JPS637999Y2 - - Google Patents

Info

Publication number
JPS637999Y2
JPS637999Y2 JP1983141947U JP14194783U JPS637999Y2 JP S637999 Y2 JPS637999 Y2 JP S637999Y2 JP 1983141947 U JP1983141947 U JP 1983141947U JP 14194783 U JP14194783 U JP 14194783U JP S637999 Y2 JPS637999 Y2 JP S637999Y2
Authority
JP
Japan
Prior art keywords
wiring board
printed wiring
case
semiconductor memory
shielding plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1983141947U
Other languages
Japanese (ja)
Other versions
JPS6051696U (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP14194783U priority Critical patent/JPS6051696U/en
Publication of JPS6051696U publication Critical patent/JPS6051696U/en
Application granted granted Critical
Publication of JPS637999Y2 publication Critical patent/JPS637999Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Elimination Of Static Electricity (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Description

【考案の詳細な説明】 産業上の利用分野 本考案は半導体メモリを収容するカートリツジ
に関する。
DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a cartridge containing a semiconductor memory.

背景技術とその問題点 従来、プログラム等の情報の記憶された半導体
メモリを収容してマイクロコンピユータ等の電子
機器への着脱を容易にしたメモリカートリツジが
知られている。そして、従来のメモリカートリツ
ジでは、内部の半導体メモリの静電破壊を防止す
るために、半導体メモリを搭載した印刷配線板の
端子部に合成樹脂製のカバーを設けて、端子部に
手などが直接触れないようにしたもの、また非使
用時に端子部を導体ですべて短絡したものがあつ
た。
BACKGROUND TECHNOLOGY AND PROBLEMS Conventionally, memory cartridges have been known that house semiconductor memories in which information such as programs is stored and that can be easily attached to and detached from electronic devices such as microcomputers. In conventional memory cartridges, in order to prevent electrostatic damage to the internal semiconductor memory, a synthetic resin cover is provided over the terminal section of the printed wiring board that carries the semiconductor memory, and the terminal section is covered with a cover made of synthetic resin. Some were made so that they could not be touched directly, and some had all terminals shorted with conductors when not in use.

然しながら、前者は高圧の静電気には無力であ
り、後者は構造が複雑で価格上昇を招くという欠
点があつた。
However, the former has disadvantages in that it is powerless against high-voltage static electricity, and the latter has a complicated structure, leading to an increase in price.

考案の目的 本考案は、かゝる点に鑑み、簡単な構造ながら
半導体メモリの静電破壊を確実に防止し得るメモ
リカートリツジを提供することを目的とする。
Purpose of the Invention In view of the above, an object of the present invention is to provide a memory cartridge which has a simple structure but can reliably prevent electrostatic damage to a semiconductor memory.

考案の概要 本考案は、半導体メモリを搭載した印刷配線板
を収容する匣体と、この匣体の開口に配設した導
電性遮蔽部材と、この遮蔽部材を匣体の開口内に
移動自在に接触支持する第1の導電性ばねと、こ
の第1の導電性ばねと印刷配線板のアースパター
ンとの間に介在する第2の導電性ばねとを具備す
るメモリカートリツジであつて、半導体メモリの
静電破壊を確実に防止することができる。
Summary of the invention The present invention includes a case that houses a printed wiring board equipped with a semiconductor memory, a conductive shielding member disposed in the opening of the case, and a conductive shielding member that is movable within the opening of the case. A memory cartridge comprising a first conductive spring for contact support and a second conductive spring interposed between the first conductive spring and a ground pattern of a printed wiring board, the memory cartridge comprising: a semiconductor memory; Electrostatic damage can be reliably prevented.

実施例 以下、図面を参照しながら、本考案によるメモ
リカートリツジの一実施例について説明しよう。
Embodiment Hereinafter, an embodiment of a memory cartridge according to the present invention will be described with reference to the drawings.

第1図に本考案によるメモリカートリツジの一
実施例の分解図を示す。第1図において、1は半
導体メモリ(ICメモリ)、2は印刷配線板であつ
て、半導体メモリ1は印刷配線板2に搭載されて
いる。印刷配線板2の一方の端部に複数の端子3
が配設され、そのうちのアース端子3eからアー
スパターン4が配線板2の中央部の透孔5を繞つ
て設けられる。尚、図示を省略するも、複数の端
子3の他の端子は、印刷配線板2上の他の導電パ
ターンを介して半導体メモリ1の各ピンに接続さ
れている。
FIG. 1 shows an exploded view of an embodiment of a memory cartridge according to the present invention. In FIG. 1, 1 is a semiconductor memory (IC memory), 2 is a printed wiring board, and the semiconductor memory 1 is mounted on the printed wiring board 2. A plurality of terminals 3 are provided at one end of the printed wiring board 2.
A ground pattern 4 is provided extending from the ground terminal 3e of the ground terminal 3e to the through hole 5 in the center of the wiring board 2. Although not shown, other terminals of the plurality of terminals 3 are connected to each pin of the semiconductor memory 1 via other conductive patterns on the printed wiring board 2.

6は配線板周縁の切欠部である。7は圧縮コイ
ルばね、8は開脚ばねであつて、共に金属線から
作られ、この開脚ばね8はコイル部8cと、コイ
ル部8cから延長され、相互に交叉する1対の脚
部8lから成り、脚部8lの先端8fは後出の遮
蔽板30と確実に摺動接触するように折曲げてあ
る。また、コイルばね7のコイル直径及び開脚ば
ね8のコイル部8cの直径は印刷配線板2の透孔
5の周囲のアースパターン4の直径と略等しい。
6 is a notch on the periphery of the wiring board. 7 is a compression coil spring, and 8 is a leg spring, both of which are made of metal wire, and this leg spring 8 has a coil portion 8c and a pair of leg portions 8l extending from the coil portion 8c and crossing each other. The tip 8f of the leg 8l is bent to ensure sliding contact with a shielding plate 30, which will be described later. Further, the coil diameter of the coil spring 7 and the diameter of the coil portion 8c of the spread leg spring 8 are approximately equal to the diameter of the ground pattern 4 around the through hole 5 of the printed wiring board 2.

9は結合用ねじ、10は上側匣体半部、20は
下側匣体半部であつて、両匣体半部10,20は
合成樹脂成型品であり、両匣体半部10及び20
が一体に結合されて匣体40を構成する。両匣体
半部10及び20の詳細構造は後述する。
9 is a coupling screw, 10 is an upper half of the casing, 20 is a lower half of the casing, both casing halves 10 and 20 are synthetic resin molded products;
are combined together to form the case 40. The detailed structure of both housing halves 10 and 20 will be described later.

30は金属製遮蔽板であつて、印刷配線板2の
端子3を隠顕させるための長孔31が設けられ
る。また、遮蔽板30の長辺及び短辺の一部にそ
れぞれ折曲部32及び33が設けてある。
30 is a metal shielding plate, and is provided with a long hole 31 for concealing the terminal 3 of the printed wiring board 2. Further, bent portions 32 and 33 are provided on a portion of the long side and short side of the shielding plate 30, respectively.

次いで、第2図及び第3図を参照しながら、匣
体半部10及び20の詳細構造を説明する。
Next, the detailed structure of the housing halves 10 and 20 will be explained with reference to FIGS. 2 and 3.

第2図において、上側匣体半部10は上板11
とこの上板11を繞る側壁12とを有し、上板1
1の長辺側の側壁の一方は一部切欠かれて開口部
13となつている。14は1対の弾性鉤片、15
は円筒状突起であつて、円筒状突起15の頂部は
周縁15cが一段高くなつており、弾性鉤片14
と共に上板11の内面に植立される。16は1対
の案内突条であつて、開口部13の端縁より外寄
りに設けられる。17は1対の支持突起である。
18はカートリツジを電子機器へ挿脱する際に指
を掛けるための凹部(長辺に沿う多数の凸条が形
成されている)の裏側を示す。
In FIG. 2, the upper housing half 10 is the upper plate 11
and a side wall 12 that covers the upper plate 11.
One of the long sides of the side wall 1 is partially cut out to form an opening 13. 14 is a pair of elastic hooks, 15
is a cylindrical protrusion, and the top of the cylindrical protrusion 15 has a peripheral edge 15c that is higher than the elastic hook 14.
It is also planted on the inner surface of the upper plate 11. Reference numeral 16 denotes a pair of guide protrusions, which are provided outward from the edge of the opening 13. 17 is a pair of support protrusions.
Reference numeral 18 indicates the back side of a recessed portion (formed with a large number of protrusions along the long sides) on which a finger is placed when inserting and removing the cartridge into an electronic device.

第3図において、下側匣体半部20は下板21
とこの下板21を繞る側壁22とを有し、下板2
1の長辺側の側壁の一方は一部切欠かれて開口部
23となつている。24は1対の係止片、25は
円柱状突起であつて、係止片24及び円柱状突起
25は共に下板21の内面に上側匣体半体10の
弾性鉤片14及び円筒状突起15とそれぞれ対向
するように植立されており、円柱状突起25の頂
部25tにはねじ止め用の孔が設けられ、また基
部25bは頂部25tよりも大径である。26は
1対の案内突条であつて、開口部23の端縁より
外寄りに設けられる。27は1対の係止支承片、
28は支承片であつて、共に前出の印刷配線板2
を支承するために設けられる。
In FIG. 3, the lower housing half 20 is a lower plate 21.
and a side wall 22 that covers the lower plate 21.
One of the long sides of the side wall 1 is partially cut out to form an opening 23. 24 is a pair of locking pieces, and 25 is a cylindrical projection. Both the locking piece 24 and the cylindrical projection 25 are connected to the elastic hook piece 14 and the cylindrical projection of the upper case half 10 on the inner surface of the lower plate 21. A screw hole is provided at the top 25t of the cylindrical projection 25, and the base 25b has a larger diameter than the top 25t. Reference numeral 26 denotes a pair of guide protrusions, which are provided outward from the edge of the opening 23. 27 is a pair of locking support pieces;
28 is a support piece, both of which are attached to the printed wiring board 2 mentioned above.
It is established to support the

本実施例の組立手順は次の通りである。 The assembly procedure of this embodiment is as follows.

下側匣体半部20の開口部23の内側に遮蔽
板30を載置する。遮蔽板30の折曲部33は
突条26と摺動自在に当接する。
A shielding plate 30 is placed inside the opening 23 of the lower housing half 20. The bent portion 33 of the shielding plate 30 comes into slidable contact with the protrusion 26 .

開脚ばね8の先端8fを遮蔽板30の折曲部
32の内側に当接させると共に、コイル部8c
を円柱状突起25に係合する。開脚ばね8の弾
力によつて遮蔽板30の端部は開口部23の端
縁の内側に当接する。
The tip end 8f of the leg spring 8 is brought into contact with the inside of the bending part 32 of the shielding plate 30, and the coil part 8c
is engaged with the cylindrical projection 25. Due to the elasticity of the leg spring 8, the end of the shielding plate 30 comes into contact with the inner side of the edge of the opening 23.

コイルばね7を円柱状突起25に係合する。 The coil spring 7 is engaged with the cylindrical projection 25.

印刷配線板2を切欠部6において係止支承片
27に係止する。印刷配線板2の端子3は遮蔽
板30の内側に位置する。また、配線板2の透
孔5を円柱状突起25が貫通し、透孔5を繞る
アースパターン4と遮蔽板30とは、コイルば
ね7及び開脚ばね8を介して、電気的に接続さ
れる。
The printed wiring board 2 is locked to the locking support piece 27 at the notch 6. Terminals 3 of printed wiring board 2 are located inside shielding plate 30. Further, a cylindrical protrusion 25 passes through the through hole 5 of the wiring board 2, and the earth pattern 4 surrounding the through hole 5 and the shielding plate 30 are electrically connected via the coil spring 7 and the spread leg spring 8. be done.

下側匣体半部20に上側匣体半部10を係合
する。上側匣体半部10の弾性鉤片14と下側
匣体半部20の係止片24とが係合する。ま
た、円筒状突起15の頂部周縁15cと円柱状
突起25の大径基部25bとで印刷配線板2の
透孔5の近傍を挾持し、更に、支承突起17と
係止片24の切欠部24aとが印刷配線板2の
厚み方向の動きを規制する。
The upper housing half 10 is engaged with the lower housing half 20. The elastic hook piece 14 of the upper housing half 10 and the locking piece 24 of the lower housing half 20 engage with each other. Further, the vicinity of the through hole 5 of the printed wiring board 2 is sandwiched between the top peripheral edge 15c of the cylindrical projection 15 and the large diameter base 25b of the cylindrical projection 25, and furthermore, the support projection 17 and the notch 24a of the locking piece 24 are held together. and restricts movement of the printed wiring board 2 in the thickness direction.

両匣体10及び20をねじ9で一体に結合す
る。
Both casing bodies 10 and 20 are joined together with screws 9.

上述の手順で組立てられた本実施例のメモリカ
ートリツジにあつては、印刷配線板2の端子3は
アースパターン4に接続された遮蔽板30の内側
に隠れているので、静電気が端子3に直接放電す
ることがなく、従つて、半導体メモリ1が放電に
よつて破壊されることがない。
In the memory cartridge of this embodiment assembled according to the above-described procedure, the terminals 3 of the printed wiring board 2 are hidden inside the shielding plate 30 connected to the ground pattern 4, so that static electricity does not reach the terminals 3. There is no direct discharge, and therefore the semiconductor memory 1 is not destroyed by discharge.

また、本実施例のメモリカートリツジを電子機
器に装着する場合は、電子機器側に設けられた印
刷配線板用コネクタ(図示せず)の絶縁体によつ
て、遮蔽板30が下側匣体半部20の係止片24
に当接するまで押込まれるので、印刷配線板2の
端子3は遮蔽板30の長孔31から露出し、コネ
クタのコンタクトに接触して、電子機器と半導体
メモリ1とは所定の状態に接続される。
Further, when the memory cartridge of this embodiment is installed in an electronic device, the shielding plate 30 is attached to the lower case by the insulator of the printed wiring board connector (not shown) provided on the electronic device side. Locking piece 24 of half part 20
Since the terminals 3 of the printed wiring board 2 are exposed from the long holes 31 of the shielding plate 30 and come into contact with the contacts of the connector, the electronic device and the semiconductor memory 1 are connected in a predetermined state. Ru.

考案の効果 以上詳述のように、本考案によれば、遮蔽板3
0と印刷配線板2のアースパターン4とが2個の
ばねによつて接続されるので、半導体メモリの静
電破壊を確実に防止することができる。また、ば
ねの構造が簡単であるので組立てが容易であり、
コスト上昇を招かない。
Effects of the invention As detailed above, according to the invention, the shielding plate 3
0 and the ground pattern 4 of the printed wiring board 2 are connected by the two springs, electrostatic damage to the semiconductor memory can be reliably prevented. In addition, the spring structure is simple, making it easy to assemble.
Does not cause cost increases.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案によるメモリカートリツジの一
実施例の分解斜視図、第2図及び第3図は夫々そ
の上側及び下側匣体半部の斜視図である。 1は半導体メモリ、2は印刷配線板、4はアー
スパターン、7はコイルばね、8は開脚ばね、1
0は上側匣体半部、20は下側匣体半部、30は
遮蔽板、40は匣体を示す。
FIG. 1 is an exploded perspective view of an embodiment of a memory cartridge according to the present invention, and FIGS. 2 and 3 are perspective views of upper and lower housing halves thereof, respectively. 1 is a semiconductor memory, 2 is a printed wiring board, 4 is a ground pattern, 7 is a coil spring, 8 is an open leg spring, 1
0 is an upper half of the case, 20 is a lower half of the case, 30 is a shielding plate, and 40 is a case.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体メモリを搭載した印刷配線板を収容する
匣体と、該匣体の開口に配設した導電性遮蔽部材
と、該遮蔽部材を上記匣体の開口内に移動自在に
接触支持する第1の導電性ばねと、該第1の導電
性ばねと上記印刷配線板のアースパターンとの間
に介在する第2の導電性ばねとを具備することを
特徴とするメモリカートリツジ。
A case for accommodating a printed wiring board on which a semiconductor memory is mounted, a conductive shielding member disposed in an opening of the case, and a first member that contacts and supports the shielding member so as to be movable within the opening of the case. A memory cartridge comprising: a conductive spring; and a second conductive spring interposed between the first conductive spring and the ground pattern of the printed wiring board.
JP14194783U 1983-09-13 1983-09-13 memory cartridge Granted JPS6051696U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14194783U JPS6051696U (en) 1983-09-13 1983-09-13 memory cartridge

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14194783U JPS6051696U (en) 1983-09-13 1983-09-13 memory cartridge

Publications (2)

Publication Number Publication Date
JPS6051696U JPS6051696U (en) 1985-04-11
JPS637999Y2 true JPS637999Y2 (en) 1988-03-09

Family

ID=30317319

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14194783U Granted JPS6051696U (en) 1983-09-13 1983-09-13 memory cartridge

Country Status (1)

Country Link
JP (1) JPS6051696U (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS542834A (en) * 1977-05-27 1979-01-10 Atari Inc Cartridge for television game

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS542834A (en) * 1977-05-27 1979-01-10 Atari Inc Cartridge for television game

Also Published As

Publication number Publication date
JPS6051696U (en) 1985-04-11

Similar Documents

Publication Publication Date Title
JP3035541B1 (en) Floating connector
US6288330B1 (en) Cover device adapted to provide electromagnetic interference shielding to an electronic component that is received in a housing of an electrical appliance
US6447303B1 (en) Communication module connector
JP2763861B2 (en) noise filter
JPS6126152B2 (en)
US11146027B2 (en) Electrical receptacle connector
KR960705382A (en) Orientation and Positioning Device for Electrical Connectors
JP2001203490A (en) Filter device for at least one elastic wiring connected externally to case
JPS637999Y2 (en)
JP3264310B2 (en) Low profile connector socket
JP3057562B2 (en) Electrical connector key mechanism
EP0573239B1 (en) Coplanar sliding electrical connector
CN219228290U (en) Interference suppressor and washing machine
JPH056719Y2 (en)
JPS6217989Y2 (en)
JPH0631753Y2 (en) Grounding structure of electronic equipment
JPH0548372Y2 (en)
JPS634316Y2 (en)
JPH0623026Y2 (en) Case device
JPS594549Y2 (en) Noise prevention connector device
JP2000269660A (en) Transmission and receiving unit
JP2536625B2 (en) Emulation probe for flat package IC
JPH054719Y2 (en)
JPH081581Y2 (en) Noise prevention connector
JPH0357023Y2 (en)