JPS6345367A - 輸送型スパツタリング成膜法 - Google Patents

輸送型スパツタリング成膜法

Info

Publication number
JPS6345367A
JPS6345367A JP18822286A JP18822286A JPS6345367A JP S6345367 A JPS6345367 A JP S6345367A JP 18822286 A JP18822286 A JP 18822286A JP 18822286 A JP18822286 A JP 18822286A JP S6345367 A JPS6345367 A JP S6345367A
Authority
JP
Japan
Prior art keywords
cathode
gas
sputtered
film
anode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP18822286A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0214427B2 (enrdf_load_html_response
Inventor
Kiyoshi Ishii
清 石井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP18822286A priority Critical patent/JPS6345367A/ja
Publication of JPS6345367A publication Critical patent/JPS6345367A/ja
Publication of JPH0214427B2 publication Critical patent/JPH0214427B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Physical Vapour Deposition (AREA)
JP18822286A 1986-08-11 1986-08-11 輸送型スパツタリング成膜法 Granted JPS6345367A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18822286A JPS6345367A (ja) 1986-08-11 1986-08-11 輸送型スパツタリング成膜法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18822286A JPS6345367A (ja) 1986-08-11 1986-08-11 輸送型スパツタリング成膜法

Publications (2)

Publication Number Publication Date
JPS6345367A true JPS6345367A (ja) 1988-02-26
JPH0214427B2 JPH0214427B2 (enrdf_load_html_response) 1990-04-09

Family

ID=16219908

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18822286A Granted JPS6345367A (ja) 1986-08-11 1986-08-11 輸送型スパツタリング成膜法

Country Status (1)

Country Link
JP (1) JPS6345367A (enrdf_load_html_response)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2287884A2 (de) 2009-08-18 2011-02-23 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Gasflusssputterquelle
JP2013520573A (ja) * 2010-02-24 2013-06-06 ティア・エービー 粒子を製造するためのプラズマ・スパッタリング・プロセス
CN103751305A (zh) * 2013-12-11 2014-04-30 内蒙古元和药业股份有限公司 一种治疗类风湿关节炎的药物及其制备方法

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0399833U (enrdf_load_html_response) * 1990-01-31 1991-10-18
CA2564539C (en) 2005-11-14 2014-05-06 Sulzer Metco Coatings B.V. A method for coating of a base body with a platinum modified aluminide ptmal by means of a physical deposition out of the gas phase
WO2022009536A1 (ja) * 2020-07-07 2022-01-13 ソニーグループ株式会社 スパッタリング装置およびスパッタリング成膜方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2287884A2 (de) 2009-08-18 2011-02-23 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Gasflusssputterquelle
DE102009037853B3 (de) * 2009-08-18 2011-03-31 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Gasflusssputterquelle
JP2013520573A (ja) * 2010-02-24 2013-06-06 ティア・エービー 粒子を製造するためのプラズマ・スパッタリング・プロセス
CN103751305A (zh) * 2013-12-11 2014-04-30 内蒙古元和药业股份有限公司 一种治疗类风湿关节炎的药物及其制备方法

Also Published As

Publication number Publication date
JPH0214427B2 (enrdf_load_html_response) 1990-04-09

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