JPS6344752A - Sheet with built-in semiconductor device - Google Patents

Abstract

PURPOSE:To facilitate levelling connected parts accurately and improve electrical reliability by a method wherein hard conductor chips are provided between respective conductive patterns of facing insulating films and the conductive patterns are mutually connected. CONSTITUTION:An Ag paste pattern 32 is baked on 1st insulating film 31 and conductive adhesive is applied to a Schottky diode mounting position and a solder ball mounting position and semi-cured by heat. Then a Schottky diode chip 33 is die-mounted and a solder ball 36 is mounted. A through-hole 35 is drilled in the material of 2nd insulating film 34 and the 2nd insulating film 34 is laminated on the 1st insulating film 31. Conductive adhesive is applied to the top electrode 33' of the Schottky diode chip 33 and the through-hole which contains the solder ball 36 is filled with conductive adhesive 37 and the conductive adhesive is semi-cured by heat. An Ag paste pattern 39 is baked on 3rd insulating film 38 and the 3rd insulating film 38 is laminated on the 2nd insulating film 34 on the 1st insulating film 31 and the whole laminated films are subjected to thermocompression bonding by passing through heating compression rolls.

Description

[Detailed Description of the Invention] [Purpose of the Invention (Industrial Application Field) The present invention relates to a tag (TAG) sheet etc. that is attached to displayed products in order to prevent the theft of products at stores. 41! of two films facing each other in relation to a sheet with built-in semiconductor elements applied to. (Prior art) A conventional tag sheet used in a product theft prevention system at a store such as a depot, etc. is shown in Fig. 2 (Prior art). 4) to (C)
It is configured as shown in . In these figures, 1
is an insulating sheet such as a polyimide resin film. A predetermined conductive pattern 2 is formed on the surface of this insulating sheet 1. This four-conductor pattern 2 is formed by etching a copper foil laminated on the surface of the insulating sheet 1, and consists of three parts 2I*22+23. 1
f7:,,;-7,iノ? Kuhn 2 has 0. - A semiconductor diode element 3 is soldered to the turn.

In the figure, 4 indicates the Ushida layer. In this case, the terminals of the diode element 3 are connected to both ends of the conductive pattern portion 22, and conductivity is maintained as shown in the equivalent circuit of FIG.
Together with the turn portion 22, it constitutes an LC resonant circuit. The turn portion 21 functions as a reception antenna of this co-wired circuit, and the turn portion 23 functions as a transmission antenna. These circuit components are protected by an insulating coating made of resin or the like coated thereon by means such as thermocompression bonding.

The above-mentioned tag sheet is used in stores such as Deno and Hitoto in the anti-theft system shown in FIG. Briefly, a tag sheet has a price tag printed on its surface and is attached one by one to each product displayed in a store. This tag sheet is removed from the product when paying the fee at the cash register, and remains on the product that has been obtained illegally.

On the other hand, a detection device as shown is installed at an appropriate exit of the store. In the figure, reference numeral 11 denotes a high frequency transmitting device of about 1.15 GHz, and a transmitting antenna 12 connected to this high frequency transmitting device 11i' is stretched at the exit. High frequency receiving device 13 that senses a frequency of approximately 2.3 GHz
is installed, and a receiving antenna 14 connected to this receiving device 13 is stretched across from the transmitting antenna 12. As shown in the figure, the high frequency transmitting device 11 is activated in case a person passes the exit.

Therefore, when a product that has been illegally acquired and has the tag sheet attached to it, for example, a person wearing a jacket with the tag sheet 10 attached as shown in the figure, passes through this exit, the high frequency receiving device 13, the alarm device 15 sounds, and theft can be prevented.

That is, the high frequency radio waves transmitted from the high frequency transmitting device 11 are received by the receiving antenna section 21 of the tag sheet, whereby the LC consisting of the diode 3 and the coil section 22
The resonant circuit operates. As a result, a radio wave of a specific frequency determined by the value of LC (set to 2.3 GHz according to the receiving device 13) is transmitted from the transmitting antenna portion 23. This high frequency radio wave is received by the antenna 14, detected by the receiving device 13, and operates the alarm device 15.

The conventional tag sheet mentioned above has the following problems.The first problem is that the circuit is formed by etching the copper foil laminated onto the insulating sheet into four predetermined turns. The cost and manufacturing cost are high, and the manufacturing process is complicated, making it difficult to mass-produce.

The second problem is that since the soldered elements 3 are present on the circuits and turns of the insulating sheet, irregularities are formed on the surface. For this reason, it is difficult to maintain the thinness required for the purpose of use, and it is also difficult to print product names and the like.

The third problem is that since the element 3 is soldered, the mounting accuracy is poor and it is difficult to maintain a predetermined circuit performance.

In order to solve these problems, the applicant of the present application
No. 49911 proposes a structure as shown in FIG. 4 as an inexpensive tag sheet that is thin, has excellent flatness, and has a high-precision resonant circuit. That is, this tag sheet is formed by completely printing a conductive paste on the surface of a first insulating film 21, and a predetermined conductive pattern (3 patterns 22), and the first insulating film covering the conductive pattern 22. The second insulating film 2 is bonded to the surface of 21.
3, nine through-holes 24 are opened in the second insulating film 23 so as to expose a predetermined position of the 23rd electrical connection turn 22, and the conductive film is accommodated in one of the through-holes 24! A semiconductor diode chip 25 mounted on the turn 22, a conductive material 26 filled inside another through hole, and a predetermined conductive pattern 2.
7 is printed, the insulating film has conductivity/
a third insulating film 28 bonded onto the second insulating film 23 such that the 4' turn 27 connects between the semiconductor diode chip 25 and the conductive material 26 filled in the through hole; It is characterized in that the conductive patterns 22, 27 and the semiconductor diode chip 25 constitute an LC resonant circuit, and an optical receiving antenna and a transmitting antenna connected thereto.

However, the tag sheet shown in FIG. 4 as described above has the following problems. (1) The 2svL material 26 filled in the null-hole portion of the second insulating film 23 is a diode chip that is housed in another through-hole 24 portion and is mounted on the first e+ film 21. For example, 200 μm ± 10 so that K is approximately the same as the thickness of zs.
An accuracy of 8 μm is required. In this case, conductive material 2
If the formation of the conductive paste is carried out by printing a conductive paste, it is difficult to control the thickness of the conductive paste with the above precision during one production, and the manufacturing yield is low.
Attempting to achieve the above accuracy increases manufacturing costs.

(2) Even if the tag sheet is manufactured with the above precision, in a structure in which only the conductive paste is completely filled into the through holes of the second insulating film 23, there will be a recess (2N) in the center of the surface of the conductive paste. voids) 29 are likely to occur, and the mechanical bonding force between the conductive paste and the conductive pattern 27 of the third insulating film 28 cannot be obtained sufficiently, and when the tag sheet is bent into an arch, the above bonding force is Electrical open failures tend to occur at weak points, resulting in poor reliability.

(Problems to be Solved by the Invention) The present invention aims to solve the above-mentioned problems associated with the conductivity of opposing insulating films and the connection between turns using only conductive paste. The present invention provides a sheet with built-in semiconductor elements that is highly mass-producible, has a high manufacturing yield, is highly reliable, is thin, and has excellent flatness.

[Structure of the Invention] (Preparatory Means for Solving Problems) The sheet with built-in semiconductor elements of the present invention comprises a first insulating film on one side of which a predetermined 41 conductive pattern is formed by printing a conductive paste; a second insulating film bonded to the conductive pattern-formed surface of the first insulating film and having a plurality of through holes formed therein corresponding to predetermined positions of the conductive pattern; the through holes in the second insulating film; a semiconductor element chip that is housed in a part of the conductive material and mounted on the conductive/four turn and has a height approximately equal to the thickness of the second insulating film; a rigid four-body chip housed in a portion and mounted on the conductive pattern and having a height approximately equal to the thickness of the second insulating film;
A conductive adhesive is filled in the through hole accommodating the chip, and a predetermined conductive pattern is formed on one side by printing a conductive paste, and a part of this conductive pattern is formed on the semiconductor chip. It is characterized by comprising a third insulating film electrically connected to the upper end electrode of the element chip and the four-electrode chip, respectively, and bonded on the second insulating film in a virtual state.

Note that each of the above-mentioned insulating films may include a resin film all around, and a polyester resin film is particularly preferred from the viewpoint of cost and customization. As the conductive paste, a semi-hardened silver/epoxy fat-based paste that is widely used in the manufacture of semiconductor devices and the like can be used.

(Function) The conductive patterns of the opposing insulating films are electrically connected by a hard conductive chip and a conductive adhesive interposed between them. Therefore, when conductive turns are formed by printing conductive yeast, leveling of the connecting portion with the conductive chip can be easily and accurately performed, and mass productivity is improved, resulting in a high manufacturing yield.

Please note that the hard conductive chip and conductive adhesive are
11! Since the conductive patterns are fully interposed between the conductive patterns and are sufficiently mechanically bonded to each other, even if the sheet is bent into an arch, the connection between the conductive patterns will remain electrically open. There is little risk of defects and high reliability.

(Embodiment) Hereinafter, an embodiment of the present invention will be described in detail with reference to all the drawings.

In the tag sheet shown in FIG. 1, 31 has a thickness of approximately 15 mm.
The first insulating film (in this example, an ester film) has a thickness of 0 μm, and one side (inner surface side) of the film is printed with a conductive paste (Ag paste in this example) to form a conductive pattern having a predetermined circuit pattern. 32 is formed. A part of the conductive pattern 32 is provided with a semiconductor element chip mount part and a conductor chip mount part, and a Schottky diode chip 33 is mounted on the semiconductor element chip mount part. 3
Reference numeral 4 denotes a second insulating film (a polyester film in this example) which is bonded (laminated and bonded fc) to the conductive pattern forming surface of the first insulating film 31, and its thickness is equal to that of the Schottky diode chip 33. The height is approximately the same as that of (approximately 200 lines), and through holes 35 are formed corresponding to the semiconductor element chip mount portion and the conductor chip mount portion, respectively, and the shot holes 35 are formed in a part of the through holes 35. key diode chip 3
3 is accommodated. Then, a hard conductive chip 36 having a depth and height approximately equal to the thickness of the second insulating film 34 is accommodated in the through hole of the second insulating film 34 corresponding to the conductive chip mount portion. is mounted on the conductor chip mount portion and electrically connected. In this example, spherical solder (solder goal) is used as the conductive chip 36, but it may also be a steel ball or a cylindrical metal chip that fits into a circular through hole. Furthermore, a conductive adhesive 37 is filled in the through hole accommodating the solder goal 36. 38 is a third insulating film (polyester in this example) with a thickness of approximately 150 μm, and a predetermined conductive pattern 39 is printed on one side (inner surface side) of a conductive paste (Ag paste in this example). is formed,
The pattern-shaped bottom surface of this conductor is laminated (laminated and bonded) onto the second insulating film 34. In this case, the conductive pattern 3 of the third insulating film 38
9 is a through hole 35 of the second insulating film 34
The shi that is housed within.

It is electrically connected to the upper end electrode 33' of the cut key diode chip 33 and also to the solder goal 36. In this way, the conductive groove 39 of the third insulating film 38 and the first insulating film 3 are connected via the solder goal 36 in the through hole and the conductive adhesive 37.
By electrically connecting 4 of 1 with the magnetic pattern 32 in a state where they are mechanically and sufficiently bonded, the entire structure becomes an LC resonant circuit having an equivalent circuit as shown in FIG. 2(C). , are connected to this to form a receiving antenna pattern and a transmitting antenna pattern.

An example of the manufacturing process for the above tag sheet will be briefly described. First, the material for the first insulating film 31 is continuously supplied from a first roll, and then Ag paste is offset printed on one side of the film using a printing roll to form nine predetermined turns. Subsequently, the film is passed through an oven to bake the Ag paste pattern 32. Next, in the stamping zone, a conductive adhesive is completely applied to the Schottky diode mount position and the solder goal mount position on the film, and is heated to a semi-cured state. In the mounting zone, the Schottky diode chip 33 is die-mounted at its mounting position, and the entire solder sol 36 is mounted at its mounting position. - While continuously supplying the material for the second insulating film 34 from the second roll, punch through holes 35 at predetermined positions using a punching device, and apply adhesive to both sides of the film using a transfer roll. 0 and Ag-? of the first insulating film 31. - Overlay the second insulating film 34 on the strike pattern forming surface, and place the jockey diode chip 3 in the through hole 35 of the second insulating film 34.
Apply conductive adhesive on the upper end electrode 33' of No. 3 and solder? - The conductive adhesive 37 is filled into the through-hole from the upper surface side of the solder sole 36, and the conductive adhesive is heated to a green hardened state. - 10,000, the material for the third insulating film 38 is continuously supplied from the third roll, and then a printing roll is applied to one side of the film.
G paste is offset printed to form predetermined equal turns. Next, pass the film through an oven, and
g. The paste pattern 39 is fired. And the third above
The Ag d-st cutan forming surface of the insulating film 38 is superimposed on the second insulating film 34 superimposed on the first insulating film 31, and the whole is passed through a heated pressure roll to be heated and pressed. By layering, the semi-hardened conductive adhesive present in the Schottky diode chip part and the solder goal part is completely baked, and multiple rows of tag sheets with a laminated structure as shown in Figure 1 are formed into a strip shape. form a series of things. The thus obtained belt-shaped tag sheet is sent to a punching device where perforations are made for cutting into individual tag sheets, and further sent to a slitter device where it is cut into rows and then wound into a product roll.

As described above, the tag sheet having the entire structure shown in FIG. 1 has the features of the tag sheet shown in FIG. 4 as they are. That is, since the second insulating film 34 is inserted as a spacer between the two opposing insulating films 31 and 38, the sheet surface has no irregularities and has excellent flatness. Therefore, it is suitable for use as a tag sheet in which product names, prices, etc. are printed on the surface. Moreover, the switch diode chip 33 is /
It is difficult to package the chip into a 4' package and incorporate it as an independent semiconductor device, but since the chip itself is used as it is and is being packaged with insulating films 31, 34, and 311, it is difficult to make the tag sheet extremely thin. can do.

Please note that in the tag sheet of the above embodiment, the electrical connection between the conductive patterns 32 and 39 of two opposing insulating films 31 and 38 is accommodated in the through hole of the insulating film 34 inserted as a spacer. However, since the conductive chip 36 and the conductive adhesive 37 have approximately the same height as the depth of the through hole, compared to a structure in which only the conductive paste is filled in the through hole,
There is no problem of difficulty in leveling when the conductive paste is entirely printed, and when the conductive patterns 32 and 39 of the two facing insulating films 31 and 38 are printed using Ag paste. Leveling can be easily and accurately set, mass production is possible, manufacturing yield is high, and costs can be reduced. Please note that even when the tag sheet in the above example is folded into a bow,
Since the conductive chip 36 in the through hole and the conductive adhesive 37 sufficiently maintain the mechanical bond and electrical connection between the opposing conductive terminals, open defects occur. There is little risk and it is highly reliable.

Note that the sheet with a built-in semiconductor element of the present invention is not limited to the tag sheet of the above embodiment, but can also be applied to sheets in general (including IC cards) that have a built-in semiconductor element chip and a conductive pattern for forming a predetermined circuit. Applicable.

[Effects of the Invention] As described above, according to the sheet with built-in semiconductor elements of the present invention, a hard conductive chip is interposed between the conductive patterns of the opposing insulating films to make electrical connection. When the conductive/4' turn is formed by printing a conductive paste, the leveling of the connection part with the conductive chip can be easily and accurately performed, and it is suitable for mass production and has a low manufacturing yield. It gets expensive. Furthermore, when the sheet is bent into a bow, the electrically conductive pattern interconnections with the conductive chips interposed therebetween are less likely to cause electrical open failures, and thus have higher reliability.

[Brief explanation of the drawing]

FIG. 1 is a sectional view showing a tag sheet according to an embodiment of the present invention, FIG. 2 (4) is a plan view showing the circuit glossy turn inside the conventional tag sheet, and FIG. 2 (B) is Same figure (4
) cross-sectional view along the line B-B, Figure 2 (C is the same figure (4)
Circuit / 4' turn equivalent circuit diagram, Figure 3 is a stealth 1 using tag sheeter! A diagram shown to explain the prevention system,
FIG. 4 is a sectional view showing a tag sheet currently being proposed. 31... First insulating film, 32.39... Conductive pattern, 33... Diode chip, 34...
second insulating film, 35... through hole, 36...
...Conductor chip (solder pole), 37...Conductive adhesive, 38...Third insulating film. Applicant's agent Patent attorney Takehiko Suzue Gogo 1 Figure 1vB 1 (A) (B) (() Figure 2

Claims (3)

[Claims] (1) A first insulating film having a predetermined conductive pattern formed on one side by printing conductive paste;
a second insulating film bonded to the conductive pattern forming surface of the insulating film and having a plurality of through holes opened corresponding to predetermined positions of the conductive pattern;
a semiconductor element chip that is housed in a part of the through hole of the insulating film and mounted on the conductive pattern and has approximately the same height as the second insulating film; and a through hole of the second insulating film. a hard conductive chip mounted on the conductive pattern and having approximately the same height as the second insulating film; and filling the through hole housing the conductive chip. A predetermined conductive pattern is formed on one side of the conductive adhesive by printing a conductive paste, and a part of this conductive pattern is electrically connected to the upper end electrode of the semiconductor element chip and the conductive chip, respectively. a third insulating film bonded to the second insulating film while being connected to the third insulating film;
A sheet with a built-in semiconductor element, characterized by comprising an insulating film. (2) A sheet with a built-in semiconductor element according to claim 1, wherein the conductor chip is a spherical solder. (3) The semiconductor element chip is a Schottky diode chip, and the conductive pattern of the first insulating film, the conductive pattern of the third insulating film, the Schottky diode chip, and the conductive chip are connected. 3. The semiconductor element built-in sheet according to claim 1, wherein the circuit comprises an LC resonant circuit and a receiving antenna and a transmitting antenna connected to the LC resonant circuit.