JPS634630B2 - - Google Patents

Info

Publication number
JPS634630B2
JPS634630B2 JP58058918A JP5891883A JPS634630B2 JP S634630 B2 JPS634630 B2 JP S634630B2 JP 58058918 A JP58058918 A JP 58058918A JP 5891883 A JP5891883 A JP 5891883A JP S634630 B2 JPS634630 B2 JP S634630B2
Authority
JP
Japan
Prior art keywords
gold alloy
coating layer
base member
hard
sputtering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP58058918A
Other languages
Japanese (ja)
Other versions
JPS59185774A (en
Inventor
Noribumi Kikuchi
Juzo Oosawa
Takayuki Shingyochi
Naoyuki Hosoda
Atsuyuki Fujiie
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Metal Corp
Original Assignee
Mitsubishi Metal Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Metal Corp filed Critical Mitsubishi Metal Corp
Priority to JP5891883A priority Critical patent/JPS59185774A/en
Publication of JPS59185774A publication Critical patent/JPS59185774A/en
Publication of JPS634630B2 publication Critical patent/JPS634630B2/ja
Granted legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/0021Reactive sputtering or evaporation
    • C23C14/0036Reactive sputtering

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)

Description

【発明の詳細な説明】[Detailed description of the invention]

この発明は、例えば時計ケースや時計バンド、
さらにネツクレスやブレスレツトなどの基体部材
の表面に硬質金合金被覆層を形成する方法に関す
るものである。 通常、上記のような各種の装飾品においては、
ステンレス鋼や真ちゆうなどの基体部材の表面に
湿式電気メツキ法などを用いて金合金をメツキす
ることが行なわれている。 しかし、このような金合金メツキ法において
は、 (a) 金合金メツキ層自体が純金に近く、軟質であ
るため、傷がつき易く、摩耗し易い。 (b) 金合金メツキ層はピンホールが多く、耐食性
に劣るものであるため、下地としてNiメツキ
などを行なう必要がある。 (c) メツキ液として、シアン化合物を使用するた
め、廃水処理用プラントを必要とし、コスト高
の原因となる。 などの問題点を有するものである。 そこで、本発明者等は、上述のような観点か
ら、装飾品などの基体部材の表面に、硬質にして
耐食性のすぐれた金合金被覆層を形成すべく研究
を行なつた結果、 ターゲツトとして、 (a) Au:41.6〜91.6%、AgおよびCuのうちの1
種または2種、並びに不可避不純物:残りから
なる組成(以上重量%、以下%は重量%を示
す)を有する金合金。 (b) Au:41.6〜91.6%、Ni,Co,FeおよびPdの
うちの1種または2種以上:0.5〜10%、Agお
よびCuのうちの1種または2種、並びに不可
避不純物:残りからなる組成を有する金合金。 (c) Au:41.6〜91.6%、Al:0.5〜5%、Agおよ
びCuのうちの1種または2種、並びに不可避
不純物:残りからなる組成を有する金合金。 (d) Au:41.6〜91.6%、Zn:0.5〜5%、Agおよ
びCuのうちの1種または2種、並びに不可避
不純物:残りからなる組成を有する金合金。 以上(a)〜(d)のうちのいずれかの金合金と、 Ti,Zr、およびCr、並びにこれらの合金のう
ちの1種または2種以上からなる硬化金属とを用
い、 N2およびNH3のうちの1種または2種を含有
するArガス雰囲気中でスパツタリングを行なう
と、ステンレス鋼や真ちゆうなどの基体部材の表
面に、上記(a)〜(d)のうちのいずれかの金合金中
に、上記硬化金属が主として窒化物の形で分散含
有した組織を有する金合金被覆層が蒸着形成され
るようになり、この結果の金合金被覆層は、きわ
めて硬質で、ビツカース硬さで400〜700Kg/mm2
著しく高い硬さをもち、かつピンホールなどの形
成もないので、金合金自体のもつ耐食性によつて
すぐれた耐食性をもつという知見を得たのであ
る。 この発明は、上記知見にもとづいてなされたも
のであつて、ターゲツトとして、上記組成の金合
金と、上記硬化金属とを用い、N2およびNH3
いずれか、または両方を1〜80容量%含有し、残
りがArからなる混合ガス雰囲気中で、スパツタ
リングを行なうことにより、基体部材の表面に、
上記金合金中に、上記硬化金属が主として窒化物
の形で0.5〜5%含有した硬質金合金被覆層を形
成する方法に特徴を有するものである。 なお、この発明の方法において、混合ガス雰囲
気中のN2およびNH3の含有量を1〜80容量%と
限定したのは、1容量%未満の含有では、金合金
被覆層に所望の高硬度を付与することができず、
一方80容量%を越えた含有になると、スパツター
速度が低下し、実用的でなくなるという理由によ
るものであり、また、金合金被覆層における硬化
金属の含有量が0.5%未満では所望の高硬度を確
保することができず、一方その含有量が5%を越
えると窒化物の量が多くなりすぎ、この窒化物に
よつて金合金自体のもつ色調が損なわれるように
なることから、その含有量を0.5〜5%と定めた。 さらに、この発明の方法は、直流または高周波
電流を用いる通常のスパツタリング法によつて実
施することができるが、望ましくは蒸着速度の速
いマグネトロンスパツタリング法を用いるのがよ
く、しかもこれによつて光沢の良好な蒸着表面が
得られるようになる。 つぎに、この発明の方法を実施例により具体的
に説明する。 実施例 それぞれ第1表に示される材質の基体部材、金
合金ターゲツト、および硬化金属ターゲツトを用
意し、これら各部材を同じく第1表に示される組
合せで通常のスパツタリング装置内に装着し、さ
らに同じく第1表に示されるスパツタリング条件
にてスパツタリングを行なうことによつて本発明
法1〜18をそれぞれ実施した。 ついで、この結果形成された金合金被覆層につ
いて、その組成をX線マイクロアナライザーにて
定量すると共に、硬さ、平均層厚、および色調を
測定し、観察した。これらの結果を第2表に示し
た。第2表には比較の目的で金合金ターゲツトの
硬さも示した。 第2表に示される結果から、本発明法1〜18に
よつて形成された金合金被覆層は、いずれも高い
硬さを有し、かつ金合金ターゲツトのもつ色調と
ほぼ同じ色をもつものであつた。 上述のように、この発明の方法によれば、ピン
ホールなどの欠陥のない硬質の金合金被覆層をコ
This invention can be applied to watch cases, watch bands, etc.
The invention further relates to a method for forming a hard gold alloy coating layer on the surface of a base member such as a necklace or bracelet. Usually, in the various ornaments mentioned above,
Gold alloy is plated on the surface of a base member such as stainless steel or brass using a wet electroplating method or the like. However, in such a gold alloy plating method, (a) the gold alloy plating layer itself is close to pure gold and is soft, so it is easily scratched and abraded. (b) The gold alloy plating layer has many pinholes and has poor corrosion resistance, so it is necessary to use Ni plating as a base layer. (c) Since a cyanide compound is used as the plating liquid, a wastewater treatment plant is required, which causes high costs. This method has the following problems. Therefore, from the above-mentioned viewpoint, the present inventors conducted research to form a hard gold alloy coating layer with excellent corrosion resistance on the surface of a base member such as an ornament, and as a result, as a target: (a) Au: 41.6-91.6%, one of Ag and Cu
A gold alloy having a composition consisting of one or two species, and unavoidable impurities: the remainder (the above weight percent, the below weight percent). (b) Au: 41.6 to 91.6%, one or more of Ni, Co, Fe, and Pd: 0.5 to 10%, one or two of Ag and Cu, and unavoidable impurities: the remainder A gold alloy with the following composition. (c) A gold alloy having a composition consisting of Au: 41.6 to 91.6%, Al: 0.5 to 5%, one or two of Ag and Cu, and unavoidable impurities: the remainder. (d) A gold alloy having a composition consisting of Au: 41.6 to 91.6%, Zn: 0.5 to 5%, one or two of Ag and Cu, and unavoidable impurities: the remainder. Using any of the gold alloys (a) to (d) above, Ti, Zr, and Cr, and a hardened metal consisting of one or more of these alloys, N 2 and NH When sputtering is performed in an Ar gas atmosphere containing one or two of the above three , any of the above (a) to (d) may occur on the surface of a base member such as stainless steel or brass. A gold alloy coating layer having a structure in which the hardened metal is mainly dispersed in the form of nitride is formed by vapor deposition in the gold alloy, and the resulting gold alloy coating layer is extremely hard and has a Vickers hardness. The gold alloy has extremely high hardness of 400 to 700 kg/mm 2 and does not form pinholes, so it was found that it has excellent corrosion resistance due to the corrosion resistance of the gold alloy itself. This invention was made based on the above findings, and uses a gold alloy having the above composition and the above hardened metal as a target, and injects 1 to 80% by volume of either N 2 or NH 3 or both. By performing sputtering in a mixed gas atmosphere containing Ar, and the remainder being Ar, on the surface of the base member,
The method is characterized by forming a hard gold alloy coating layer containing 0.5 to 5% of the hardened metal mainly in the form of nitride in the gold alloy. In addition, in the method of this invention, the content of N 2 and NH 3 in the mixed gas atmosphere is limited to 1 to 80% by volume, because if the content is less than 1% by volume, the gold alloy coating layer will not have the desired high hardness. cannot be granted,
On the other hand, if the content exceeds 80% by volume, the sputtering speed will decrease, making it impractical.If the content of hardened metal in the gold alloy coating layer is less than 0.5%, it will be difficult to achieve the desired high hardness. On the other hand, if the content exceeds 5%, the amount of nitrides will be too large, and the color tone of the gold alloy itself will be impaired by these nitrides. was set at 0.5% to 5%. Furthermore, although the method of the present invention can be carried out by a conventional sputtering method using direct current or high-frequency current, it is preferable to use a magnetron sputtering method which has a high deposition rate. A deposited surface with good gloss can be obtained. Next, the method of the present invention will be specifically explained using examples. Example A base member, a gold alloy target, and a hardened metal target each made of the materials shown in Table 1 are prepared, and these members are mounted in a normal sputtering device in the combinations also shown in Table 1, and then the same Methods 1 to 18 of the present invention were carried out by sputtering under the sputtering conditions shown in Table 1. Next, the composition of the gold alloy coating layer thus formed was determined using an X-ray microanalyzer, and the hardness, average layer thickness, and color tone were measured and observed. These results are shown in Table 2. Table 2 also shows the hardness of gold alloy targets for comparison purposes. From the results shown in Table 2, the gold alloy coating layers formed by methods 1 to 18 of the present invention all have high hardness and have almost the same color tone as the gold alloy target. It was hot. As described above, according to the method of the present invention, a hard gold alloy coating layer free from defects such as pinholes is coated.

【表】【table】

【表】【table】

【表】 スト安く形成することができ、しかもこれを装飾
品などに適用した場合には、傷がつきにくく、か
つ摩耗し難いので、金合金自体のもつ美麗な黄金
色を、すぐれた光沢を保持した状態で著しく長期
に旦つて確保できるようになるのである。
[Table] It can be formed at a low cost, and when applied to decorative items, it is hard to scratch and wear, so it can maintain the beautiful golden color of the gold alloy itself with excellent luster. This means that it can be secured for an extremely long period of time.

Claims (1)

【特許請求の範囲】 1 ターゲツトとして、金合金と、Ti,Zr、お
よびCr、並びにこれらの合金のうち1種または
2種以上からなる硬化金属とを用い、 N2およびNH3のうちの1種または2種:1〜
80容量%、Ar:残りからなる混合ガス雰囲気中
で、スパツタリングを行なうことにより、基体部
材表面に、上記金合金中に上記硬化金属が主とし
て窒化物の形で0.5〜5重量%含有した組成を有
する硬質金合金を蒸着させることを特徴とする硬
質金合金被覆層の形成方法。
[Claims] 1. A gold alloy, Ti, Zr, and Cr, and a hardened metal consisting of one or more of these alloys are used as targets, and one of N 2 and NH 3 is used as a target. Species or 2 types: 1~
By performing sputtering in a mixed gas atmosphere consisting of 80% by volume, Ar: and the rest, a composition containing 0.5 to 5% by weight of the above-mentioned hardening metal mainly in the form of nitride in the above-mentioned gold alloy is formed on the surface of the base member. 1. A method for forming a hard gold alloy coating layer, comprising depositing a hard gold alloy comprising:
JP5891883A 1983-04-04 1983-04-04 Formation of coated hard gold alloy layer Granted JPS59185774A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5891883A JPS59185774A (en) 1983-04-04 1983-04-04 Formation of coated hard gold alloy layer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5891883A JPS59185774A (en) 1983-04-04 1983-04-04 Formation of coated hard gold alloy layer

Publications (2)

Publication Number Publication Date
JPS59185774A JPS59185774A (en) 1984-10-22
JPS634630B2 true JPS634630B2 (en) 1988-01-29

Family

ID=13098198

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5891883A Granted JPS59185774A (en) 1983-04-04 1983-04-04 Formation of coated hard gold alloy layer

Country Status (1)

Country Link
JP (1) JPS59185774A (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6067654A (en) * 1983-09-22 1985-04-18 Seiko Instr & Electronics Ltd Preparation of hard gold alloy plating
FR2589484A1 (en) * 1985-11-04 1987-05-07 Asulab Sa OBJECT WITH PRECIOUS METAL COATING RESISTANT TO WEAR
JPH0520683U (en) * 1991-09-03 1993-03-19 積水化学工業株式会社 Washbasin unit
CN106756842B (en) * 2016-12-16 2019-03-15 安徽宝恒新材料科技有限公司 A kind of processing method improving stainless steel machinery performance

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS542942A (en) * 1977-06-10 1979-01-10 Tsuneo Nishida Golddcolorrtrimmed members

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS542942A (en) * 1977-06-10 1979-01-10 Tsuneo Nishida Golddcolorrtrimmed members

Also Published As

Publication number Publication date
JPS59185774A (en) 1984-10-22

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