JPS6345002Y2 - - Google Patents

Info

Publication number
JPS6345002Y2
JPS6345002Y2 JP2840182U JP2840182U JPS6345002Y2 JP S6345002 Y2 JPS6345002 Y2 JP S6345002Y2 JP 2840182 U JP2840182 U JP 2840182U JP 2840182 U JP2840182 U JP 2840182U JP S6345002 Y2 JPS6345002 Y2 JP S6345002Y2
Authority
JP
Japan
Prior art keywords
layer
conductor layer
conductor
metallic glass
integrated circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP2840182U
Other languages
English (en)
Japanese (ja)
Other versions
JPS57157144U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS57157144U publication Critical patent/JPS57157144U/ja
Application granted granted Critical
Publication of JPS6345002Y2 publication Critical patent/JPS6345002Y2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Electrodes Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP2840182U 1981-03-03 1982-02-26 Expired JPS6345002Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US24033381A 1981-03-03 1981-03-03

Publications (2)

Publication Number Publication Date
JPS57157144U JPS57157144U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1982-10-02
JPS6345002Y2 true JPS6345002Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1988-11-22

Family

ID=30000193

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2840182U Expired JPS6345002Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1981-03-03 1982-02-26

Country Status (1)

Country Link
JP (1) JPS6345002Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Also Published As

Publication number Publication date
JPS57157144U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1982-10-02

Similar Documents

Publication Publication Date Title
KR100339179B1 (ko) 상호 접속 구조 및 그 형성 방법
JP4021601B2 (ja) スパッタ装置および成膜方法
US6387805B2 (en) Copper alloy seed layer for copper metallization
US4094761A (en) Magnetion sputtering of ferromagnetic material
US4166279A (en) Electromigration resistance in gold thin film conductors
US4899206A (en) Semiconductor device
US5911857A (en) Method for forming metal wiring of semiconductor devices
US5880023A (en) Process for formation of wiring layer in semiconductor device
US6614114B2 (en) Conductive line formed on integrated circuits
JPH0799169A (ja) 炭化けい素電子デバイスの製造方法
JPS6345002Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP2570857B2 (ja) 半導体装置の製造方法
US20230100972A1 (en) Method for producing a coating of a base body and functional element having a base body with a coating
KR100200499B1 (ko) 반도체 소자의 금속배선막 형성방법
JPS61183433A (ja) アルミニウム合金薄膜とその製造方法
JP3079765B2 (ja) 電気接点用材料
JPH10172923A (ja) 半導体素子の金属配線形成方法
JP2566826Y2 (ja) ヒューズ
JPS5829618B2 (ja) 半導体装置の電極形成方法
KR930003841B1 (ko) 메탈 리큐드의 홀 필링을 이용한 집적회로의 배선 형성방법
US4755438A (en) Aluminum film coated copper material
JPH02271634A (ja) 多層配線形成方法およびこれに用いる真空蒸着装置
JPS6167282A (ja) 超伝導集積回路用抵抗素子及びその製法
JPS63307271A (ja) スパッタ装置
JP2566825Y2 (ja) ヒューズ