JPS62204370U - - Google Patents
Info
- Publication number
- JPS62204370U JPS62204370U JP9305686U JP9305686U JPS62204370U JP S62204370 U JPS62204370 U JP S62204370U JP 9305686 U JP9305686 U JP 9305686U JP 9305686 U JP9305686 U JP 9305686U JP S62204370 U JPS62204370 U JP S62204370U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- wiring board
- printed wiring
- pins
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9305686U JPS62204370U (de) | 1986-06-18 | 1986-06-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9305686U JPS62204370U (de) | 1986-06-18 | 1986-06-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62204370U true JPS62204370U (de) | 1987-12-26 |
Family
ID=30955307
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9305686U Pending JPS62204370U (de) | 1986-06-18 | 1986-06-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62204370U (de) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019216244A1 (ja) * | 2018-05-07 | 2019-11-14 | 株式会社村田製作所 | 多層基板及びその接続構造 |
-
1986
- 1986-06-18 JP JP9305686U patent/JPS62204370U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019216244A1 (ja) * | 2018-05-07 | 2019-11-14 | 株式会社村田製作所 | 多層基板及びその接続構造 |
| JPWO2019216244A1 (ja) * | 2018-05-07 | 2021-03-11 | 株式会社村田製作所 | 多層基板及びその接続構造 |
| US11470728B2 (en) | 2018-05-07 | 2022-10-11 | Murata Manufacturing Co., Ltd. | Multilayer board and connecting structure of the same |