JPH0310676Y2 - - Google Patents

Description

[Detailed description of the invention] This invention relates to an easily attachable and detachable integrated circuit device in which an integrated circuit element having a large number of leads is built into a package.A grounding lead is connected to the inner surface of a conductive cover member and other leads are By leading out to a concave groove provided at one end of an insulating substrate, the structure is simplified and the integrated circuit element is prevented from being damaged by electrostatic discharge.

Conventionally, in order to make IC elements such as IC (integrated circuit) memory removable to electrical equipment, ICs were placed on insulating substrates.
A device is known in which the device is fixed and the leads of the IC device are connected to conductive paths provided on the substrate (for example, see Japanese Patent Laid-Open No. 76223/1983).

However, according to such conventional technology,
(1) Because it is necessary to provide a conductive path on the board, the configuration is complicated and increases the cost. (2) Because the leads or conductive path are exposed, the IC can be easily damaged by human static electricity during handling. There are problems such as the occurrence of

The purpose of this invention is to provide a novel integrated circuit device that solves these problems.

The integrated circuit device according to this invention consists of (a) an insulating substrate having a recess for arranging elements on one main surface, and a plurality of recesses for leading out leads from an end surface of the substrate to reach the recess; Grooves are arranged in parallel, and the bottom surfaces of these concave grooves are each formed with a step for locking the leads at a position near the end surface; Another flat integrated circuit element having a plurality of leads, wherein the plurality of leads are inserted into the plurality of concave grooves respectively, and each lead is bent near its tip to fit the step in the corresponding concave groove. (c) a conductive cover member attached to the insulating substrate so as to cover the integrated circuit element and the recess, the conductive cover member having a plurality of recessed grooves; The grounding lead is electrically connected to the inner surface of the conductive cover member, and the grounding lead is electrically connected to the inner surface of the conductive cover member. It is.

According to the configuration of this invention, a plurality of leads other than those for grounding the integrated circuit element are led out to the vicinity of the end surface of the substrate through the concave grooves, so there is no need to provide a special conductive path as in the prior art described above. , it becomes possible to attach and detach it to other devices.

Further, since the plurality of leads are inserted into the plurality of concave grooves, fingers and the like hardly come into contact with the leads.

Furthermore, since the grounding lead of the integrated circuit element is electrically connected to the inner surface of the conductive cover member, when the integrated circuit device of this invention is grabbed by hand, the conductive cover member is first touched by the hand, etc. Even if you touch any lead other than the one for rear grounding,
Since the potential of this lead is only equal to the potential of the grounding lead, it is possible to prevent high voltage from being applied to the internal circuits of the integrated circuit element due to static electricity or the like.

Furthermore, the plurality of leads are each inserted into a plurality of concave grooves, and the vicinity of the tip of each lead is bent to lock at a step in the corresponding concave groove, which simplifies the assembly work and allows other The lead can be attached to and removed from equipment smoothly, and the tip of the lead will not be damaged mechanically by turning over or peeling off during attachment or detachment.

This invention will be described in detail below with reference to embodiments shown in the accompanying drawings.

1 to 3 show an IC memory device 10 according to an embodiment of the invention, which includes an insulating substrate 12, an IC memory element 14, and a conductive cover member 16 as main components. I'm here.

The insulating substrate 12 is made of, for example, plastic, and as shown in FIG. 3, a recess 18 for arranging the elements is formed on one main surface thereof, and a number of recesses for leading out leads are formed near one end. Grooves 20 are arranged in parallel. Each concave groove 20 has a bottom surface 20a.
is formed to be inclined as shown in FIG. 2, and a recessed portion 22 for inserting and fixing the lead tip.
is formed, and the lead is locked in a bent state in the vicinity of the tip, as shown in FIG. Furthermore, engagement recesses 24 and 26 are formed on both sides of the concave groove arrangement portion of the substrate 12.

The IC memory element 14 is made of, for example, a flat package type ROM, and a large number of signal lead-out leads 28 and ground leads 30 are led out from its sides.

The conductive cover member 16 is constructed by processing a metal plate, for example, and is used to cover the IC memory element 14.
is accommodated in the recess 18 and the lead 28 is placed in the recessed groove 20.
After inserting and fixing the IC into the recess and recess 22,
The memory element 14 is covered and attached to the substrate 12 using locking pieces A, B, C, etc.
The cover member 16 is provided with an opening 32 as shown in FIG.
A lead 28 inserted into the device is exposed to enable connection with other equipment. The cover member 16 also has substrates 12 on both sides of the opening 32.
Engagement recesses 34 and 36 are provided corresponding to the recesses 24 and 26, respectively. These recesses 34 and 36 are for engaging with engaging pieces of a connector device, as will be described later.

As shown in FIG. 2, the lead 28 and the concave groove 20
The gap formed between the bottom surface 20a and the bottom surface 20a is adapted to absorb contact pressure from above. Also,
The grounding lead 30 is electrically connected to the inner surface of the cover member 16.

4 and 5 show the above IC memory device 10.
This figure shows a connector device 40 to be coupled with a base member 42, a terminal plate 44, and a large number of electrical terminals 4 as main components.
6. Contains a coil spring 48, etc.

The base member 42 is screwed to other equipment, and a pair of protruding pieces 50 and 52 are provided on the main surface of the base member 42 parallel to each other and spaced apart from each other. 44 is rod 54
It is rotatably attached to the base member 42, and together with the base member 42, it forms a receiving opening for the above-mentioned IC memory device and the like. Furthermore, a stopper 56 is provided on the main surface of the base member 42 for stopping an IC memory device or the like inserted into the receiving opening.

On the side of the terminal board 44 facing the base member 42, first and second electrical terminals 46, each made of a leaf spring or the like, are arranged to hold a plurality of electrical terminals 46 parallel to each other and spaced apart from each other and electrically insulated from each other. Holding pieces 58 and 6
0 is provided so as to protrude toward the base member 42, and the second holding piece 60 is adapted to come into contact with the upper surface of the stopper 56. Further, on both sides of the tip end of the terminal plate 44, engaging pieces 62 and 64 protrude toward the base member 42 for engaging, respectively, the recesses 34 and 36 provided on the outer surface of the package in the aforementioned IC memory device 10, etc. It is set up like this.

A coil spring 48 is attached to the rod 54, and one end of this spring 48 extends above the terminal plate 44 so as to constantly press the terminal plate 44 toward the base member 42 (forward). .

FIGS. 6 and 7 show how the above-described IC memory device 10 and connector device 40 are connected.

When the IC memory device 10 is inserted into the receiving opening between the base member 42 and the terminal board 44, the terminal board 4
4 pivots rearward against the force of spring 48 as cover member 16 slides under engagement pieces 62 and 64, allowing smooth reception of IC memory device 10. When the tip of the IC memory device 10 (the concave groove arrangement portion) reaches the stopper 56, the engaging pieces 62 and 64 fit into the concave portions 34 and 36, respectively, thereby reliably stopping the IC memory device 10. A grounding electrical terminal 46a of the electrical terminals 46 electrically contacts the cover member 16 from above, and the other electrical terminals also electrically contact the corresponding leads 28 from above.

After this, connect the IC memory device 10 to the connector device 4.
0, but in this case, the terminal board 44
rotates backward against the force of spring 48,
IC memory device 10 smoothly connects connector device 4
It can be separated from 0.

FIG. 8 shows an example of application of the above-described IC memory device 10 and connector device 40.

A recess 72 for placing a musical score is provided on the upper surface of the electronic musical instrument main body 70, and an elongated protrusion 74 for preventing the musical score from slipping is provided on the front side of this recess 72. A plate-like member (music stand) 76 for supporting music is provided behind the recess 72, and the aforementioned connector device 40 is provided in a groove 78 on the right side of the recess 72.

The music score book 80 has a front cover 82 and a back cover 84.
, a plurality of musical score sheets 86 bound between these covers 82 and 84 , and the above-mentioned music sheet 86 fixed near the lower right corner on the inside surface of the back cover 84 .
An IC memory device 10 is included.

In the ROM as the IC memory element 14 in the IC memory device 10, musical score data corresponding to a plurality of songs printed on the musical score sheet 86 is stored in advance.

When using the music score book 80, it is placed in the recess 72 as shown in FIG. 8, and the lower right corner of the back cover 84 is inserted into the groove 78. Then, the IC memory device 10 is coupled to the connector device 40 as shown in FIGS. 6 and 7, and the IC memory device 14 is connected to the connector device 40 as shown in FIGS.
is electrically connected to the internal circuit of the electronic musical instrument via the connector device 40.

After this, operate the song selection switch to select the desired song, and transfer the score data for one song to the IC memory device.
It can be read from 0 and used for automatic performance and/or automatic key press display, etc. In this case, the read musical score data may be used after being stored in a RAM (random access memory) or the like within the musical instrument, or may be used directly without such storage processing.

In the above embodiment, an IC memory device is illustrated as an example of an integrated circuit device, but this invention can also be applied to integrated circuit devices other than memories. Furthermore, the integrated circuit device of this invention can be attached to and detached from electrical equipment other than electronic musical instruments as appropriate, and when applied to various types of equipment, it can be used as a standalone device without being attached to sheets, cards, etc. .

As described above, according to this invention, a compact and detachable integrated circuit device can be realized, and the following excellent effects can be obtained.

(1) Since the leads of the IC element are used as contacts with other devices, there is no need to provide conductive paths on the board, which simplifies the configuration and reduces costs.

(2) Since the leads of the IC element are guided into the concave groove at the edge of the board, the leads cannot be easily touched by fingers, etc.
Contact deterioration and IC electrostatic damage are effectively prevented.

(3) Since the cover is made of a conductor and used for grounding, even if you touch the contact, it will always be at the same potential as the ground lead, and this will also prevent
IC electrostatic damage is effectively prevented.

(4) The vicinity of the tip of each lead inserted into the concave groove is bent so that it is locked at a step within the concave groove, which simplifies assembly work and allows for smooth attachment and detachment to other equipment. , the lead tip is protected from mechanical damage during attachment and detachment.

[Brief explanation of the drawing]

1 to 3 show an IC memory device according to an embodiment of the invention, in which FIG. 1 is a perspective view;
FIG. 2 is a sectional view, FIG. 3 is an exploded perspective view, FIGS. 4 and 5 show a connector device to which the IC memory device is coupled, and FIG. 4 is a perspective view.
Fig. 5 is a side view, Figs. 6 and 7 show how the IC memory device and the connector device are connected, Fig. 6 is a perspective view, and Fig. 7 is taken along the - line in Fig. 6. The sectional view, FIG. 8, is a perspective view showing an application example of the IC memory device and the connector device. 10...IC memory device, 12...insulating substrate,
14...IC memory element, 16... Conductive cover member.

Claims (1)

[Claims for Utility Model Registration] (a) An insulating substrate having a recessed portion for arranging elements on one main surface, which has a plurality of recessed portions for leading out leads from an end surface of the substrate to reach the recessed portion. Grooves are arranged in parallel, and the bottom surfaces of these concave grooves are each formed with a step for locking a lead at a position near the end surface, and (b) a grounding lead and a grounding lead protruding laterally, Another flat integrated circuit element having a plurality of leads, wherein the plurality of leads are inserted into the plurality of concave grooves, and each lead is bent near its tip to fit the step in the corresponding concave groove. (c) a conductive cover member attached to the insulating substrate so as to cover the integrated circuit element and the recess, the conductive cover member having a plurality of recessed grooves; An integrated structure characterized by having an opening that is continuously exposed from the end surface through each step to each lead, and the grounding lead is electrically connected to the inner surface of the conductive cover member. circuit device.