JPS6340000Y2 - - Google Patents

Info

Publication number
JPS6340000Y2
JPS6340000Y2 JP1981172155U JP17215581U JPS6340000Y2 JP S6340000 Y2 JPS6340000 Y2 JP S6340000Y2 JP 1981172155 U JP1981172155 U JP 1981172155U JP 17215581 U JP17215581 U JP 17215581U JP S6340000 Y2 JPS6340000 Y2 JP S6340000Y2
Authority
JP
Japan
Prior art keywords
chuck
electronic component
pocket
main body
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1981172155U
Other languages
Japanese (ja)
Other versions
JPS5878700U (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP17215581U priority Critical patent/JPS5878700U/en
Priority to GB08230425A priority patent/GB2111033B/en
Priority to KR2019820008511U priority patent/KR890000185Y1/en
Priority to US06/437,329 priority patent/US4578010A/en
Priority to CA000414463A priority patent/CA1192666A/en
Priority to IT8224004A priority patent/IT1191060B/en
Priority to FR8218265A priority patent/FR2515918B1/en
Priority to DE19828230547U priority patent/DE8230547U1/en
Publication of JPS5878700U publication Critical patent/JPS5878700U/en
Application granted granted Critical
Publication of JPS6340000Y2 publication Critical patent/JPS6340000Y2/ja
Granted legal-status Critical Current

Links

Description

【考案の詳細な説明】 本考案は、プリント基板への電子部品挿入動作
を実行する挿入部に対して電解コンデンサ等のテ
ーピングに適しない異形電子部品を移送するため
の電子部品移送用チヤツク機構に関する。
[Detailed Description of the Invention] The present invention relates to an electronic component transfer chuck mechanism for transferring irregularly shaped electronic components that are not suitable for taping, such as electrolytic capacitors, to an insertion section that performs the operation of inserting electronic components into a printed circuit board. .

従来、抵抗器、コンデンサ等のテーピングを用
いて電子部品をプリント基板に自動挿入する電子
部品自動挿入機は知られている。しかし、電子部
品本体の直径が大きな電解コンデンサやパワート
ランジスタ、可変抵抗器等の異形電子部品はテー
ピングに適しないか、テーピングが不可能なた
め、従来の電子部品自動挿入機では挿入できなか
つた。
2. Description of the Related Art Automatic electronic component insertion machines that automatically insert electronic components onto printed circuit boards using taping such as resistors and capacitors have been known. However, irregularly shaped electronic components such as electrolytic capacitors, power transistors, and variable resistors, which have large diameter electronic components, are not suitable for taping, or cannot be taped, so conventional electronic component automatic insertion machines cannot insert them.

そのため、最近本出願人により異形電子部品用
の電子部品自動挿入機の開発が行われるようにな
つてきている。この場合問題となるのは、プリン
ト基板への異形電子部品の挿入を行う挿入部に対
していかに異形電子部品を保持して移送するかで
ある。
Therefore, the applicant of the present invention has recently begun to develop automatic electronic component insertion machines for oddly shaped electronic components. In this case, the problem is how to hold and transfer the odd-shaped electronic component to the insertion section that inserts the odd-shaped electronic component into the printed circuit board.

本考案は、上記の点に鑑み、異形電子部品のう
ちとくに電解コンデンサ等を保持して挿入部に一
個毎供給することが可能な電子部品移送用チヤツ
ク機構を提供しようとするものである。
In view of the above-mentioned points, the present invention aims to provide a chuck mechanism for transferring electronic components, which is capable of holding irregularly shaped electronic components, particularly electrolytic capacitors, etc., and supplying them one by one to an insertion section.

以下、本考案に係る電子部品移送用チヤツク機
構の実施例を図面に従つて説明する。
DESCRIPTION OF THE PREFERRED EMBODIMENTS Examples of the electronic component transfer chuck mechanism according to the present invention will be described below with reference to the drawings.

第1図及び第2図において、シーケンサ1は、
電解コンデンサ等のテーピングに適しない異形電
子部品を複数種類収納しておき、それらのうちか
ら特定種類のものを選択して供給するものであ
り、電子部品移送用チヤツク機構2はシーケンサ
1で選択された電子部品を取出してプリント基板
への電子部品の挿入を行う挿入部3へ移送する。
In FIGS. 1 and 2, the sequencer 1 is
A plurality of types of irregularly shaped electronic parts such as electrolytic capacitors which are not suitable for taping are stored, and a specific type is selected and supplied from among them, and the chuck mechanism 2 for transferring electronic parts is selected by the sequencer 1. The electronic components are taken out and transferred to the insertion section 3 where the electronic components are inserted into the printed circuit board.

前記シーケンサ1において、第1図の如く円筒
外装ケース10の中心には間欠回転軸11が貫通
しており、この間欠回転軸11の周囲に断面が正
多角形の間欠回転保持体12が固着されている。
この間欠回転保持体12の各面には部品マガジン
ホルダ13が固着されており、この部品マガジン
ホルダ13により第3図の如く部品マガジン14
が垂直にかつ等角度間隔で保持される。ここで、
部品マガジン14はプラスチツク等で成形された
上下方向に細長い角筒状であり、電解コンデンサ
等の電子部品20を本体20Aが内側、リード2
0Bが外側となるように一定姿勢(横倒し姿勢)
で多数個積重ねて収納したものである。なお、各
ホルダ13に設けられる部品マガジンはホルダ毎
に異つた品種の電子部品を収納するのが普通であ
る。シーケンサ1の円筒外装ケース10の下端に
は底板21が接続一体化され、これらは装置本体
のフレーム側に固定される。底板21上には、前
記部品マガジン14の下方に位置する如くポケツ
ト24が前記間欠回転保持体12の下部に固定さ
れている。従つて、間欠回転保持体12の間欠回
転運動に伴つて、部品マガジン14及びこの下部
開口に連通するポケツト24が共に一定角度(例
えば45度)回転移動することになる。そして、部
品取出位置となるA点に位置するポケツト24の
下部開口に対応して底板21にも開口部25が形
成され、この位置においてポケツト24の最下段
の電子部品20が電子部品移送用チヤツク機構2
の第1のチヤツク30にて取出されるようになつ
ている。なお、ポケツト24の下部も開口してい
るが、第4図に示すように、部品係止爪27が伸
長ばね28によつてポケツト24の内側に侵入す
る方向に付勢されており、これにより電子部品1
個分のスペースをポケツト24に空けた状態にて
電子部品20の落下を通常時(チヤツク30が位
置しないとき)は防止している。
In the sequencer 1, as shown in FIG. 1, an intermittent rotation shaft 11 passes through the center of a cylindrical exterior case 10, and an intermittent rotation holder 12 having a regular polygonal cross section is fixed around the intermittent rotation shaft 11. ing.
A component magazine holder 13 is fixed to each surface of the intermittent rotation holding body 12, and the component magazine holder 13 allows a component magazine 14 to be opened as shown in FIG.
are held vertically and equiangularly spaced. here,
The component magazine 14 has a rectangular tube shape elongated in the vertical direction and is made of plastic or the like, and holds electronic components 20 such as electrolytic capacitors with the main body 20A inside and the leads 2
Fixed posture with 0B facing outward (sideways posture)
A large number of them are stacked and stored. Note that the component magazine provided in each holder 13 normally stores different types of electronic components for each holder. A bottom plate 21 is integrally connected to the lower end of the cylindrical exterior case 10 of the sequencer 1, and these are fixed to the frame side of the main body of the apparatus. On the bottom plate 21, a pocket 24 is fixed to the lower part of the intermittent rotation holder 12 so as to be located below the component magazine 14. Therefore, with the intermittent rotational movement of the intermittent rotation holding body 12, both the component magazine 14 and the pocket 24 communicating with this lower opening rotate by a certain angle (for example, 45 degrees). An opening 25 is also formed in the bottom plate 21 corresponding to the lower opening of the pocket 24 located at point A, which is the component removal position, and at this position, the electronic component 20 at the bottom of the pocket 24 is inserted into the electronic component transfer chuck. Mechanism 2
The first chuck 30 is adapted to be taken out. Note that the lower part of the pocket 24 is also open, but as shown in FIG. Electronic parts 1
The electronic component 20 is prevented from falling under normal conditions (when the chuck 30 is not located) by leaving space in the pocket 24 for the electronic component 20.

電子部品移送用チヤツク機構2は、電子部品2
0の本体20Aを挾持してシーケンサ1から取出
すための第1のチヤツク30と、該第1のチヤツ
ク30で取出された電子部品20のリード20B
を挾持して挿入部3に移送する第2のチヤツク4
0とを備えている。
The electronic component transfer chuck mechanism 2
A first chuck 30 for holding and taking out the main body 20A of the electronic component 20 from the sequencer 1, and a lead 20B of the electronic component 20 taken out by the first chuck 30.
A second chuck 4 that clamps and transfers the
0.

前記第1のチヤツク30は、第4図に示すよう
に一対の挾持レバー31A,31Bをピン32で
チヤツク取付ブロツク33に枢着し、該チヤツク
取付ブロツク33に組込まれたエアシリンダ34
のピストンロツド35に前記挾持レバー31A,
31Bの下端をリンク36A,36Bを介して連
結したものである。前記チヤツク取付ブロツク3
3はまたボールブツシユ37を一対に有し、シー
ケンサ1の底板21に垂直に設けられたボールブ
ツシユ軸38により上下に摺動自在に支持されて
いる。さらに、チヤツク取付ブロツク33の昇降
駆動は底板21に取付けられたエアシリンダ39
によつて行われる。なお、前記シーケンサ側のポ
ケツト24の下端部には挾持レバー31A,31
Bが侵入可能なように切欠部24Aが形成されて
いる。また挾持レバー31A,31Bの先端は挾
持すべき電子部品20の本体20Aに外接する如
く円弧状面31C,31Dとなつている。
As shown in FIG. 4, the first chuck 30 has a pair of clamping levers 31A and 31B pivotally connected to a chuck mounting block 33 by pins 32, and an air cylinder 34 built into the chuck mounting block 33.
The clamping lever 31A is attached to the piston rod 35 of the
The lower ends of 31B are connected via links 36A and 36B. The chuck mounting block 3
3 also has a pair of ball bushes 37, which are supported by a ball bush shaft 38 provided perpendicularly to the bottom plate 21 of the sequencer 1 so as to be vertically slidable. Further, the chuck mounting block 33 is driven up and down by an air cylinder 39 attached to the bottom plate 21.
It is carried out by. In addition, at the lower end of the pocket 24 on the sequencer side, there are clamping levers 31A, 31.
A notch 24A is formed so that B can enter therein. Further, the tips of the clamping levers 31A and 31B form arcuate surfaces 31C and 31D so as to circumscribe the main body 20A of the electronic component 20 to be clamped.

第2のチヤツク40は、第5図に示すように、
一対の挾持レバー40A,40Bをピン41でチ
ヤツク取付ブロツク42に枢着し、該チヤツク取
付ブロツク42に組込まれたエアシリンダ43の
ピストンロツド44に前記挾持レバー40A,4
0Bの後端をリンク45A,45Bを介して連結
したものである。そのチヤツク取付ブロツク42
は回転駆動軸46に固定され、この回転駆動軸4
6はスライダ47に90度回転駆動される如く設け
られている。一方、シーケンサ1及び装置本体フ
レーム側に固定される支持台48上には平行に一
対の支持軸49が固定され、該支持軸49により
スライダ47は矢印Bの如く水平方向に摺動自在
に支持される。なお、スライダ47の動く範囲を
規制するためにストツパボルト50A,50Bが
設けられ、これらのストツパボルト50A,50
Bはばね51によりクツシヨン効果を持たせてい
る。なお、挾持レバー40Aには電子部品20の
リード20Bの間隔に対応した台形状凸部40C
が、挾持レバー40Bにはその台形状凸部40C
が嵌入する台形状凹部40Dが夫々形成され、こ
れらの凸部40Cと凹部40Dとでリード20B
の間隔が正確に規制される。
The second chuck 40, as shown in FIG.
A pair of clamping levers 40A, 40B are pivotally connected to a chuck mounting block 42 by pins 41, and the clamping levers 40A, 40B are attached to a piston rod 44 of an air cylinder 43 assembled in the chuck mounting block 42.
The rear ends of 0B are connected via links 45A and 45B. The chuck mounting block 42
is fixed to a rotary drive shaft 46, and this rotary drive shaft 4
6 is provided on the slider 47 so as to be rotated by 90 degrees. On the other hand, a pair of support shafts 49 are fixed in parallel on a support stand 48 fixed to the sequencer 1 and the device main body frame side, and the slider 47 is supported by the support shafts 49 so as to be slidable in the horizontal direction as shown by arrow B. be done. In addition, stopper bolts 50A, 50B are provided to restrict the range of movement of the slider 47, and these stopper bolts 50A, 50
B is provided with a cushioning effect by a spring 51. Note that the clamping lever 40A has a trapezoidal convex portion 40C corresponding to the spacing between the leads 20B of the electronic component 20.
However, the trapezoidal convex portion 40C of the clamping lever 40B
A trapezoidal recess 40D into which the lead 20B is fitted is formed, and these convex parts 40C and recess 40D
The spacing between is regulated accurately.

通常、部品マガジン14内の電子部品20は重
力によつてポケツト24内に落下し、第4図の部
品係止爪27に引掛つて止まつている。今、シー
ケンサ1の間欠回転保持体12が所定角度回転し
て所望の品種の電子部品を収納した部品マガジン
14がA点に来ると、第4図の位置関係にある第
1のチヤツク30の挾持レバー31A,31Bが
電子部品20を受入れるために矢印Cの如く開く
方向に作動される。この動作はエアシリンダ34
のピストンロツド35を内部のばね34Aの弾性
で収縮することにより実行され、挾持レバー31
A,31Bが開くと同時に挾持レバー31Bの先
端部分が部品係止爪27のピン27Aに当接して
部品係止爪27を矢印Dの如く外方向に移動させ
る。この結果、ポケツト24の最下段の電子部品
20が解放されて矢印Eの如く挾持レバー31
A,31B間に落下する。その後、エアシリンダ
34は圧縮エアの力によりピストンロツド35を
伸長させる。そして、挾持レバー31A,31B
先端の円弧状面31C,31Dで電子部品20の
本体20Aを挾持した状態でエアシリンダ39が
伸長し、チヤツク取付ブロツク33は矢印Fの如
く下降し、第1のチヤツク30は第2のチヤツク
40が待機する位置にまで下降する。第1のチヤ
ツク30の下降位置では電子部品20のリード2
0Bは第2のチヤツク40に対し丁度第5図の如
き位置関係となる。すなわち、第1のチヤツク3
0でシーケンサ1より取出された電子部品20の
リード20Bを第2のチヤツク40は上向きでか
つ挾持レバー40A,40Bを開いた状態で受入
れる。この状態において、第1図に示す押し棒用
のエアシリンダ60が伸長し、押し棒61で電子
部品20を押込み、電子部品20のリード20B
の基部が確実に第2のチヤツク40で挾持される
ようにする。この場合、ばね62によつて押し棒
61にクツシヨン効果を持たせている。この動作
の後、第2のチヤツク40のエアシリンダ43が
作動して挾持レバー40A,40Bを閉じてリー
ド20Bを挾持する。それから矢印Gの如く回転
駆動軸46が90度回転して第2のチヤツク40を
第2図仮想線のように横向きにして電子部品20
を立てた状態とした後、スライダ47が矢印Bの
ように右方向に水平移動する。この結果、第2の
チヤツク40で保持された電子部品20は挿入部
3の下端位置に移送され、そのリード20Bは挿
入部3で挾持され、この挿入部3の動作によつて
プリント基板70に電子部品20のリード20B
が挿入されることになる。
Normally, the electronic components 20 in the component magazine 14 fall into the pocket 24 due to gravity and are caught by the component locking claws 27 shown in FIG. 4, where they are stopped. Now, when the intermittent rotation holding body 12 of the sequencer 1 rotates by a predetermined angle and the component magazine 14 containing the desired type of electronic components comes to point A, the first chuck 30 in the positional relationship shown in FIG. The levers 31A and 31B are operated in the opening direction as shown by arrow C in order to receive the electronic component 20. This operation is performed by the air cylinder 34.
The piston rod 35 is compressed by the elasticity of the internal spring 34A, and the clamping lever 31
At the same time as A and 31B open, the tip of the clamping lever 31B comes into contact with the pin 27A of the component locking claw 27 to move the component locking claw 27 outward as indicated by arrow D. As a result, the electronic component 20 at the bottom of the pocket 24 is released and the holding lever 31 is moved as shown by arrow E.
It falls between A and 31B. Thereafter, the air cylinder 34 extends the piston rod 35 by the force of compressed air. And the clamping levers 31A, 31B
The air cylinder 39 extends while holding the main body 20A of the electronic component 20 between the arcuate surfaces 31C and 31D at the tips, the chuck mounting block 33 descends as shown by arrow F, and the first chuck 30 connects to the second chuck 40. lowers to the waiting position. In the lowered position of the first chuck 30, the lead 2 of the electronic component 20
0B has a positional relationship with respect to the second chuck 40 exactly as shown in FIG. That is, the first chuck 3
The second chuck 40 receives the lead 20B of the electronic component 20 taken out from the sequencer 1 at 0 with the second chuck 40 facing upward and the holding levers 40A and 40B open. In this state, the air cylinder 60 for the push rod shown in FIG.
to ensure that the base of the chuck is firmly clamped by the second chuck 40. In this case, the spring 62 gives the push rod 61 a cushioning effect. After this operation, the air cylinder 43 of the second chuck 40 is operated to close the clamping levers 40A, 40B and clamp the lead 20B. Then, the rotary drive shaft 46 is rotated 90 degrees as shown by arrow G, and the second chuck 40 is turned sideways as shown by the imaginary line in FIG.
After the slider 47 is in the upright position, the slider 47 moves horizontally to the right as shown by arrow B. As a result, the electronic component 20 held by the second chuck 40 is transferred to the lower end position of the insertion section 3, its leads 20B are clamped by the insertion section 3, and the electronic component 20 is attached to the printed circuit board 70 by the operation of the insertion section 3. Lead 20B of electronic component 20
will be inserted.

上記実施例によれば次のような効果を上げるこ
とができる。
According to the above embodiment, the following effects can be achieved.

(1) シーケンサ1からの電子部品20の取出しを
その本体20Aを挾持する第1のチヤツク30
で行つているので、取出し動作時にリード20
Bが曲がることがない。
(1) A first chuck 30 that holds the main body 20A to take out the electronic component 20 from the sequencer 1.
Since the lead 20 is used during the extraction operation,
B never bends.

(2) 第2のチヤツク40は一対の挾持レバー40
A,40Bで電子部品20のリード20Bを挾
持するだけでなく挾持レバー先端の台形状凸部
40C及び台形状凹部40Dとによつてリード
20Bの間隔を正確に規制できる。
(2) The second chuck 40 is a pair of clamping levers 40
Not only can the leads 20B of the electronic component 20 be clamped by A and 40B, but also the interval between the leads 20B can be accurately regulated by the trapezoidal convex portion 40C and trapezoidal concave portion 40D at the tip of the clamping lever.

除上のように、本考案によれば、電解コンデン
サ等の電子部品を保持して挿入部に一個毎供給す
ることが可能な電子部品移送用チヤツク機構を得
ることができ、異形電子部品用の電子部品自動挿
入機等に装着するのに好適である。
As described above, according to the present invention, it is possible to obtain a chuck mechanism for transferring electronic components that can hold electronic components such as electrolytic capacitors and supply them one by one to the insertion section, and is suitable for handling irregularly shaped electronic components. Suitable for mounting on electronic component automatic insertion machines, etc.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案に係る電子部品移送用チヤツク
機構の実施例であつてとくに第1のチヤツクの周
辺の機構を示す正断面図、第2図は実施例におけ
る第2のチヤツクの周辺の機構を示す正面図、第
3図は部品マガジンの平断面図、第4図は第1の
チヤツクを示す側面図、第5図は第2のチヤツク
を示す側面図である。 1……シーケンサ、2……電子部品移送用チヤ
ツク機構、3……挿入部、14……部品マガジ
ン、20……電子部品、20A……本体、20B
……リード、21……底板、24……ポケツト、
25……開口部、30……第1のチヤツク、31
A,31B……挾持レバー、31C,31D……
円弧状面、40……第2のチヤツク、40A,4
0B……挾持レバー、40C……台形状凸部、4
0D……台形状凹部。
FIG. 1 is a front sectional view showing an embodiment of the chuck mechanism for transferring electronic components according to the present invention, particularly showing the mechanism around the first chuck, and FIG. 2 is a front sectional view showing the mechanism around the second chuck in the embodiment. 3 is a plan sectional view of the parts magazine, FIG. 4 is a side view of the first chuck, and FIG. 5 is a side view of the second chuck. DESCRIPTION OF SYMBOLS 1...Sequencer, 2...Chuck mechanism for electronic component transfer, 3...Insertion section, 14...Parts magazine, 20...Electronic component, 20A...Main body, 20B
... Lead, 21 ... Bottom plate, 24 ... Pocket,
25...Opening, 30...First chuck, 31
A, 31B... Clamping lever, 31C, 31D...
Arc-shaped surface, 40... second chuck, 40A, 4
0B...Pinching lever, 40C...Trapezoidal convex portion, 4
0D...Trapezoidal recess.

Claims (1)

【実用新案登録請求の範囲】 電子部品の本体に外接する円弧状面を夫々先端
に有していて当該電子部品の本体を挾持する一対
の挾持レバー31A,31Bを備え、上下方向に
昇降自在な第1のチヤツク30と、 電子部品のリードの間隔を規制する台形状凸部
を先端に有する一方の挾持レバー40Aと、前記
台形状凸部が嵌入する台形状凹部を先端に有する
他方の挾持レバー40Bとでリードを挾持し、水
平方向に移動自在でかつ回転自在な第2のチヤツ
クの40とを備え、 横倒し姿勢の電子部品が積み重ね状態で入つた
ポケツト24に設けられた部品係止爪27を、前
記第1のチヤツク30は上昇位置にて前記ポケツ
ト外方向に移動させ、前記ポケツト内の電子部品
を落下させてその本体を挾持して下降し、 前記第2のチヤツク40は下降位置の前記第1
のチヤツク30で保持された電子部品のリードを
挾持し、回転して電子部品を立てた状態で所定位
置へ水平移動することを特徴とする電子部品移送
用チヤツク機構。
[Scope of Claim for Utility Model Registration] A pair of clamping levers 31A and 31B each having an arcuate surface circumscribing the main body of the electronic component at the tip and clamping the main body of the electronic component, and is capable of being raised and lowered in the vertical direction. A first chuck 30, one clamping lever 40A having a trapezoidal convex portion at its tip that regulates the interval between the leads of the electronic component, and the other clamping lever having a trapezoidal concave portion at its tip into which the trapezoidal convex portion fits. 40B, and a second chuck 40 that is horizontally movable and rotatable, and a component locking claw 27 provided in a pocket 24 containing stacked electronic components lying on its side. , the first chuck 30 moves outward from the pocket in the raised position, drops the electronic component in the pocket, clamps its main body, and descends, and the second chuck 40 moves outward from the pocket in the lowered position. Said first
A chuck mechanism for transferring an electronic component, characterized in that the chuck 30 grips the lead of the electronic component held and rotates to horizontally move the electronic component to a predetermined position in an upright state.
JP17215581U 1981-10-31 1981-11-20 Chuck mechanism for transferring electronic parts Granted JPS5878700U (en)

Priority Applications (8)

Application Number Priority Date Filing Date Title
JP17215581U JPS5878700U (en) 1981-11-20 1981-11-20 Chuck mechanism for transferring electronic parts
GB08230425A GB2111033B (en) 1981-10-31 1982-10-25 Electronic component selection and supply apparatus
US06/437,329 US4578010A (en) 1981-10-31 1982-10-28 Electronic component selection and supply apparatus in automatic electronic component inserting machine
KR2019820008511U KR890000185Y1 (en) 1981-10-31 1982-10-28 Supplying apparatus of electronic parts
CA000414463A CA1192666A (en) 1981-10-31 1982-10-29 Electronic component selection and supply apparatus in automatic electronic component inserting machine
IT8224004A IT1191060B (en) 1981-10-31 1982-10-29 SELECTION AND FEEDING EQUIPMENT OF ELECTRONIC COMPONENTS FOR AUTOMATIC MACHINES FOR THE INSERTION OF ELECTRONIC COMPONENTS
FR8218265A FR2515918B1 (en) 1981-10-31 1982-10-29 SELECTION AND FEEDING APPARATUS FOR AUTOMATIC INSERTION MACHINE OF ELECTRONIC COMPONENTS IN PRINTED CIRCUITS
DE19828230547U DE8230547U1 (en) 1981-10-31 1982-10-30 DEVICE FOR SELECTING AND FEEDING ELECTRONIC COMPONENTS FOR AN AUTOMATIC ELECTRONIC COMPONENT ASSEMBLY MACHINE

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17215581U JPS5878700U (en) 1981-11-20 1981-11-20 Chuck mechanism for transferring electronic parts

Publications (2)

Publication Number Publication Date
JPS5878700U JPS5878700U (en) 1983-05-27
JPS6340000Y2 true JPS6340000Y2 (en) 1988-10-19

Family

ID=29964060

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17215581U Granted JPS5878700U (en) 1981-10-31 1981-11-20 Chuck mechanism for transferring electronic parts

Country Status (1)

Country Link
JP (1) JPS5878700U (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5361060A (en) * 1976-11-11 1978-06-01 Matsushita Electric Ind Co Ltd Method of and device for inserting electronic part
JPS53140575A (en) * 1977-05-13 1978-12-07 Matsushita Electric Ind Co Ltd Device for automatically inserting part
JPS5515876A (en) * 1978-07-22 1980-02-04 Mitsubishi Plastics Ind Material for packing processed meat and packing method that use said material

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5361060A (en) * 1976-11-11 1978-06-01 Matsushita Electric Ind Co Ltd Method of and device for inserting electronic part
JPS53140575A (en) * 1977-05-13 1978-12-07 Matsushita Electric Ind Co Ltd Device for automatically inserting part
JPS5515876A (en) * 1978-07-22 1980-02-04 Mitsubishi Plastics Ind Material for packing processed meat and packing method that use said material

Also Published As

Publication number Publication date
JPS5878700U (en) 1983-05-27

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