JPS6343430U - - Google Patents

Info

Publication number
JPS6343430U
JPS6343430U JP13689086U JP13689086U JPS6343430U JP S6343430 U JPS6343430 U JP S6343430U JP 13689086 U JP13689086 U JP 13689086U JP 13689086 U JP13689086 U JP 13689086U JP S6343430 U JPS6343430 U JP S6343430U
Authority
JP
Japan
Prior art keywords
film fixing
semiconductor device
fixing member
film
insulating member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13689086U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0432762Y2 (US07122603-20061017-C00045.png
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP13689086U priority Critical patent/JPH0432762Y2/ja
Publication of JPS6343430U publication Critical patent/JPS6343430U/ja
Application granted granted Critical
Publication of JPH0432762Y2 publication Critical patent/JPH0432762Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched

Landscapes

  • Credit Cards Or The Like (AREA)
  • Die Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP13689086U 1986-09-04 1986-09-04 Expired JPH0432762Y2 (US07122603-20061017-C00045.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13689086U JPH0432762Y2 (US07122603-20061017-C00045.png) 1986-09-04 1986-09-04

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13689086U JPH0432762Y2 (US07122603-20061017-C00045.png) 1986-09-04 1986-09-04

Publications (2)

Publication Number Publication Date
JPS6343430U true JPS6343430U (US07122603-20061017-C00045.png) 1988-03-23
JPH0432762Y2 JPH0432762Y2 (US07122603-20061017-C00045.png) 1992-08-06

Family

ID=31040428

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13689086U Expired JPH0432762Y2 (US07122603-20061017-C00045.png) 1986-09-04 1986-09-04

Country Status (1)

Country Link
JP (1) JPH0432762Y2 (US07122603-20061017-C00045.png)

Also Published As

Publication number Publication date
JPH0432762Y2 (US07122603-20061017-C00045.png) 1992-08-06

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