JPS6342155A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS6342155A JPS6342155A JP18633186A JP18633186A JPS6342155A JP S6342155 A JPS6342155 A JP S6342155A JP 18633186 A JP18633186 A JP 18633186A JP 18633186 A JP18633186 A JP 18633186A JP S6342155 A JPS6342155 A JP S6342155A
- Authority
- JP
- Japan
- Prior art keywords
- lead
- directions
- inner lead
- slant
- machining
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 9
- 239000011347 resin Substances 0.000 abstract description 6
- 229920005989 resin Polymers 0.000 abstract description 6
- 238000003754 machining Methods 0.000 abstract description 4
- 238000005452 bending Methods 0.000 abstract description 2
- 230000015556 catabolic process Effects 0.000 abstract 1
- 238000000034 method Methods 0.000 description 4
- 238000007789 sealing Methods 0.000 description 3
- 241000723353 Chrysanthemum Species 0.000 description 2
- 235000007516 Chrysanthemum Nutrition 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は半導体装置に用いられるリードフレームの改良
に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to improvements in lead frames used in semiconductor devices.
一般に樹脂封止型半導体装置に用いられているリードフ
レームのインナーリードは、第２図の平面図に示すよう
に、半導体チップを載置固着するアイランド１２を中央
にして、多数の、例えば２８本のリード１１の内端部が
アイランド１２の周囲を囲むように設けられている。ア
イランド１２を外枠（図示されず）に吊っている墨シビ
ン１３の近くのインナーリードの長さが、吊りビン１３
と直角位ｆｆＫあるインナーリードに比べ非常に長くな
っている。As shown in the plan view of FIG. 2, the inner leads of a lead frame generally used in a resin-sealed semiconductor device have a large number of leads, for example, 28 leads, with an island 12 on which a semiconductor chip is placed and fixed in the center. The inner ends of the leads 11 are provided so as to surround the island 12. The length of the inner lead near the black sheath 13 hanging the island 12 on the outer frame (not shown) is the length of the inner lead near the hanging bin 13.
It is much longer than the inner lead, which has a perpendicular position ffK.
第２図に示すリードフレームのアイランド１１に載置固
着した半導体チップとインナーリード１２の内端との間
を接続するワイヤポンディング工程から、第２図の破線
の枠４で示す領域内の樹脂封止工程までの間に受ける機
械的な衝撃によシ、インナーリードの上下方向の振動が
生じやすく、ボンディングワイヤが断線することが多発
する。From the wire bonding process for connecting the semiconductor chip placed and fixed on the island 11 of the lead frame shown in FIG. 2 to the inner ends of the inner leads 12, the resin in the area indicated by the broken line frame 4 in FIG. Due to mechanical shocks received up to the sealing process, vertical vibrations of the inner leads are likely to occur, and bonding wires often break.
さらに、樹脂封止全行なう際、樹脂の急速な移動による
インナーリードの上下、左右方向のバタッキを生じさせ
、前述と同様、ボンディングワイヤ断線の危険が高い。Furthermore, when the entire resin sealing is performed, the rapid movement of the resin causes the inner leads to flap in the vertical and horizontal directions, and as described above, there is a high risk of bonding wire breakage.
このようなインナーリード先端の上下方向の振動を防止
する方法として第３図（＆）の平面図および同図（ｂ）
の同図（勾のＡ−Ａ断面図に示すように、インナーリー
ド１４の長手方向に平行に窪み溝５ｔ−設けたものもあ
るが、この対策ではインナーリード１４の上下方向に対
する衝撃に対しては強化されているが、しかし、多ピン
のリードフレームでは、インナーリードの巾が狭くなっ
ておシ、上述した方法は加工精度上不可能に近くなって
いる。As a method of preventing such vertical vibration of the tip of the inner lead, the plan view in Figure 3 (&) and the figure (b)
As shown in the same figure (A-A sectional view of the slope), there is also a recessed groove 5t that is provided parallel to the longitudinal direction of the inner lead 14, but this countermeasure prevents the inner lead 14 from being impacted in the vertical direction. However, in a multi-pin lead frame, the width of the inner lead becomes narrow, making the above-mentioned method nearly impossible in terms of processing accuracy.
特に第２図のような２８ピンクラスのリードフレームで
は、アイランドを吊る吊シピンＪ３に近接しているイン
ナーリード先端の断面形状は正方形に近く、インナーリ
ード長手方向に平行な方向に対する加工自体困難である
。In particular, in a 28-pin class lead frame as shown in Figure 2, the cross-sectional shape of the tip of the inner lead near the hanging pin J3 for hanging the island is close to a square, and machining in the direction parallel to the longitudinal direction of the inner lead is difficult. be.
本発明に係るリードフレームは、インナーリードの長手
方向に対し斜め方向でかつ斜め方向の向きが交互に逆で
ある複数個の窪み長溝が設けられている。The lead frame according to the present invention is provided with a plurality of recessed long grooves that are diagonal to the longitudinal direction of the inner lead and whose diagonal directions are alternately opposite.
つぎに本発明を実施例により説明する。 Next, the present invention will be explained by examples.
第１図（尋は本発明に係るリードフレームのインナーリ
ードの一本を示す平面図、同図働は斜視図である。これ
らの図において、リード１の表面には、リードの長手方
向に対し斜めで、かつ斜めの向きが交互に逆である窪み
溝２，２．・・・が形成されている。これらの窪み溝の
形成は、斜め方向の加工であるため位置精度は必要とさ
れず、加工が容易である。さらにこの加工は、アイラン
ド全リード平面よシ下げるための吊シビンの押し曲げ加
工と同時に行うことで、工数増なしに実施できる。FIG. 1 (the bottom is a plan view showing one of the inner leads of the lead frame according to the present invention, and the same figure is a perspective view. In these figures, the surface of lead 1 has a Recessed grooves 2, 2, etc., which are diagonal and whose diagonal directions are alternately opposite, are formed.The formation of these recessed grooves does not require positional accuracy because the processing is performed in an oblique direction. , processing is easy.Furthermore, this processing can be performed without increasing the number of man-hours by simultaneously performing the pressing and bending processing of the hanging shear for lowering the entire island lead from the plane.
上述のとおり本発明では、リードフレームのインナーリ
ードに斜め方向の窪み溝を設けることによシ、インナー
リードの上下、左右方向に対する衝撃を架溝の部分で吸
収でき、インナーリードの振動を抑制する効果がある。As described above, in the present invention, by providing diagonal grooves in the inner leads of the lead frame, the shocks in the vertical and horizontal directions of the inner leads can be absorbed by the grooves, thereby suppressing the vibrations of the inner leads. effective.
又、斜め方向の向きを交互に逆方向に配置することによ
り、ねじれに対しても抑制する効果がある。Further, by alternately arranging the diagonal directions in opposite directions, there is an effect of suppressing twisting.
第１図（ａ）は本発明の一実施例に係る一本のインナー
リードの部分平面図、同図（ｂ）は斜視図、第２図は２
８ピンデ工アルインライン型半導体装置のリードフレー
ムの樹脂封止領域内の部分平面図、第３図（→は従来方
法によシ衝撃に対して強化されたリードフレームのイン
ナーリードの一部の平面図、同図（ゆけ同図（勾０Ａ−
Ａ断面図である。
１．１１．１４・・・・・・インナーリード、２・・・
・・・インナーリードの窪み溝、４・・・・・・樹脂封
止領域、１２・・・・・・アイランド、１３・・・・・
・吊りピン。
第１図
菊／図
（ａ） Δ （ｂ）
躬３図FIG. 1(a) is a partial plan view of one inner lead according to an embodiment of the present invention, FIG. 1(b) is a perspective view, and FIG.
FIG. 3 is a partial plan view of the resin-sealed area of the lead frame of an 8-pin in-line type semiconductor device (→ is a plan view of a portion of the inner lead of the lead frame reinforced against impact using the conventional method) Figure, the same figure (go to the same figure (gradient 0A-
It is an A sectional view. 1.11.14 Inner lead, 2...
...Inner lead depression groove, 4...Resin sealing area, 12...Island, 13...
・Hanging pin. Figure 1 Chrysanthemum/Figure (a) Δ (b) Chrysanthemum Figure 3
Claims (1)
封止型半導体装置において、前記樹脂封止領域内に位置
するリードフレームのインナーリードには、前記リード
の長手方向に対し斜めで、かつ、斜め方向の向きが交互
に逆である複数の窪み溝が設けられていることを特徴と
する半導体装置。In a resin-sealed semiconductor device that is assembled with leads using a lead frame, the inner leads of the lead frame located within the resin-sealed area are provided with an inner lead that is diagonal to the longitudinal direction of the lead, and that is diagonally directed. 1. A semiconductor device characterized in that a plurality of grooves are provided in which the directions of the grooves are alternately opposite.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18633186A JPS6342155A (en) | 1986-08-08 | 1986-08-08 | Semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18633186A JPS6342155A (en) | 1986-08-08 | 1986-08-08 | Semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6342155A true JPS6342155A (en) | 1988-02-23 |
Family
ID=16186475
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18633186A Pending JPS6342155A (en) | 1986-08-08 | 1986-08-08 | Semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6342155A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5559366A (en) * | 1994-08-04 | 1996-09-24 | Micron Technology, Inc. | Lead finger tread for a semiconductor lead package system |
| US5808355A (en) * | 1995-06-05 | 1998-09-15 | Samsung Aerospace Industries, Ltd. | Lead frame of a semiconductor device and a method for designing it |
| US5808354A (en) * | 1994-11-21 | 1998-09-15 | Samsung Electronics Co., Ltd. | Lead frame for a semiconductor device comprising inner leads having a locking means for preventing the movement of molding compound against the inner lead surface |
| JP2009091626A (en) * | 2007-10-09 | 2009-04-30 | Sumitomo Electric Ind Ltd | Masking device |
-
1986
- 1986-08-08 JP JP18633186A patent/JPS6342155A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5559366A (en) * | 1994-08-04 | 1996-09-24 | Micron Technology, Inc. | Lead finger tread for a semiconductor lead package system |
| US5808354A (en) * | 1994-11-21 | 1998-09-15 | Samsung Electronics Co., Ltd. | Lead frame for a semiconductor device comprising inner leads having a locking means for preventing the movement of molding compound against the inner lead surface |
| US5808355A (en) * | 1995-06-05 | 1998-09-15 | Samsung Aerospace Industries, Ltd. | Lead frame of a semiconductor device and a method for designing it |
| JP2009091626A (en) * | 2007-10-09 | 2009-04-30 | Sumitomo Electric Ind Ltd | Masking device |
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