JPS6336663Y2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to improvements in metallized film capacitors.

Conventionally, metallized film capacitors use an organic film 1 made of polyethylene, polycarbonate, polystyrene, polyester, polypropylene, etc. as a dielectric material, and one or both sides of the film 1 (only one side will be explained below) is coated with a material as shown in FIG. As shown, a metallized film having a metal vapor deposited film 2 and a blank area (margin area) 3 is placed in a second layer.
As shown in the figure, the margin part 3 on one side of the film 1
The capacitor element is wound on top of each other so that they are on opposite sides, and metallic contact is applied to both end faces of the capacitor element, and then the lead wire is soldered or welded to provide an exterior. Metallized film capacitors are generally known.

However, with the recent development of electronics, the miniaturization of electronic components has progressed significantly, and these metallized film capacitors have been miniaturized and chipped, and are becoming more and more automated along with ceramic capacitors, electrolytic capacitors, and resistors. Practical use is desired.

The present invention is a practical realization of the above-mentioned requirements, and will be described in detail below based on examples.

FIG. 3 is a perspective view of the winding of a metallized film capacitor according to an embodiment of the present invention, and FIG. 4 is a cross-sectional view of FIG.
1 is the metal film deposited, 13 is the margin part,
14 is a spacer, 15 is a film, and 16 is a lead-out electrode. The two films 11 are arranged so that the margin 13 of the metallized organic film 11 on which the metal film 12 is deposited is located opposite to each other, and the film 11 A metal vapor-deposited lead electrode 16 is preliminarily attached to both ends of at least one side of the film 15, which is thicker than the dielectric film 11, via a spacer 14 at the end of the winding of the capacitor element, which is wound by overlapping the capacitor elements with a shift in the width direction. The formed heat-resistant film was wound and fixed to form a capacitor element. Thereafter, metal powder such as zinc or solder is sprayed onto both end faces of the capacitor element to form a conductive layer 17, and a lead-out electrode 16, which is metal vapor-deposited, is welded to a heat-resistant film that has been wound one or more times at the end of the winding. There is. Therefore, the lead-out electrode 16 may be an external electrode, and the conductive layer and the lead-out electrode may be solder-plated to form an airtight seal.

Since the film capacitor constructed as described above is chip-shaped, it can be handled and used in the same way as recent chip-shaped ceramic capacitors, tantalum capacitors, electrolytic capacitors, etc. A metallized organic film capacitor can also be constructed by connecting a lead wire to the part by soldering or welding or other known means and providing an exterior covering.

However, in the product of the present invention, a heat-resistant film is wound around the end of the winding of the capacitor element, a capacitor element having a band-shaped metal layer is formed on the heat-resistant film, and a conductive layer is formed on both end surfaces of the element. At the same time, the conductive layer is connected to the lead-out electrode provided on the heat-resistant film, and can be used as a chip capacitor.Like conventional chip capacitors, the cylindrical chip is fitted with metal caps on both end faces of the element to ensure airtightness. However, the drawbacks of the cap being heavy and the cap containing air between the cap and the end face, which creates an air vent hole during soldering and moisture absorption through the hole, can be overcome. Furthermore, the chip constructed in this manner can be formed into a square shape, and the shape is required depending on the usage pattern.

As described above, the present invention can be used both as a chip capacitor and as an externally packaged capacitor with external lead wires, and can easily meet various recent market demands.Moreover, it has excellent moisture resistance and heat resistance. It has an excellent and industrially useful configuration.

[Brief explanation of the drawing]

Fig. 1 is an enlarged sectional view of the main part of a conventional capacitor element, Fig. 2 is a partially exploded perspective view of a conventional capacitor element, Fig. 3 is a partially exploded perspective view of the metallized film capacitor of the present invention, and Fig. 4 The figure is an enlarged sectional view of the main part of the capacitor element of the present invention. 11...Organic film, 12...Metal film, 13
...Margin part, 14...Spacer, 15...Film, 16...Leading electrode, 17...Conductive layer.

Claims (1)

[Claims for Utility Model Registration] (1) A capacitor element formed by winding a pair of metalized films made of organic films such as polyester or polypropylene, with a metal vapor-deposited on at least one side, leaving a margin on one end, with a staggered overlap. A heat-resistant film having a conductive layer obtained by vapor deposition or printing of a band-shaped conductive metal on the end face of at least one side is wound one or more times around the end of the winding, and metal powder is sprayed onto both end faces of the element to make it conductive. Layered metallized film capacitor. (2) On the conductive layer formed by spraying metal powder such as zinc or solder on both end faces of the capacitor element,
A metallized film capacitor according to claim 1, which is characterized in that the end face of the winding is sealed with solder plating.