JPS634316Y2 - - Google Patents

Description

[Detailed description of the invention] This invention relates to a memory device equipped with a storage integrated circuit element, and the storage integrated circuit element is covered with a conductive covering member connected to its ground connection terminal to prevent static electricity, etc. This prevents the integrated circuit from being destroyed.

Conventionally, ROM (read-only memory),
When connecting storage integrated circuit elements such as RAM (Random Access Memory) to logic circuits, careless handling may damage the integrated circuit even if a part of the human body touches the connection terminal. Electrostatic damage occurred.

The purpose of this invention is to provide a memory device that is less susceptible to electrostatic discharge damage and easier to connect.

The memory device according to this invention covers a storage integrated circuit element with a conductive covering member so that a portion of each of its plurality of connection terminals is exposed, and also covers a grounding connection terminal of the storage integrated circuit element. It is characterized by being electrically connected to the member.
According to these characteristics, even if you handle the memory device carelessly, your hands, etc. will first touch the covering member connected to the ground connection terminal, and then touch any connection terminal other than the ground connection terminal. Even if something happens, these connection terminals are only at the same potential as the covering member and the ground connection terminal, so that the internal circuitry of the memory integrated circuit element is effectively protected from electrostatic damage. In addition, in this specification,
The term "connection terminal" shall include not only the leads or pins inherent in the integrated circuit element, but also the conductors connected thereto.

This invention will be described in detail below with reference to embodiments shown in the accompanying drawings.

FIG. 1 shows a musical score sheet equipped with a memory device according to an embodiment of this invention.

The musical score sheet 10 has a musical score printed on the surface of a sheet main body 12 made of cardboard or the like, and a memory device 14 is provided in the margin near the lower end.

The musical score sheet 10 is used in an electronic musical instrument. That is, the lower part of the musical score sheet 10 is inserted into the music stand groove provided on the top surface of the electronic musical instrument, and electrically connected to the memory device 14 via the connector device. In such an electrically connected state, the stored contents of the memory device 14 can be read and automatic performance can be performed.

FIG. 2 shows a memory device 14 and a connector device 2.
This shows the cross-sectional structure of 0.

In the memory device 14, a storage integrated circuit element 22 made of a ROM is provided on the sheet body 12. The integrated circuit element 22 has a plurality of leads 24 protruding from one side and a grounding lead 26 protruding from the other side, and the internal circuit includes, for example, a wire for automatically playing the music on the surface of the sheet. It stores performance data.

An insulating member 28 is provided on the sheet body 12 adjacent to the integrated circuit device 22 and having approximately the same thickness. The insulating member 28 acts as a fixture for fixing the plurality of leads 24 of the integrated circuit element 22 and also acts as a spacer, and includes one or more lateral holes 30 for receiving the plurality of leads 24;
A plurality of vertical holes 32 are provided to expose a portion of each of the plurality of leads 24.

The integrated circuit element 22 and the insulating member 28 are covered with a dish-shaped conductive covering member 34 made of metal, and the peripheral portion of the covering member 34 is fixed to the sheet body 12 with a vinyl-based adhesive thin film 36. ing. The covering member 34 has a plurality of openings 38 for exposing the plurality of vertical holes 32 of the insulating member 28, respectively. Note that one large opening may be provided to expose the plurality of vertical holes 32.

The grounding lead 26 of the integrated circuit element 22 is electrically connected to the inner surface of the covering member 34 by solder or the like.

The connector device 20 includes an insulating connector body 4
0, and a recess 42 that fits into the projection of the covering member 34 is provided on the surface of the connector body 40 facing the memory device 14 . Recess 42
On the inner surface of the insulating member 28, connection pins 44 are respectively provided in portions corresponding to the plurality of vertical holes 32 of the insulating member 28.
are provided, and each connecting pin 44 comes into electrical contact with a corresponding lead 24 through a corresponding vertical hole 32 when the connector device 20 is fitted into the memory device 14. Incidentally, the surfaces of the connecting pin 44 and the lead 24 are plated with gold to ensure good electrical contact between the connecting pin 44 and the lead 24.

A conductive layer 46 for grounding is formed on the inner surface of the recess 42 at a portion other than the location where the connecting pin 44 is arranged so as to come into contact with the covering member 34 when the connector device 20 is fitted to the memory device 14. There is.

Note that the connection pin 44 and the conductive layer 46 are electrically connected to a data reading circuit or the like within the electronic musical instrument by wiring means (not shown).

According to the above configuration, the memory device 14 can be easily connected to a data reading circuit or the like by simply fitting the connector device 20 to the memory device 14. In addition, since the integrated circuit element 22 is covered with the conductive covering member 34, even if it is touched carelessly by hand, the covering member 34 at the ground potential will be removed before the leads 24 are touched.
This can prevent a situation where the integrated circuit in the integrated circuit element 22 is electrostatically destroyed. Note that in order to prevent damage to the integrated circuit during connection, the connection pin 44 must be connected to the lead 24.
It is preferable to configure the fitting portion so that the conductive layer 46 contacts the covering member 34 before contacting the conductive layer 46 .

3 and 4 show a file having a memory device according to another embodiment of the invention, with FIG. 3 showing the file in an open state;
FIG. 4 shows the file in a closed state.

The file 50 has a binding tool 53 for binding a suitable paper 52, and a folding section 54 is provided on the back cover (or the front cover). This folding section 54 is provided with a memory device 56, and this folding section 54 is provided with a memory device 56.
4 is folded as shown in FIG.

5, 6 and 7 show the folding section 5
4 and the detailed configuration of the memory device 56.

The folding section 54 has a structure in which a vinyl leather cover 62 is provided on one surface of a hard paper 58 having a hole for arranging a memory device 56 via a cushion material 60, and the other surface of the hard paper 58 is covered with a vinyl leather cover 64. It's getting old.

In the memory device 56, a battery (BATT) 66, a first memory integrated circuit element 68 made of RAM, a second memory integrated circuit element 70 made of RAM, and a battery 66 are disposed on the cushion material 60 of the memory device 56.
6. A printed circuit board 72 is provided which has a wiring pattern for interconnecting the integrated circuit elements 68 and 70 and leading the leads of the integrated circuit elements 68 and 70 to a connection position with a connector device (not shown). There is.

The battery 66, integrated circuit elements 68 and 70, and printed circuit board 72 are covered with a dish-shaped conductive covering member 74 made of metal, and the peripheral portion of the covering member 74 is interposed between the cushion material 60 and the hard paper 58. inserted and fixed.

As shown in FIG. 7, an insulating member 76 is provided on the printed circuit board 72 and serves as a spacer. 7
8 are provided in large numbers. Inside each connection hole 78, an integrated circuit element 6 is mounted on the printed circuit board 72.
A contact member 80 is provided which is connected to 8 or 70 corresponding leads via a wiring layer on the printed circuit board. Further, the grounding wiring layer on the printed circuit board 72 is connected to the grounding leads of the integrated circuit elements 68 and 70, and this grounding wiring layer is electrically connected to the inner surface of the covering member 74 by the lead 82. It is connected.

The covering member 74 is provided with a hole 84 having a larger diameter corresponding to each connection hole 78 in a planar arrangement as shown in FIG. In addition, the covering member 74 includes
As shown in FIG. 5, guide holes 86a and 86 for inserting a pair of guide pins of the connector device.
b is provided. In addition, instead of providing the guide holes 86a and 86b, guide notches 88a and 88b may be provided on both sides of the covering member 74.

According to the memory device 56 having the above configuration, the guide pins of the connector device are connected to the guide holes 86a and 86b.
By inserting the connecting pin of the connector device into the connecting hole 78 through the hole 84 while engaging the guide cutouts 88a and 88b, the necessary electrical connection with the device to be used can be achieved. and,
In this case, since the guide pin first touches the covering member 74 at the ground potential, it is possible to prevent damage to the integrated circuit during connection. Further, even if the contact member 80 is not touched directly even if it is handled carelessly by hand or the like, it only touches the covering member 74 at the ground potential, so it is possible to effectively prevent damage to the integrated circuit due to human body static electricity or the like.

8, 9, 10, and 11 show memory devices according to still other embodiments of this invention.

The memory device 90 in this example includes a first storage integrated circuit element 92 made of ROM, and a second storage integrated circuit element 94 made of ROM.
As shown in FIG. 9, it has a flat shape.

A large number of leads 96 of an integrated circuit element 92 and a large number of leads 98 of an integrated circuit element 94 are connected to an insulating member 10 for a spacer, as shown in FIGS. 10 and 11.
It is inserted into the corresponding horizontal hole 102 of No. 0 and led out to a groove 104 connected to each horizontal hole 102. Additionally, integrated circuit elements 92 and 94
The insulating member 100 is housed in a case consisting of a pair of conductive covering members 106 and 108 made of metal, and the covering member 108 has a number of cutouts for exposing the lead lead-out grooves 104 of the insulating member 100, respectively. It has 110.

The grounding lead 112 of the integrated circuit element 92 and the grounding lead 114 of the integrated circuit element 94 are both electrically connected to the inner surface of the covering member 108 by solder or the like.

As an example, the connector device (not shown) includes groove 1.
04 is formed, and a lead 9 is inserted into the receiving port through a groove 104.
6 and 98 may be arranged.

The memory device 90 having the above configuration has the same effect of preventing damage to an integrated circuit as the memory devices of the two embodiments described above, and can be stored in a pocket provided in a notebook, file, etc., or by attaching means provided in a case. Therefore, it can be attached to a notebook, file, etc., and when used, it can be taken out or removed from the notebook, file, etc., and inserted into a device to be used, such as a musical instrument or language practice device.

As described above, according to this invention, since the storage integrated circuit element is covered with a conductive covering member connected to its ground connection terminal, damage to the integrated circuit due to static electricity, etc. can be effectively prevented. , a memory device that is convenient to handle and easy to connect is realized.

[Brief explanation of the drawing]

FIG. 1 is a front view showing a musical score sheet equipped with a memory device according to an embodiment of the invention, FIG. 2 is a sectional view of the memory device of FIG. 1 and a connector device coupled thereto, and FIG. 4 is a front view showing an open state of the file including a memory device according to another embodiment of the invention, FIG. 4 is a perspective view showing the file of FIG. 3 in a closed state, and FIG. 3
6 is a sectional view taken along the line - in FIG. 5, and FIG. 7 is an enlarged top view of the memory device shown in FIG.
5 is a cross-sectional view taken along the - line in FIG. 5; FIG. 8 is a top view showing a memory device according to another embodiment of the invention; FIG. 9 is a side view of the memory device in FIG. 8;
10 is a sectional view taken along the line XX in FIG. 8, and FIG. 11 is a sectional view taken along the line XI-XI in FIG. 8. 14,56,90...Memory device, 22,6
8, 70, 92, 94...Storage integrated circuit element,
34, 74, 106, 108...Electroconductive covering member.

Claims (1)

[Scope of utility model registration request] a storage integrated circuit element having a ground connection terminal and a plurality of other connection terminals; and a conductive covering member that covers the storage integrated circuit element so that a portion of each of the plurality of connection terminals is exposed. What is claimed is: 1. A memory device characterized in that the grounding connection terminal is electrically connected to the covering member.