JPS6344457U - - Google Patents
Info
- Publication number
- JPS6344457U JPS6344457U JP13866786U JP13866786U JPS6344457U JP S6344457 U JPS6344457 U JP S6344457U JP 13866786 U JP13866786 U JP 13866786U JP 13866786 U JP13866786 U JP 13866786U JP S6344457 U JPS6344457 U JP S6344457U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- hybrid integrated
- guide frame
- circuit boards
- external
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000010396 two-hybrid screening Methods 0.000 claims 3
- 239000011295 pitch Substances 0.000 claims 1
- 238000005192 partition Methods 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Combinations Of Printed Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Casings For Electric Apparatus (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13866786U JPH0635476Y2 (ja) | 1986-09-10 | 1986-09-10 | 混成集積回路 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13866786U JPH0635476Y2 (ja) | 1986-09-10 | 1986-09-10 | 混成集積回路 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6344457U true JPS6344457U (de) | 1988-03-25 |
| JPH0635476Y2 JPH0635476Y2 (ja) | 1994-09-14 |
Family
ID=31043856
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13866786U Expired - Lifetime JPH0635476Y2 (ja) | 1986-09-10 | 1986-09-10 | 混成集積回路 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0635476Y2 (de) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02266554A (ja) * | 1989-04-07 | 1990-10-31 | Nec Corp | 集積回路パッケージ |
| JP2011222552A (ja) * | 2010-04-02 | 2011-11-04 | Denso Corp | 表面実装型電子部品及び表面実装型電子部品の実装構造 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP4303916A4 (de) * | 2021-03-05 | 2024-04-17 | Mitsubishi Electric Corporation | Halbleitermodul |
-
1986
- 1986-09-10 JP JP13866786U patent/JPH0635476Y2/ja not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02266554A (ja) * | 1989-04-07 | 1990-10-31 | Nec Corp | 集積回路パッケージ |
| JP2011222552A (ja) * | 2010-04-02 | 2011-11-04 | Denso Corp | 表面実装型電子部品及び表面実装型電子部品の実装構造 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0635476Y2 (ja) | 1994-09-14 |