JPS6336053U - - Google Patents
Info
- Publication number
- JPS6336053U JPS6336053U JP13044186U JP13044186U JPS6336053U JP S6336053 U JPS6336053 U JP S6336053U JP 13044186 U JP13044186 U JP 13044186U JP 13044186 U JP13044186 U JP 13044186U JP S6336053 U JPS6336053 U JP S6336053U
- Authority
- JP
- Japan
- Prior art keywords
- liquid
- cooling plate
- brazing
- welding
- heat sink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims description 4
- 238000005219 brazing Methods 0.000 claims 1
- 239000002826 coolant Substances 0.000 claims 1
- 238000003466 welding Methods 0.000 claims 1
- 239000007788 liquid Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
Description
第１図及び第２図はいずれも本考案に係る半導
体装置用液冷ヒートシンクの具体例の説明図で、
それぞれイ図は上面図、ロ図はイ図のＸ１―Ｘ１
及びＸ２―Ｘ２断面図である。第３図及び第４図
はいずれも従来の液冷ヒートシンクの説明図で、
それぞれイ図は上面図、ロ図はイ図のＸ３―Ｘ３
及びＸ４―Ｘ４断面図である。
１……半導体素子、２……液冷プレート、３…
…角形パイプ、４……丸パイプ、５……ロー付け
又は溶接部。
1 and 2 are explanatory diagrams of specific examples of liquid cooling heat sinks for semiconductor devices according to the present invention,
Figure A is the top view, and Figure B is the X 1 - X 1 of Figure A.
and an X 2 -X 2 sectional view. Figures 3 and 4 are both explanatory diagrams of conventional liquid cooling heat sinks.
Figure A is the top view, and Figure B is the X 3 - X 3 of Figure A.
and an X 4 -X 4 sectional view. 1... Semiconductor element, 2... Liquid cooling plate, 3...
...Square pipe, 4...Round pipe, 5...Brazed or welded part.
Claims (1)
通路として角形パイプをロー付け又は溶接により
取付けて成る半導体装置用液冷ヒートシンク。 A liquid-cooled heat sink for semiconductor devices, which is made by brazing or welding a rectangular pipe as a coolant conduction path to a liquid-cooling plate on which semiconductor elements are mounted.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13044186U JPS6336053U (en) | 1986-08-26 | 1986-08-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13044186U JPS6336053U (en) | 1986-08-26 | 1986-08-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6336053U true JPS6336053U (en) | 1988-03-08 |
Family
ID=31027942
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13044186U Pending JPS6336053U (en) | 1986-08-26 | 1986-08-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6336053U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009141013A (en) * | 2007-12-04 | 2009-06-25 | Toshiba Corp | Cooling plate structure |
-
1986
- 1986-08-26 JP JP13044186U patent/JPS6336053U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009141013A (en) * | 2007-12-04 | 2009-06-25 | Toshiba Corp | Cooling plate structure |
| JP4703633B2 (en) * | 2007-12-04 | 2011-06-15 | 株式会社東芝 | Cooling plate structure |
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