem of how to connect this number of lead wires to the circuit at this density could not be solved.

The problems associated with such a high-density multi-electrode head are common not only to discharge breakdown recording devices, but also to other recording devices, such as electrolytic S3 devices and energization recording devices, which conduct electricity through electrode needles. It was a challenge.

Means for Solving the Problems In order to solve the above problems, the present invention provides a fixing material having a plurality of grooves at a constant pitch, and a tip of one end of a conductive wire coated with an insulating resin having high light-to-heat conversion efficiency. The conductive wire is inserted into the groove of the fixing material and fixed so that the fixed conductive wire is exposed, and at the other end of the fixed conductive wire, a fixed number of conductive wires are taken out at the fixed pitch formed on the circuit board. It is a multi-electrode head that connects all the conductive wires to the circuit board using a plurality of circuit boards, and is made of a fixing material grooved at a constant pitch and a circuit board. is fixed on the drum of a winding machine, and a conductive wire coated with an insulating resin with high light-to-heat conversion efficiency is fed at a constant pitch while rotating the drum of the winding machine. The conductive wire is wound around the drum of a winding machine so as to follow the connection terminal of the wire, and the conductive wire is fixed to a fixing member. When connecting the conductive wire to the connection terminal of the circuit board, a light beam is used to A multi-electrode head is obtained by removing a part of the wire covering and simultaneously performing soldering to integrate the fixing material and the circuit board.

Operation The present invention realizes a multi-electrode head with higher resolution, lower cost, and higher reliability using the above-described structure and method.

EXAMPLE Hereinafter, an example of the multi-electrode head of the present invention and its manufacturing method will be described with reference to the drawings.

FIG. 1 shows a perspective view of an embodiment of the multi-electrode head of the present invention. In FIG. 1, numeral 108 is a writing portion that contacts the recording paper to print.

One end of the coated wire 102 is a conductive wire coated with an insulating resin having high light-to-heat conversion efficiency and arranged at a constant pitch (hereinafter referred to as a coated wire), and is easily bent.
3 are fixed with a fixing material 101 so that they are aligned in a straight line and exposed. The tip 103 of the covered wire may protrude from the fixing material, but since it will be bent, the protruding length should be smaller than the diameter of the covered wire. Any material can be used for the covered wire 102 as long as it is conductive and easily bent. The most common is thin metal wire. For discharge recording, tungsten wire or nickel are often used. Copper wire is the easiest to work with. Of course, other conductors can also be used. Further, the cross section of the covered wire may be circular or may have another shape. Preferably, the cross section is circular in view of cost.

Resin is convenient for the fixing material 101. However, in cases such as discharge recording, if the tip of the wire is flush with the fixing material, the tip becomes hot and the resin around the wire is destroyed. In such cases, inorganic materials with good heat resistance can be used. For example, ceramic or glass can be used.

In the case of discharge recording, it is known that good results can be obtained by embedding it in a sintered body of boron nitride. The other ends of the covered wires are connected to circuit boards 110 and 111 alternately (every other time). The circuit board is, for example, a printed wiring board. 1
04 is a circuit board base. 109 is soldering 105
It is a terminal for 106 is a circuit component such as an IC. Reference numeral 107 is a connector for connecting to a signal source circuit or the like in order to input a signal to this circuit board. By adopting such a configuration, even if the linear density of the writing portion is high, the density of the connecting portion can be reduced, making manufacturing easier.

Also, when soldering a circuit board, when connecting covered wires to terminals,
Since a resin with high light-to-heat conversion efficiency is used for coating the coated wire, irradiation with a light beam can melt the coating film of the coated wire and melt the solder at the same time, making it easy to connect by soldering. become.

[Example 1] Semiconductor was coated on the surface of a plate-shaped (length 20fl x width 20mm x thickness 2m) hexagonal boron nitride sintered body (grade HC sintered body manufactured by T!l Kagaku Kogyo Co., Ltd.). Blade thickness is 3 with Guising tool for wafer processing (Disco IJDAD-2H15)
Width 35μm using 0μ ugly blade (NBC-22050)
512 pieces were cut at a depth of 35 μm and a pitch of 62.5 μm (16 pieces/n). As shown in Fig. 2, a hexagonal boron nitride sintered body with grooves formed on the drum 21 (diameter 10 CII) of a high-precision wire winding machine and a circuit board on which a driving IC with terminals with a pitch of 500 μm are mounted. As shown in Figure 3, the grooves on the orthogonal boron nitride sintered body are installed so that the terminals are lined up (solder cream is printed on the terminals of the circuit board). 30 with a film thickness of 2.5 μm)
A coated copper wire with a diameter of μmμ was wound around every 8 grooves (7 grooves were left open) in a conventional manner. In this state, light beam solder the coated copper wire and the terminals of the circuit board @ (YB manufactured by Matsushita Industrial Equipment Co., Ltd.)
-010SXC-2).

Next, move another circuit board from the position of the previous circuit board by 62.
Shift the wire by 5 μm to the side, then wrap the coated copper wire in the same way as before so that the coated copper wire goes into the groove next to the previously wrapped wire W4, and wrap this coated copper wire around the terminal of the newly installed circuit board. Light beam soldering was carried out using a machine.

The same operation was repeated 6 times and 8 times, and when the coated copper wire was inserted into all the grooves of the hexagonal boron nitride sintered body, a plate-shaped (
Cover with a hexagonal boron nitride sintered body with a length of 20mm x medium 201mm x thickness of 1mm), and place Aron Alpha (manufactured by Toagosei Kagaku Kogyo Co., Ltd.) between the hexagonal boron nitride sintered bodies (as a fixing material). between the lids) and fix the wire wrapped around the cylinder.
Immediately after cutting the soldering of each circuit board, remove the sintered bulk boron nitride body and the eight circuit boards connected to it with coated copper wires from the cylinder. A multi-electric scratching head was prepared by polishing the end face of the hexagonal boron nitride sintered body so that one end of the coated copper wire was aligned. Using this multi-electrical head, pressing the tip of the coated copper wire in the recording area (the copper wire is exposed) against a commercially available discharge breakdown recording paper and applying a voltage of 40V from the drive IC, the result is 16 dots. 7
)/fl without defects (poor connection) was obtained.

In the example, a coated copper wire with a blue urethane coating was used, but it may be coated with another insulating resin with high light-to-heat conversion efficiency, or other i-wires other than copper wire may be used. The good news is obvious.

It is clear that the cross section of the covered wire may have any shape, but a circular shape is common and inexpensive.

Effects of the Invention As is clear from the above explanation, in order to solve the above problems, the present invention provides a conductive wire material in which a fixing material having a plurality of grooves at a constant pitch is coated with an insulating resin having high light-to-heat conversion efficiency. The conductive wire is inserted into the groove of the fixing material and fixed so that the tip of one end is exposed, and at the other end of the fixed conductive wire, a fixed number of wires are taken out and formed on a circuit board. A multi-electrode head is constructed by connecting terminals with a pitch larger than the above-mentioned fixed pitch, and using a plurality of the above-mentioned circuit boards, all the above-mentioned conductive wires are connected to the terminals of the circuit board. The fixing material, which has been grooved with At the same time as it is fitted into the groove of the fixing material, it is wound around the drum of a winding machine so as to be along the connection terminal of the circuit board, and after the conductive wire is fixed to the fixation material, the conductive wire is attached to the connection terminal of the circuit board. When connecting, a part of the covering of the conductive wire is removed using a light beam and at the same time soldering is performed to integrate the fixing material and the circuit board, thereby obtaining a multi-electrode head.

As a result, a large number of ms can be connected in a short time, so a high-resolution multi-electrode head can be manufactured at low cost and high reliability can be achieved.

[Brief explanation of the drawing]

Fig. 1 is a configuration diagram of the multi-electrode head of the present invention, Fig. 2 is a schematic diagram of a high-precision winding machine, Fig. 3 is a diagram of the fixing material and circuit board attached to the drum, and Fig. 4 is a conventional writing method. FIG. 3 is a perspective view of an electrode head. 101... Fixing material, 102... Covered wire, 103... Covered wire tip, 104...
Circuit board base, 105...Solder, 106...
...Circuit components, 107...Connector,
108...Writing portion, 109...Terminal, 110, 111...Circuit board, 21...
... Rotating drum, 22 ... Pole screw, 23
... Servo motor, 24 ... Rotating motor, 25 ... Winding position, 31 ... Rotating drum, 32 ... Grooving fixed material, 33
...Circuit board with IC mounted, 34...
・Circuit components, 35...Terminals, 36...
... Connector, 41 ... Electrode needle, 42 ...
...Fixed part, 43...Lead. Name of agent: Patent attorney Toshio Nakao Haka1meno0no5■Pubia F? /θ2-4zs1μβk Ari3--Zzu1? Chi/θ4-Circuit crazy bass 10.5-4EB /θ6-Dump barrel ζ Power fork WS3 107--Connector//θ, 7/-1 22--Borirenen' 23--Boo small motor No. 3rXJ, 33. 32,. 3/ J Otsu, 34 Figure 4

Claims (4)

[Claims] (1) A fixing material having a plurality of grooves at a constant pitch, and inserting the conductive wire into the grooves of the fixing material so that one end of the conductive wire coated with an insulating resin having high light-to-heat conversion efficiency is exposed. The other end of the fixed conductive wire is taken out in fixed numbers and connected to terminals formed on a circuit board with a pitch larger than the fixed pitch, and the circuit board is connected to a plurality of terminals. A multi-electrode head characterized in that all of the conductive wires are connected to a circuit board using a plurality of conductive wires. (2) The multi-electrode head according to claim (1), wherein the fixing material is a hexagonal boron nitride sintered body. (3) The multi-electrode head according to claim (1), wherein the covered wire has a substantially circular cross section. (4) A fixed material with grooves processed at a constant pitch and a circuit board are fixed on the drum of a winding machine, and a conductive wire coated with an insulating resin with high light-to-heat conversion efficiency is rotated by the drum of the winding machine. While feeding the conductive wire at a constant pitch, the conductive wire is inserted into the groove of the fixing material and at the same time is wound around the drum of the winding machine so as to follow the connection terminal of the circuit board. After fixing the conductive wire to the fixing material, the conductive wire is A multi-electrode characterized in that when connecting to a connection terminal of a circuit board, a part of the covering of the conductive wire is removed using a light beam and soldering is performed at the same time to integrate the fixing material and the circuit board. Head manufacturing method.