JPS6334565U - - Google Patents
Info
- Publication number
- JPS6334565U JPS6334565U JP12775286U JP12775286U JPS6334565U JP S6334565 U JPS6334565 U JP S6334565U JP 12775286 U JP12775286 U JP 12775286U JP 12775286 U JP12775286 U JP 12775286U JP S6334565 U JPS6334565 U JP S6334565U
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- carrier
- wire rod
- supports
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims description 3
- 230000002265 prevention Effects 0.000 claims description 2
- 230000032258 transport Effects 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案による反り防止機構の一例の要
部の側面図、第２図は同、正面図、第３図はプリ
ント基板と支持部材との関連を示す斜視図、第４
図はプリント基板の半田処理後の側面図である。
図中、１はプリント基板、２は電子部品、２ａ
はリード、３は長孔、４は支持部材、４ａ１は係
止片、５は半田槽、６はキヤリア、７は線材であ
る。
FIG. 1 is a side view of the main parts of an example of the warpage prevention mechanism according to the present invention, FIG. 2 is a front view of the same, FIG. 3 is a perspective view showing the relationship between the printed circuit board and the support member, and FIG.
The figure is a side view of the printed circuit board after soldering. In the figure, 1 is a printed circuit board, 2 is an electronic component, 2a
3 is a lead, 3 is a long hole, 4 is a support member, 4a1 is a locking piece, 5 is a solder bath, 6 is a carrier, and 7 is a wire rod.
Claims (1)
田付けする半田処理装置において、 プリント基板をその両側縁を支持して略水平状
態で移送するキヤリアと、 該キヤリアに支持されるプリント基板の下方で
所要間隔を置いた位置に上記キヤリアの走行方向
と同方向に架張される線材と、 上記プリント基板の所要位置に貫通係止されて
上記線材上に摺接され、上記プリント基板を水平
支持する支持部材とを有して成るプリント基板の
反り防止機構。[Scope of Claim for Utility Model Registration] A soldering device for soldering external leads of a mount component to a printed circuit board, comprising: a carrier that supports both edges of the printed circuit board and transports it in a substantially horizontal state; and a carrier supported by the carrier. A wire rod is stretched in the same direction as the running direction of the carrier at a position below the printed circuit board at a required interval, and a wire rod is inserted through the printed circuit board at a predetermined position and is in sliding contact with the wire rod. A printed circuit board warpage prevention mechanism comprising a support member that horizontally supports the board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12775286U JPS6334565U (en) | 1986-08-21 | 1986-08-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12775286U JPS6334565U (en) | 1986-08-21 | 1986-08-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6334565U true JPS6334565U (en) | 1988-03-05 |
Family
ID=31022805
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12775286U Pending JPS6334565U (en) | 1986-08-21 | 1986-08-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6334565U (en) |
-
1986
- 1986-08-21 JP JP12775286U patent/JPS6334565U/ja active Pending
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