JPS634499B2 - - Google Patents
Info
- Publication number
- JPS634499B2 JPS634499B2 JP56173100A JP17310081A JPS634499B2 JP S634499 B2 JPS634499 B2 JP S634499B2 JP 56173100 A JP56173100 A JP 56173100A JP 17310081 A JP17310081 A JP 17310081A JP S634499 B2 JPS634499 B2 JP S634499B2
- Authority
- JP
- Japan
- Prior art keywords
- film
- heat
- heat treatment
- less
- tension
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000010438 heat treatment Methods 0.000 claims description 18
- 229920006267 polyester film Polymers 0.000 claims description 11
- 238000000034 method Methods 0.000 claims description 10
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 5
- 239000002253 acid Substances 0.000 description 4
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- -1 polyethylene terephthalate Polymers 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- 150000007513 acids Chemical class 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 150000002009 diols Chemical class 0.000 description 2
- 238000009998 heat setting Methods 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 150000001991 dicarboxylic acids Chemical class 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 239000001023 inorganic pigment Substances 0.000 description 1
- RXOHFPCZGPKIRD-UHFFFAOYSA-N naphthalene-2,6-dicarboxylic acid Chemical compound C1=C(C(O)=O)C=CC2=CC(C(=O)O)=CC=C21 RXOHFPCZGPKIRD-UHFFFAOYSA-N 0.000 description 1
- 239000012860 organic pigment Substances 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- XNGIFLGASWRNHJ-UHFFFAOYSA-L phthalate(2-) Chemical compound [O-]C(=O)C1=CC=CC=C1C([O-])=O XNGIFLGASWRNHJ-UHFFFAOYSA-L 0.000 description 1
- 229920001515 polyalkylene glycol Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 238000007665 sagging Methods 0.000 description 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 1
- 230000002087 whitening effect Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
- B29D7/00—Producing flat articles, e.g. films or sheets
- B29D7/01—Films or sheets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2067/00—Use of polyesters or derivatives thereof, as moulding material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Oral & Maxillofacial Surgery (AREA)
- Thermal Sciences (AREA)
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
- Shaping By String And By Release Of Stress In Plastics And The Like (AREA)
Description
【発明の詳細な説明】
本発明は、ポリエステルフイルムの熱処理方法
に関するものである。
ポリエチレンテレフタレートを主体とするポリ
エステルフイルムは、その優れた機械的、電気的
特性、透明性、寸法安定性等の諸性質から種々の
用途に広く使用されている。中でも、電子機器の
進歩に伴い、フレキシブルプリント回路(以下、
FPCという)用途等への展開は著しいものがあ
る。
しかしながら、通常の二軸延伸ポリエステルフ
イルムでは、製膜技術上の制約から十分なリラツ
クス熱処理が不可能なため、FPC用途等、特に
高温での寸法安定性要求の厳しい用途では、熱寸
法安定性すなわち熱収縮率は未だ不十分である。
熱収縮率を十分小さくするには、実質的に無張
力下で必要な温度に熱処理すればよいことは、当
業者の常識であるが、その際、フイルムのタル
ミ、シワ等平面性の悪化が起こり易いこと、これ
を解消するために張力を加えると低熱収縮化が不
十分となることもまた、当業者が周知のことであ
る。したがつて、EPC用途等特に低熱収縮率品
を必要とする用途においては、小面積カツトシー
トとして熱オーブン中で熱処理するなどの方法を
とらざるを得なかつた。
本発明者らは、平面性のよい、低熱収縮性フイ
ルムを連続的に製造する方法について検討する過
程でEPC用等の製造工程において必要とされる
温度における寸法安定性を満足させるためには、
実質的に無緊張で180℃に30分間加熱した時の熱
収縮率が、タテ方向で0.5%以下、ヨコ方向で0.3
%以下である必要があることを知り、この特性を
満たしつつ平面性の良好なポリエステルフイルム
を得る方法について鋭意検討した結果、本発明に
到達したものである。
本発明の目的は、EPC用途等に適する熱収縮
率が、タテ方向0.5%以下、ヨコ方向0.3%以下の
ポリエステルフイルムを連続的に得るための熱処
理方法を提供するにある。
すなわち、本発明の方法は、二軸延伸ポリエス
テルフイルムを供給ロールと引取ロール間で熱処
理するに際し、該熱処理が熱処理温度T1〜T2、
熱処理時間t1〜t2、張力P〜0.025(Kg/mm2)の各
範囲内でなされる二軸延伸ポリエステルフイルム
の熱処理方法。
ただし、
T1=210(℃)、T2=240(℃)
logt1=1.623×10-3A+1.097(秒)
logt2=1.623×10-3A+0.986(秒)
logP=−1.30×10-3A−0.818(Kg/mm2)
A:フイルムの厚さ(μm)
を特徴とするものである。
本発明におけるポリエステルフイルムとは、95
モル%以上がポリエチレンテレフタレートからな
る二軸延伸フイルムで、そのポリエチレンテレフ
タレートは、エチレングリコール、プロピレング
リコール、ジエチレングリコール、ポリアルキレ
ングリコール、ペンタエリスリトール、ポリオキ
シアルキレングリコール等のジオール成分、テレ
フタル酸、イソフタル酸、フタル酸、2・6−ナ
フタレンジカルボン酸、アジピン酸、セバシン酸
等のジカルボン酸、p−オキシエトキシ安息香酸
等のオキシカルボン酸等を共重合あるいは、これ
らのジオール成分、ジカルボン酸成分、オキシカ
ルボン酸成分等から成るポリエステルを添加、配
合したものであつてもよく、また、無機顔料、有
機顔料、抗酸化剤、紫外線吸収剤等を添加、配合
したものであつてもよい。さらに、本発明に適用
するフイルムは、複合したものであつてもよい。
なお、本発明に適用するフイルムは、通常の熱
固定がなされたもの、すなわちフイルムの縦方向
(フイルムの長手方向)の180℃で30分間加熱した
際の熱収縮率が1%以上4%未満程度のものであ
る。縦方向の180℃で30分間加熱した際の熱収縮
率が4%以上のフイルムは適用が難しくなり、熱
固定なしのフイルムでは適用できない。
本発明の熱処理においては、熱処理温度が210
℃未満では如何に時間を調整しても所望の低熱収
フイルムは得られず、また、210℃〜240℃の温度
においてもt1(秒)未満では所望の低熱収フイル
ムは得られない。
一方、熱処理温度が240℃を超えると、如何に
時間、張力を調整しても平面性良好なフイルムが
得られず、また210℃〜240℃の温度においてもt2
(秒)を超える場合はフイルム張力を如何に調整
しても平面性良好なフイルムが得られない。な
お、熱処理温度は上記のように210〜240℃でなけ
ればならないが、その範囲を220℃〜235℃とする
ことがより好ましい。
また、フイルム張力が0.025(Kg/mm2)以下で
は、フイルムの平面性が不良となり、P(Kg/mm2)
を超えると所望の低熱収縮フイルムが得られな
い。
以上述べたように本発明は、二軸延伸フイルム
を特定の熱処理温度、処理時間、処理張力にて熱
処理する方法としたので、熱収縮率が低く、かつ
平面性の良好なフイルムが得られるという優れた
効果を奏するものである。
なお、本発明のフイルムは、EPC支持フイル
ム、FPCスペーサー、EPCカバーフイルム、フ
ラツトパツケージ、フラツトキーラベル、制御基
板スペーサー、コネクター等に使用するのが好ま
しい。
つぎに、本発明の実施例について説明する。
実施例
固有粘度0.62、軟化点261℃のポリエチレンテ
レフタレートを常法によつて乾燥、溶融押出し、
タテ延伸、ヨコ延伸し、225℃で熱固定して各種
厚みのフイルムを得た。次いでこのフイルムを、
夫々熱処理温度、熱処理時間、熱処理時フイルム
張力を変えて熱処理し、180℃で30分加熱したと
きの熱収縮率および平面性をチエツクした結果を
第1表に示す(表中、No.1、5、8、9、11、
15、16、17、18、22、23、27、30は夫々比較例で
ある)。
なお、第1表におけるタテとは、フイルムの長
さ方向を、ヨコとは、フイルムの幅方向を各々意
味する。
また、平面性の欄の記号は次の区分による。
○:平面性が良好であるもの
△:フイルムが白化し、透明性に低下の認められ
るもの
×:フイルムの広い範囲または局部的にタルミの
認められるもの
【表】DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for heat treating polyester films. Polyester films mainly composed of polyethylene terephthalate are widely used for various purposes due to their excellent mechanical and electrical properties, transparency, and dimensional stability. Among these, with the advancement of electronic equipment, flexible printed circuits (hereinafter referred to as
There is a remarkable development in applications such as FPC (FPC). However, with ordinary biaxially oriented polyester films, sufficient relaxation heat treatment is not possible due to film-forming technology constraints. The heat shrinkage rate is still insufficient. It is common knowledge among those skilled in the art that in order to reduce the thermal shrinkage rate sufficiently, heat treatment can be carried out at the required temperature under virtually no tension. It is also well known to those skilled in the art that this is a common occurrence, and that if tension is applied to overcome this problem, the reduction in heat shrinkage will be insufficient. Therefore, in applications that require products with particularly low thermal shrinkage, such as EPC applications, it has been necessary to use methods such as cutting small area sheets and heat-treating them in a hot oven. In the process of studying a method for continuously manufacturing a low heat shrinkage film with good flatness, the present inventors discovered that in order to satisfy the dimensional stability at temperatures required in the manufacturing process for EPC, etc.
Thermal shrinkage rate when heated to 180℃ for 30 minutes with virtually no tension is 0.5% or less in the vertical direction and 0.3 in the horizontal direction.
% or less, and as a result of intensive study on a method for obtaining a polyester film with good flatness while satisfying this characteristic, the present invention was arrived at. An object of the present invention is to provide a heat treatment method for continuously obtaining a polyester film having a heat shrinkage rate of 0.5% or less in the vertical direction and 0.3% or less in the horizontal direction, which is suitable for EPC applications. That is, in the method of the present invention, when a biaxially stretched polyester film is heat treated between a supply roll and a take-up roll, the heat treatment is performed at a heat treatment temperature of T 1 to T 2 ,
A method for heat treating a biaxially stretched polyester film, which is carried out within the following ranges: heat treatment time t1 to t2 and tension P to 0.025 (Kg/ mm2 ). However, T 1 = 210 (℃), T 2 = 240 (℃) logt 1 = 1.623 × 10 -3 A + 1.097 (seconds) logt 2 = 1.623 × 10 -3 A + 0.986 (seconds) logP = -1.30 × 10 -3 A-0.818 (Kg/mm 2 ) A: Film thickness (μm). The polyester film in the present invention is 95
A biaxially stretched film in which more than mol% of polyethylene terephthalate is composed of diol components such as ethylene glycol, propylene glycol, diethylene glycol, polyalkylene glycol, pentaerythritol, and polyoxyalkylene glycol, terephthalic acid, isophthalic acid, and phthalate. Copolymerization of acids, dicarboxylic acids such as 2,6-naphthalene dicarboxylic acid, adipic acid, and sebacic acid, and oxycarboxylic acids such as p-oxyethoxybenzoic acid, or their diol components, dicarboxylic acid components, and oxycarboxylic acid components. It may be added or blended with a polyester consisting of the like, or it may be added or blended with an inorganic pigment, an organic pigment, an antioxidant, an ultraviolet absorber, etc. Furthermore, the film applied to the present invention may be a composite film. The film used in the present invention has been subjected to normal heat setting, that is, has a heat shrinkage rate of 1% or more and less than 4% when heated at 180°C for 30 minutes in the longitudinal direction of the film. It is of a certain degree. Films with a heat shrinkage rate of 4% or more when heated at 180°C for 30 minutes in the longitudinal direction are difficult to apply, and films without heat setting cannot be used. In the heat treatment of the present invention, the heat treatment temperature is 210
If the temperature is less than t 1 (seconds), the desired low heat loss film cannot be obtained no matter how the time is adjusted, and even at a temperature of 210°C to 240°C, the desired low heat loss film cannot be obtained. On the other hand, if the heat treatment temperature exceeds 240°C, a film with good flatness cannot be obtained no matter how you adjust the time and tension, and even at temperatures between 210°C and 240°C, t2
(seconds), a film with good flatness cannot be obtained no matter how the film tension is adjusted. Note that the heat treatment temperature must be 210 to 240°C as described above, but it is more preferable that the range is 220 to 235°C. Furthermore, if the film tension is less than 0.025 (Kg/mm 2 ), the flatness of the film will be poor and P (Kg/mm 2 )
If it exceeds 20%, the desired low heat shrinkage film cannot be obtained. As described above, the present invention employs a method of heat treating a biaxially stretched film at a specific heat treatment temperature, treatment time, and treatment tension, so that a film with a low heat shrinkage rate and good flatness can be obtained. It has excellent effects. The film of the present invention is preferably used for EPC support films, FPC spacers, EPC cover films, flat packages, flat key labels, control board spacers, connectors, and the like. Next, examples of the present invention will be described. Example Polyethylene terephthalate with an intrinsic viscosity of 0.62 and a softening point of 261°C was dried by a conventional method, melt-extruded,
The films were stretched vertically and horizontally, and heat-set at 225°C to obtain films of various thicknesses. Next, this film
Table 1 shows the results of checking the heat shrinkage rate and flatness when heated at 180℃ for 30 minutes after heat treatment by changing the heat treatment temperature, heat treatment time, and film tension during heat treatment. 5, 8, 9, 11,
15, 16, 17, 18, 22, 23, 27, and 30 are comparative examples, respectively). In Table 1, "vertical" means the length direction of the film, and "horizontal" means the width direction of the film. In addition, the symbols in the flatness column are based on the following classifications. ○: Good flatness △: Film has whitening and reduced transparency ×: Film has sagging over a wide area or locally [Table]
Claims (1)
ルムを再度熱処理することにより180℃に30分間
加熱した時の熱収縮率がタテ方向で0.5%以下、
ヨコ方向で0.3%以下の二軸延伸ポリエステルフ
イルムを得るための熱処理方法において、二軸延
伸ポリエステルフイルムを供給ロールと引取ロー
ル間で熱処理するに際し、該熱処理が、熱処理温
度T1〜T2、熱処理時間t1〜t2、張力P〜0.025
(Kg/mm2)の各範囲内でなされることを特徴とす
る二軸延伸ポリエステルフイルムの熱処理方法。 ただし、 T1=210(℃)、T2=240(℃) logt1=1.623×10-3A+1.097(秒) logt2=1.623×10-3A+0.986(秒) logP=−1.30×10-3A−0.818(Kg/mm2) A:フイルムの厚さ(μm)[Claims] 1. A biaxially stretched polyester film that has already been heat-set is heat-treated again so that the heat shrinkage rate when heated to 180°C for 30 minutes is 0.5% or less in the vertical direction,
In a heat treatment method for obtaining a biaxially oriented polyester film with a content of 0.3% or less in the transverse direction, when the biaxially oriented polyester film is heat treated between a supply roll and a take-up roll, the heat treatment is carried out at a heat treatment temperature of T 1 to T 2 , Time t 1 ~ t 2 , tension P ~ 0.025
(Kg/mm 2 ). However, T 1 = 210 (℃), T 2 = 240 (℃) logt 1 = 1.623 × 10 -3 A + 1.097 (seconds) logt 2 = 1.623 × 10 -3 A + 0.986 (seconds) logP = -1.30 × 10 -3 A−0.818 (Kg/mm 2 ) A: Film thickness (μm)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17310081A JPS5874324A (en) | 1981-10-30 | 1981-10-30 | Heat treatment of polyester film |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17310081A JPS5874324A (en) | 1981-10-30 | 1981-10-30 | Heat treatment of polyester film |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5874324A JPS5874324A (en) | 1983-05-04 |
JPS634499B2 true JPS634499B2 (en) | 1988-01-29 |
Family
ID=15954174
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP17310081A Granted JPS5874324A (en) | 1981-10-30 | 1981-10-30 | Heat treatment of polyester film |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5874324A (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61160224A (en) * | 1985-01-07 | 1986-07-19 | Diafoil Co Ltd | Low shrinkage polyester film and manufacture thereof |
BR8601393A (en) * | 1985-03-26 | 1986-12-02 | Illinois Tool Works | METHOD FOR PROCESSING A FLEXIBLE SUBSTRATE |
JPH06104340B2 (en) * | 1987-03-24 | 1994-12-21 | 東レ株式会社 | Laminated seamless belt |
JP2545116B2 (en) * | 1988-06-25 | 1996-10-16 | 日東電工株式会社 | Transparent conductive laminate |
JP2007197611A (en) * | 2006-01-27 | 2007-08-09 | Fujifilm Corp | Optical film and method for manufacturing the same |
JP2014123755A (en) * | 2014-02-03 | 2014-07-03 | Fujimori Kogyo Co Ltd | Protective film for fpc, resin conductor foil laminate with protective film for fpc, and method of manufacturing flexible printed wiring board using it |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5468880A (en) * | 1977-11-11 | 1979-06-02 | Daiafoil | Method of making low oligomer polyester film |
-
1981
- 1981-10-30 JP JP17310081A patent/JPS5874324A/en active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5468880A (en) * | 1977-11-11 | 1979-06-02 | Daiafoil | Method of making low oligomer polyester film |
Also Published As
Publication number | Publication date |
---|---|
JPS5874324A (en) | 1983-05-04 |
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