JP2697001B2 - Chip type solid electrolytic capacitor - Google Patents
Chip type solid electrolytic capacitorInfo
- Publication number
- JP2697001B2 JP2697001B2 JP63258464A JP25846488A JP2697001B2 JP 2697001 B2 JP2697001 B2 JP 2697001B2 JP 63258464 A JP63258464 A JP 63258464A JP 25846488 A JP25846488 A JP 25846488A JP 2697001 B2 JP2697001 B2 JP 2697001B2
- Authority
- JP
- Japan
- Prior art keywords
- type solid
- terminals
- electrolytic capacitor
- solid electrolytic
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000003990 capacitor Substances 0.000 title claims description 22
- 239000007787 solid Substances 0.000 title claims description 15
- 238000001721 transfer moulding Methods 0.000 claims description 4
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 4
- NUJOXMJBOLGQSY-UHFFFAOYSA-N manganese dioxide Chemical compound O=[Mn]=O NUJOXMJBOLGQSY-UHFFFAOYSA-N 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910002804 graphite Inorganic materials 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- LNGCCWNRTBPYAG-UHFFFAOYSA-N aluminum tantalum Chemical compound [Al].[Ta] LNGCCWNRTBPYAG-UHFFFAOYSA-N 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000009291 secondary effect Effects 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/008—Terminals
- H01G9/012—Terminals specially adapted for solid capacitors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明はチップ型固体電解コンデンサに関し、特に端
子の導出部の構造に関する。Description: TECHNICAL FIELD The present invention relates to a chip-type solid electrolytic capacitor, and more particularly to a structure of a terminal lead-out portion.
従来、チップ型固体電解コンデンサは、たとえば第３
図（ａ），（ｂ）に示す如く２つの外部端子13,14を導
出した構造のものである。なお図において、11はコンテ
ンサ素子、12は陽極リード線、15は外装材料である。Conventionally, chip-type solid electrolytic capacitors have
It has a structure in which two external terminals 13 and 14 are derived as shown in FIGS. In the drawing, 11 is a contenter element, 12 is an anode lead wire, and 15 is an exterior material.
電解コンデンサは、その誘電体の電気的な性質により
有極性部品である。したがって上述したチップ型固体電
解コンデンサは、２端子を有しており、各端子は、異な
る極性があるため、電子部品としては方向性をもってい
る。An electrolytic capacitor is a polar component due to the electrical properties of its dielectric. Therefore, the above-described chip-type solid electrolytic capacitor has two terminals, and each terminal has a different polarity, and thus has directivity as an electronic component.
万一方向を誤間って実装すると電解コンデンサの場合
電気回路では短絡状態となり、致命的な故障となる。テ
ーピングにするなどして梱包方法を工夫することによっ
て防いでいるが梱包のミスが実装機の誤動作等による逆
実装が起っている。If mounted in the wrong direction, in the case of an electrolytic capacitor, a short circuit will occur in the electric circuit, resulting in a fatal failure. It is prevented by devising a packing method such as taping, but reverse mounting occurs due to a packing error due to a malfunction of the mounting machine.
本発明の目的は180゜方向を変えても正方向に実装で
き、かつ電気的な損失を小さくでき、加えて実装の信頼
性を向上させることができるチップ型固体電解コンデン
サを提供することにある。An object of the present invention is to provide a chip-type solid electrolytic capacitor that can be mounted in the positive direction even when the direction is changed by 180 °, can reduce electrical loss, and can improve the reliability of mounting. .
本発明のトランスファーモールド外装成形したチップ
型固体コンデンサは、外装の四つの各側面から底面部の
各周辺近傍に延長された四つの外部端子を導出して配設
し、さらに前記底面部の中央部に他の一外部端子を導出
して配設し、５端子とすることを特徴として構成され
る。The chip-type solid capacitor formed by the transfer molding exterior molding of the present invention is provided with four external terminals extended from each of the four sides of the exterior to the vicinity of each periphery of the bottom surface portion, and further arranged at the center portion of the bottom surface portion. In addition, another external terminal is derived and disposed, and five terminals are provided.
なお、前記外装の四つの各側面から導出した外部端子
を同極性端子とし、前記他の外部端子を別の極性端子と
することにより本発明の効果的実施例とすることが出来
る。Note that an effective embodiment of the present invention can be achieved by using external terminals derived from the four side surfaces of the exterior as the same polarity terminals and the other external terminals as different polarity terminals.
次に、本発明について図面を参照して説明する。第１
図（ａ），（ｂ）は本発明に関連したの参考例の３端子
チップ型固体コンデンサの外観図および斜視図である。Next, the present invention will be described with reference to the drawings. First
1A and 1B are an external view and a perspective view of a three-terminal chip type solid capacitor according to a reference example relating to the present invention.
まず、アルミニウム タンタルなどの弁作用を有する
金属粉末を所望の形状に成形し、真空焼結し、陽極酸化
を行ない、次いで、二酸化マンガンなどの半導体層、お
よびグラファイト層、ペースト層、はんだ層などの導電
体層を順次形成したコンデンサ素子１の陽極リード線２
を陽極外部端子３に溶接し、コンデンサ素子１の陰極層
を導電接着剤もしくは半田等で陰極外部端子４に接続
し、トランスファーモールドにより成形外装５をし、各
外部端子を切断しフォーミングすることによりこの３端
子チップ型固体電解コンデンサが得られる。First, a metal powder having a valve action, such as aluminum tantalum, is formed into a desired shape, vacuum-sintered, anodized, and then a semiconductor layer such as manganese dioxide, and a graphite layer, a paste layer, a solder layer, etc. Anode lead wire 2 of capacitor element 1 in which conductor layers are sequentially formed
Is welded to the anode external terminal 3, the cathode layer of the capacitor element 1 is connected to the cathode external terminal 4 by a conductive adhesive or solder, etc., the molded exterior 5 is formed by transfer molding, and each external terminal is cut and formed. This three-terminal chip type solid electrolytic capacitor is obtained.
この時陽極外部端子３は、外部３端子のうちで内側に
配置され陰極外部端子４は外部３端子のうちで外側に配
置される。なお、外部３端子は底面においてほぼ平行に
配置されている。At this time, the anode external terminal 3 is disposed inside the three external terminals, and the cathode external terminal 4 is disposed outside the three external terminals. The three external terminals are arranged substantially parallel on the bottom surface.
第２図（ａ），（ｂ）は本発明の実施例の外観図およ
び斜視図である。まず、上記参考例と同様にアルミニウ
ム、タンタルなどの弁作用を有する金属粉末を所望の形
状に成形し、真空焼結し、陽極酸化を行をい、次いで、
二酸化マンガンなどの半導体層、およびグラファイト
層、ペースト層、はんだ層などの導電体層を順次形成し
たコンデンサ素子１の陽極リード線２を陽極外部端子３
に溶接し、コンデンサ素子１の陰極層を導電接着剤もし
くは半田等で陰極外部端子４に接続し、トランスファー
モールドによリ成形外装５をし、各外部端子を切断しフ
ォーミングすることにより本発明の５端子チップ型固体
電解コンデンサが得られる。2 (a) and 2 (b) are an external view and a perspective view of an embodiment of the present invention. First, similarly to the above reference example, aluminum, metal powder having a valve action such as tantalum is formed into a desired shape, vacuum-sintered, anodized, and then
The anode lead wire 2 of the capacitor element 1 in which a semiconductor layer such as manganese dioxide and a conductor layer such as a graphite layer, a paste layer and a solder layer are sequentially formed is connected to an anode external terminal 3.
Of the present invention by connecting the cathode layer of the capacitor element 1 to the cathode external terminal 4 with a conductive adhesive or solder, forming a remolded exterior 5 by transfer molding, and cutting and forming each external terminal. A five-terminal chip type solid electrolytic capacitor is obtained.
この時陽極外部端子３は、外部５端子のうちで内側に
配置され、陰極タト部端子４は外部５端子のうちの外側
に配置された４端子で構成されている。At this time, the anode external terminal 3 is arranged inside of the external five terminals, and the cathode terminal part 4 is constituted by four terminals arranged outside of the external five terminals.
以上説明したように本発明は、中央１端子と周囲４端
子が異なる極性をもつよう構成されているので、 （１）180゜や90゜向きを変えても正方向に実装される
ため梱包時、実装時に方向性について注意を払う必要が
なくなる、 という効果がある。また、 （２）５端子チップ型固体電解コンデンサで陰極側は４
端子のため実装の信頼性が向上する。As described above, the present invention is configured such that one terminal at the center and four terminals at the periphery have different polarities. (1) Even if the orientation is changed by 180 ° or 90 °, the package is mounted in the forward direction. This has the effect of eliminating the need to pay attention to the direction during mounting. (2) A five-terminal chip type solid electrolytic capacitor with a cathode side of 4
Mounting reliability is improved because of the terminals.
（３）実装面積が大きく電気的な損失を小さくすること
ができる、 等の副次的な効果がある。(3) There are secondary effects such as that the mounting area is large and electrical loss can be reduced.
第１図（ａ），（ｂ）は本発明に関連した参考例の３端
子チップ型固体コンデンサの外観図および内部構造を示
す斜視図、第２図（ａ），（ｂ）は本発明の実施例の外
観図および内部構造を示す斜視図、第３図（ａ）（ｂ｝
は従来のチップ型固体電解コンデンサの一例の外観図お
よび内部構造を示す斜視図である。 1,11……コンデンサ素子、2,12……陽極リード線、3,13
……陽極外部端子、4,14……陰極外部端子、5,15……外
装。1 (a) and 1 (b) are perspective views showing an external view and an internal structure of a three-terminal chip type solid capacitor of a reference example related to the present invention, and FIGS. 2 (a) and 2 (b) show the present invention. FIG. 3A is a perspective view showing an external view of the embodiment and FIG.
FIG. 1 is an external view of an example of a conventional chip-type solid electrolytic capacitor and a perspective view showing an internal structure. 1,11 …… Capacitor element, 2,12 …… Anode lead wire, 3,13
…… Anode external terminal, 4,14 …… Cathode external terminal, 5,15 …… Exterior.
Claims (2)
プ型固体電解コンデンサにおいて、外装の四つの各側面
から底面部の各周辺近傍に延長された四つの外部端子を
導出して配設し、さらに前記底面部の中央部に他の一外
部端子を導出して配設し５端子としたことを特徴とする
チップ型固体電解コンデンサ。1. A chip type solid electrolytic capacitor molded by transfer molding, wherein four external terminals extending from each of four side surfaces of the exterior to the vicinity of each periphery of the bottom portion are provided and disposed, and further, the bottom portion is provided. A chip-type solid electrolytic capacitor characterized in that another external terminal is led out and arranged at the center of the chip to provide five terminals.
端子を同極性端子とし、前記他の外部端子を別の極性端
子とした特許請求の範囲第１項記載のチップ型固体電解
コンデンサ。2. The chip-type solid electrolytic capacitor according to claim 1, wherein the external terminals derived from each of the four side surfaces of the outer package are terminals of the same polarity, and the other external terminals are terminals of another polarity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63258464A JP2697001B2 (en) | 1988-10-14 | 1988-10-14 | Chip type solid electrolytic capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63258464A JP2697001B2 (en) | 1988-10-14 | 1988-10-14 | Chip type solid electrolytic capacitor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02105511A JPH02105511A (en) | 1990-04-18 |
| JP2697001B2 true JP2697001B2 (en) | 1998-01-14 |
Family
ID=17320589
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63258464A Expired - Lifetime JP2697001B2 (en) | 1988-10-14 | 1988-10-14 | Chip type solid electrolytic capacitor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2697001B2 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4166112B2 (en) * | 2003-04-09 | 2008-10-15 | 三洋電機株式会社 | Solid electrolytic capacitor and method of attaching solid electrolytic capacitor |
| JP4688675B2 (en) * | 2005-12-28 | 2011-05-25 | ニチコン株式会社 | Multilayer solid electrolytic capacitor |
| JP4986230B2 (en) * | 2007-07-11 | 2012-07-25 | ニチコン株式会社 | Multilayer solid electrolytic capacitor |
| JP5453174B2 (en) * | 2010-06-01 | 2014-03-26 | Ｎｅｃトーキン株式会社 | Bottom electrode type solid electrolytic multilayer capacitor and its mounting body |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5877034U (en) * | 1981-11-18 | 1983-05-24 | 日本電気株式会社 | Chip-shaped electronic components |
| JPS62104435U (en) * | 1985-12-20 | 1987-07-03 |
-
1988
- 1988-10-14 JP JP63258464A patent/JP2697001B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02105511A (en) | 1990-04-18 |
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