JPS6344748A - 半導体素子の冷却構造 - Google Patents
半導体素子の冷却構造Info
- Publication number
- JPS6344748A JPS6344748A JP18811286A JP18811286A JPS6344748A JP S6344748 A JPS6344748 A JP S6344748A JP 18811286 A JP18811286 A JP 18811286A JP 18811286 A JP18811286 A JP 18811286A JP S6344748 A JPS6344748 A JP S6344748A
- Authority
- JP
- Japan
- Prior art keywords
- refrigerant
- fin
- cooling
- circulation path
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18811286A JPS6344748A (ja) | 1986-08-11 | 1986-08-11 | 半導体素子の冷却構造 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18811286A JPS6344748A (ja) | 1986-08-11 | 1986-08-11 | 半導体素子の冷却構造 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6344748A true JPS6344748A (ja) | 1988-02-25 |
| JPH0515307B2 JPH0515307B2 (cs) | 1993-03-01 |
Family
ID=16217910
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18811286A Granted JPS6344748A (ja) | 1986-08-11 | 1986-08-11 | 半導体素子の冷却構造 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6344748A (cs) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5390076A (en) * | 1992-01-22 | 1995-02-14 | Nec Corporation | Cooling structure for integrated circuits |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6188596A (ja) * | 1984-10-05 | 1986-05-06 | 富士通株式会社 | 電子部品の冷却構造 |
| JPS6176965U (cs) * | 1984-10-25 | 1986-05-23 |
-
1986
- 1986-08-11 JP JP18811286A patent/JPS6344748A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6188596A (ja) * | 1984-10-05 | 1986-05-06 | 富士通株式会社 | 電子部品の冷却構造 |
| JPS6176965U (cs) * | 1984-10-25 | 1986-05-23 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5390076A (en) * | 1992-01-22 | 1995-02-14 | Nec Corporation | Cooling structure for integrated circuits |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0515307B2 (cs) | 1993-03-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5125451A (en) | Heat exchanger for solid-state electronic devices | |
| US6650538B1 (en) | Fin heat sink and airflow tube assembly employing annular airflows, and methods of fabrication thereof | |
| EP0243710A3 (en) | Flexible finned heat exchanger | |
| JPH10209221A (ja) | 電子集積回路パッケージ | |
| US11622476B2 (en) | Circuit board assemblies for electronic devices | |
| JPS6344748A (ja) | 半導体素子の冷却構造 | |
| JP2735306B2 (ja) | 基板冷却装置 | |
| JPS60220954A (ja) | 集積回路素子冷却装置 | |
| JPS61292944A (ja) | 集積回路パツケ−ジの液体冷却構造 | |
| JP2001332674A (ja) | 現場交換可能モジュール | |
| JPH04177869A (ja) | 半導体装置及び半導体ウェーハの実装方法 | |
| JPH0135484Y2 (cs) | ||
| CN219267643U (zh) | 具有避让功能的散热模块 | |
| JPS6227340Y2 (cs) | ||
| JPH0322951Y2 (cs) | ||
| JPH08125371A (ja) | プリント基板収納筐体 | |
| JPS59143388A (ja) | 液冷用電子回路基板 | |
| JPH0311894Y2 (cs) | ||
| JPH04336500A (ja) | 伝導冷却構造 | |
| JPS6072252A (ja) | 半導体素子の冷却構造 | |
| JPS5839044A (ja) | 半導体装置用集積パツケ−ジ・薄膜熱交換器 | |
| JPS61244050A (ja) | 電子部品の冷却構造 | |
| JPH011264A (ja) | 集積回路素子の冷却装置 | |
| JPS59213154A (ja) | 半導体素子冷却構造 | |
| JPS61272954A (ja) | 磁性流体を用いた冷却構造 |