JPS633198Y2 - - Google Patents

Description

[Detailed Description of the Invention] The present invention is an electronic device that uses a heating element such as a power transistor and a printed circuit board. The present invention also relates to an electronic device in which heat from a heating element is effectively radiated.

Mounting structures have been adopted for the heating elements and printed circuit boards of electronic devices that facilitate mutual wiring, adjustment, and servicing, but a satisfactory structure has not yet been achieved, and furthermore, the outer casing of electronic devices There is a problem that hot air from the heating element tends to get trapped inside.

The present invention was devised to correct the above-mentioned defects, and includes an inspection hole provided in the outer casing and a lid formed to cover the inspection hole and made of a material with good thermal conductivity. a butterfly plate whose lower side of the cover plate is rotatably attached to the outer casing below the inspection opening, and at least one of the upper side and side parts of the cover plate is attached to the outer case. a mounting means that is detachably attached to the housing; and a mounting means that is arranged substantially parallel to the inside of the lid plate;
A printed circuit board whose surface on the lid plate side is formed as a patterned surface and electronic components are mounted on a mount surface formed on the opposite side to the lid plate side, and a lower end of the printed circuit board is placed inside the lid plate. A hinge plate rotatably attached to the lower end of the side surface and a hinge plate attached to the periphery of the printed circuit board so as to partially overlap with each other, and when the cover plate is attached to the outer casing by the attachment means, the cover plate The electronic device includes a heat sink that is in contact with the printed circuit board in a thermally conductive manner, and a heating element that is mounted on the printed circuit board and in contact with a portion of the heat sink that overlaps with the printed circuit board in a thermally conductive manner.

With this configuration, it is possible to easily work on both the pattern surface and the mounting surface of the printed circuit board, and an electronic device with a high heat dissipation effect of the heating element can be obtained.

An embodiment in which the present invention is applied to a monitor television will be described below with reference to the drawings.

As shown in Figure 1, the outer casing 1 of the monitor TV
A rectangular inspection port 2 is provided in the back plate 1a of the machine, and this inspection port 2 is normally covered from the outside with a cover plate 3 as shown in FIGS. 2, 3A, and 4. . This cover plate 3 is formed of a good heat conductive material such as an aluminum plate, and a heating element 1 which will be described later.
7. It is designed to promote heat dissipation. The lower side of the cover plate 3 is connected to the back plate 1a via the butterfly plate 4, and when inspecting the electronic components inside the outer casing 1, the cover plate 3 is rotated to the outside of the inspection port 2 as shown in FIG. 3B. The inspection port 2 can be opened by moving it. Further, both sides 3a and the upper side 3b of the cover plate 3 are formed to protrude slightly on both sides and above the inspection port 2, and a screw hole 5 is provided therein. The back plate 1a is provided with screw holes 6 corresponding to the positions of the screw holes 5, so that the cover plate 3 can be fixed to the back plate 1a with screws 7, which are removable attachment means. A large number of ventilation holes 8 are provided in the lower part of the lid plate 3 to prevent hot air from getting trapped inside the outer casing 1.

At a position slightly above the butterfly plate 4 on the inner surface of the cover plate 3, there is a bendable hinge plate made of plastic or the like and having a substantially U-shape, as shown in FIGS. 3A to 3C. 9 is attached to one side of the cover plate 3 by a rivet 10 so as to be parallel to the lower side of the cover plate 3. Then, on the opposite side of the hinge plate 9, the lower end of a printed circuit board 11 formed to have the same size as the cover plate 3 is attached with a screw 12, and the printed circuit board 11 rotates around the hinge plate 9 as a fulcrum. It is free to move. The printed circuit board 11 is attached to the hinge plate 9 so that the pattern surface 11a faces the cover plate 3 and the mounting surface 11b (on which the electronic components 13 are attached) faces the inside of the outer casing 1. Further, the hinge plate 9 is almost U-shaped and has two bent parts, and when the printed circuit board 11 rotates toward the cover plate 3 side as shown in FIG. 3A, the hinge plate 9 closes. Even in the bent state, the pattern surface 11a of the printed circuit board 11 and the inner surface of the cover plate 3 are configured not to come into contact with each other.

Mounting surfaces 11b on both sides of the printed circuit board 11
As shown in FIGS. 1 and 4, heat dissipating plates 14 slightly protruding from both sides of the substrate 11 are attached to the top by rivets 15. This heat sink 1
The protruding portion of 4 is bent at a right angle toward the printed circuit board 11 side, and then bent at a right angle again toward the side of the printed circuit board 11 at a position appropriately spaced from this bent portion. As shown in FIGS. 3A and 4, when the lid plate 3 is closed, this sideward bent portion (hereinafter referred to as the heat transfer portion 14a) is connected to the side portion 3a of the lid plate 3 and the back plate 1a. The structure is such that a certain gap C is formed between the inner surface of the cover plate 3 and the pattern surface 11a of the printed circuit board 11. The heat transfer part 14a is provided with screw holes 16 corresponding to the positions of the screw holes 5 and 6, and the lid plate 3 and the heat sink 14 are connected to the back plate 1a with screws 7.
It is designed to be able to be tightened together. Further, like the cover plate 3, the heat dissipation plate 14 is made of, for example, an aluminum plate having good thermal conductivity.

A heating element 1 such as a power transistor is placed on the heat sink 14 at a portion overlapping with the printed circuit board 11.
7 is attached, the electrical connection part of the heating element 17 penetrates the heat sink 14 and the printed circuit board 11, protrudes onto the pattern surface 11a of the printed circuit board 11, and is soldered, and is connected to other electronic components 13 by printed wiring. ing.

Next, the adjustment and service status of the monitor television described above will be explained with reference to FIGS. 3A to 3C.

When adjustment or service of the monitor television is required, the screws 7 are removed and the cover plate 3 is rotated to the outside of the outer casing 1 as shown in FIG. 3B. At this time, since the center of gravity of the printed circuit board 11 is on the mounting surface 11b side to which the electronic components 13 are attached, and the position of the hinge plate 9 moves to the outside of the outer casing 1 as the cover plate 3 rotates, the printed circuit board 11 and the heat sink 14 rotate naturally and do not fall down. Therefore, immediately after opening the cover plate 3, the printed circuit board 11 and the heat sink 14 may inadvertently rotate out of the outer casing 1 and collide with the cover plate 3, damaging the electronic components 13 etc. on the board 11. There is no fear of it happening. In addition, the printed circuit board 11 has a heat sink 1
The upper end of the heat transfer portion 14a of No. 4 comes into contact with the back plate 1a and maintains a slightly inclined posture, so that the pattern surface 11
Convenient for checking a.

Next, when removing the electronic components 13 and heating element 17 of the printed circuit board 11 for replacement, remove the solder in the above state, and then rotate the printed circuit board 11 outward from the outer casing 1 as shown in FIG. 3C. mount surface 11
It is only necessary to turn b face up and remove the electronic component 13 and heating element 17. Also, when installing new electronic components or heating elements, the procedure is the reverse of the above. In this way, all the electrical connections between the electronic component 13 and the heating element 17 appear on the pattern surface 11a of the printed circuit board 11, so that services such as wiring and replacement can be performed extremely easily. At this time, the printed circuit board 11 rotates significantly toward the outside of the inspection port 2 using the hinge plate 9 that has moved outside the outer casing 1 as a fulcrum, so it is necessary to adjust or service the electronic components 13 or the heating element 17 of the printed circuit board 11. Not only can this be done extremely easily, but also other electronic components inside the outer casing 1 can be inspected easily because the inspection port 2 is wide open.

Next, the heat dissipation status of the heating element 17 is shown in Figures 3A and 4.
This will be explained with reference to the figures.

The heat dissipation plate 14 to which the heating element 17 is attached has its heat transfer portion 14a in contact with the side portion 3a of the cover plate 3, which has good thermal conductivity, as shown in FIG. As a result, the heat radiation area of the heat sink 14 is substantially increased, and the heating element 17 is effectively cooled. Further, the cover plate 3 covers the inspection port 2 and is completely exposed on the outside of the outer casing 1. Therefore, the cover plate 3 is in sufficient contact with the outside air, and sufficient heat is transferred to the outside air. At this time, since the gap C between the cover plate 3 and the printed circuit board 11 is partitioned on the side by the heat sink 14 and has a chimney shape, the warmed air in the gap C is absorbed by the chimney effect. It rises extremely smoothly. As a result, a large amount of relatively low-temperature air outside the outer casing 1 is sucked into the gap C through the ventilation hole 8. Therefore, the inner surface of the cover plate 3 and the pattern surface 11a of the printed circuit board 11 are effectively cooled, and these do not become overheated, and the temperature influence on the printed circuit board 11 by the heating element 17 is effectively prevented.

Although the embodiments of the present invention have been described above, the present invention is widely applicable not only to monitor televisions but also to other electronic devices.

Further, in the above embodiment, the printed circuit board 11
The heat sink 14 was attached to the printed circuit board 11 by connecting the cover plate 3 with the hinge plate 9. However, due to design conditions, the heat sink 14 and the cover plate 3 were connected with the hinge plate 9 and the heat sink 14 was attached to the printed circuit board 11. It may also be a structure in which the printed circuit board 11 is attached.

The electronic device of the present invention configured as described above has the following effects.

(a) When the inspection port is opened by removing the attachment means and rotating the cover plate toward the outside of the outer casing around the butterfly plate, the pattern surface of the printed circuit board is simultaneously opened.
Moreover, at this time, the center of gravity of the printed circuit board is on the mounting surface side where the electronic components are mounted, and the position of the hinge plate moves to the outside of the outer casing due to the rotation of the cover plate, so the printed circuit board The outer casing will not accidentally rotate and fall. Therefore,
Just by opening the cover plate, inspection, adjustment, and disassembly of the patterned surface of the printed circuit board can be performed quickly and easily. After this, simply rotate the printed circuit board around the hinge plate to the outside of the outer case and place it on the lid plate, and the mounting surface of the printed circuit board will be opened for inspection, adjustment, disassembly, etc. Work quickly and easily.

Therefore, operations such as inspection, adjustment, and disassembly of both the pattern surface and the mounting surface of the printed circuit board can be performed quickly and easily.

(b) When the cover plate is attached to the outer casing by the attachment means to cover the inspection area, the heat dissipation plate is in contact with the cover plate in a heat conductive manner, and the cover plate is made of a material with good thermal conductivity. That is, since it also serves as a heat radiating member, the heat radiating area of the heating element is very large, and the heat radiating effect of the heating element is very high. By using the cover plate as a heat dissipation member, space can be saved even though the heat dissipation area is very large.

(c) The heating element is mounted on the printed circuit board while being in contact with the heat sink for heat conduction.
The printed circuit board is less affected by heat from the heating element. Therefore, there is no need to mount the electronic components and the heating element, which are easily damaged by thermal effects, on separate printed circuit boards, and these electronic components and the heating element can be mounted together on the same printed circuit board. , it is possible to save space and at the same time improve the workability of soldering dips, etc.

[Brief explanation of the drawing]

The drawings show an embodiment in which the present invention is applied to a monitor television, in which FIG. 1 is a perspective view, FIG. 2 is a front view, and FIG. 3A is a cross-sectional view taken along the - line in FIG. Figures 3B and 3C are cross-sectional views of the monitor TV's adjustment and service status, and Figure 4 is the 2
It is a sectional view taken along the line - in the figure. In addition, in the symbols used in the drawings, 1...outer casing, 2...inspection port, 3...cover plate, 4...butter plate, 7
... screw, 9 ... hinge plate, 11 ... printed circuit board, 14 ... heat sink, 17 ... heat generating element.

Claims (1)

[Scope of claim for utility model registration] (a) An inspection port provided in the outer casing, (b) A cover plate provided to cover the inspection port and made of a material with good thermal conductivity, (c (d) a butterfly plate having a lower side of the cover plate rotatably attached to the outer casing below the inspection opening; (e) a mounting means that is detachably attached to the outer casing; (f) a hinge plate having the lower end of the printed circuit board rotatably attached to the lower end of the inner surface of the lid plate; (g) the printed circuit board; (h) a heat dissipation plate that is attached to the periphery of the heat dissipation plate so as to partially overlap with the cover plate, and that is in heat conductive contact with the cover plate when the cover plate is attached to the outer casing by the attachment means; (h) the heat dissipation plate; An electronic device comprising: a heating element mounted on the printed circuit board in a state in which it is in contact with a portion of the board overlapping with the printed circuit board in a heat conductive manner.